Patents by Inventor In Seok JANG

In Seok JANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220402070
    Abstract: Provided are a laser control structure and a laser bonding method using the same, and more particularly, a laser bonding method including: forming bonding portions on a substrate; providing a bonding object onto the bonding portions; providing a laser control structure onto the bonding object or the substrate; irradiating a laser toward the bonding object and the bonding portions; controlling quantity of laser light absorbed through the laser control structure; using the controlled quantity of laser light to heat the bonding portions and the bonding object to a bonding temperature; and bonding the bonding portions and the bonding object, wherein the laser control structure includes: a first substrate including a first region and a second region; a first thin film laminate on the first region; and a second thin film laminate on the second region, wherein: the first thin film laminate includes at least one first thin film layer and at least one second thin film layer, which are laminated on the first region; th
    Type: Application
    Filed: June 17, 2022
    Publication date: December 22, 2022
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Ki Seok JANG, Yong Sung EOM, GWANG-MUN CHOI, KWANG-SEONG CHOI, Jiho JOO, Seok-Hwan MOON, CHANMI LEE
  • Publication number: 20220378547
    Abstract: An endodontic file for dental nerve treatment according to the present invention comprises: a helical shaped blade that is to be inserted into a root canal, remove dental nerve, and enlarge the root canal; a head that is detachably inserted into a rotary power tool, and a connection part extending by a predetermined length between the head and the blade and having a diameter smaller than that of each of a contact end of the blade and the head. According to the endodontic file for dental nerve treatment, by forming the connection part of the endodontic file with an adjusted thickness or shape such as a thin thickness so that stress generated during rotation of the endodontic file is concentrated on the connection part rather than the blade, the endodontic file is induced to be fractured outside the tooth rather than inside the tooth root, thereby allowing fractured pieces to be easily found and removed.
    Type: Application
    Filed: August 25, 2020
    Publication date: December 1, 2022
    Inventor: Cheon Seok JANG
  • Publication number: 20220382117
    Abstract: Disclosed are an optical modulation device and a phase modulation method using the same. The optical modulation device includes a reflection plate, an insulating film over the reflection plate, dielectric patterns aligned on the insulating film in a first direction and extended in parallel in a second direction intersecting the first direction, and first and second graphene patterns provided between the dielectric patterns and alternately aligned in the first direction. The dielectric patterns and the first and second graphene patterns fully cover the top of the insulating film. Two dielectric patterns adjacent to each other in the first direction with one of the first graphene patterns interposed therebetween form one dielectric pattern pair. The dielectric pattern pair is provided in plural. The dielectric pattern pairs are isolated from each other in the first direction with one of the second graphene patterns interposed therebetween.
    Type: Application
    Filed: October 7, 2021
    Publication date: December 1, 2022
    Inventors: Min Seok JANG, Ju Young KIM, Juho PARK
  • Publication number: 20220384147
    Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes an index part having a load port, and a process executing part that receives a substrate from the index part and treats the substrate, the load port includes a housing having an interior space, a seating part disposed on an upper side of the housing, and on which a container that receives a substrate type sensor is positioned, and a charging unit that charges a power source device installed in the container in a wireless charging scheme.
    Type: Application
    Filed: May 18, 2022
    Publication date: December 1, 2022
    Applicant: SEMES CO., LTD.
    Inventors: Sang Hwan LEE, Yong Seok JANG
  • Publication number: 20220384674
    Abstract: Provided is a method for manufacturing an electronic device. The method for manufacturing the electronic device includes mapping good elements and defective elements on a substrate, providing a first transparent structure including a first adhesive layer on the substrate, selectively providing first laser light to the defective elements to cure the first adhesive layer on the defective elements and separate the defective elements from the substrate, providing a second transparent structure including a second adhesive layer, which adheres to new elements replaced for the defective elements, on the substrate, and selectively providing second laser light to the new elements to bond the new elements to the substrate.
    Type: Application
    Filed: May 31, 2022
    Publication date: December 1, 2022
    Inventors: Jiho JOO, Yong Sung EOM, Kwang-Seong CHOI, Chanmi LEE, Gwang-Mun CHOI, Ki Seok JANG, Seok-Hwan MOON, Ho-Gyeong YUN
  • Patent number: 11513066
    Abstract: An apparatus for estimating bio-information includes an optical sensor including a light source configured to emit light of multiple wavelengths onto an object, and including a plurality of detectors configured to detect light of each wavelength which is scattered or reflected from the object. The apparatus includes a processor configured to obtain spectra based on light of each wavelength which is detected by each detector, determine valid spectra of the obtained spectra, and estimate a bio-information value based on the valid spectra.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: November 29, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin Young Park, Sung Mo Ahn, Kun Sun Eom, Hyeong Seok Jang
  • Publication number: 20220361988
    Abstract: An implant abutment capable of stably adjusting vertical dimension of occlusion, the implant abutment comprising: an upper coupling portion that is an upper portion coupled to an artificial tooth; a lower coupling portion that is a lower portion coupled to a fixture; an exposed portion that is a portion exposed to the outside between the upper coupling portion and the lower coupling portion, and an adjustment groove that is formed on an outer circumferential surface of the upper coupling portion and inwardly recessed in the upper coupling portion. According to the implant abutment capable of stably adjusting vertical dimension of occlusion of the present invention, although the abutment has a low upper coupling portion, it can maintain stable coupling with the artificial tooth, thereby ultimately ensuring ease of adjusting a height of the abutment.
    Type: Application
    Filed: December 1, 2020
    Publication date: November 17, 2022
    Inventor: Cheon Seok JANG
  • Patent number: 11488841
    Abstract: Provided is a method for manufacturing a semiconductor package, the method including providing a semiconductor chip on a substrate, providing a bonding member between the substrate and the semiconductor chip, and bonding the semiconductor chip on the substrate by irradiating of a laser on the substrate. Here, the bonding member may include a thermosetting resin, a curing agent, and a laser absorbing agent.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: November 1, 2022
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Yong Sung Eom, Kwang-Seong Choi, Ki Seok Jang, Seok-Hwan Moon, Jiho Joo
  • Publication number: 20220338963
    Abstract: An implant abutment according to the present invention is a dental implant abutment with an enhanced shock distribution function, the dental implant abutment comprising: an upper coupling portion that is an upper portion coupled to an artificial tooth; a lower coupling portion that is a lower portion coupled to a fixture, and an exposed portion that is exposed to the outside between the upper coupling portion and the lower coupling portion and has a plurality of flow grooves. By forming a plurality of grooves in the exposed portion of the implant abutment, the exposed portion of the implant abutment performs a shock distribution function as if it shakes elastically and distributes an occlusal force of teeth exerted to the implant, thereby providing a buffering function of relieving an impact on an area where the implant is inserted.
    Type: Application
    Filed: October 21, 2020
    Publication date: October 27, 2022
    Inventor: Cheon Seok JANG
  • Patent number: 11482653
    Abstract: A light emitting diode apparatus is provided. The light emitting diode apparatus includes a wavelength conversion layer, a light emitting diode layer, a light transmission layer, and a sheath layer. The wavelength conversion layer has a first refractive index. The light emitting diode layer includes a base layer arranged on the wavelength conversion layer, and a light emitting structure layer arranged on the base layer. The light transmission layer is arranged on the wavelength conversion layer, surrounds a sidewall of the light emitting diode layer and contacts the sidewall of the light emitting diode layer, and has a second refractive index. The sheath layer is arranged to cover the light emitting diode layer and the light transmission layer, and has a third refractive index less than the second refractive index.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: October 25, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong Kuk Lee, Dae Young Lee, Moon Sub Kim, Sung Jin Ahn, Seung Hwan Lee, Dong Kyun Yim, Woo Seok Jang
  • Publication number: 20220280078
    Abstract: Provided is an apparatus for estimating a target component, the apparatus including a temperature controller configured to modulate temperature of an object, a measurer configured to measure a spectrum for each temperature of the object that changes based on the modulation, and a processor configured to obtain effective optical pathlength vectors corresponding to a temperature change based on the spectrum for each temperature of the object, obtain a representative effective optical pathlength based on the obtained effective optical pathlength vectors, and obtain a target component estimation model based on the obtained representative effective optical pathlength.
    Type: Application
    Filed: May 13, 2021
    Publication date: September 8, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyeong Seok JANG, Sung Hyun NAM, Sung Mo AHN, Jun Ho LEE, Ho Jun CHANG
  • Publication number: 20220263224
    Abstract: An antenna structure according to an embodiment of the present disclosure includes a dielectric layer, and an antenna conductive layer disposed on a top surface of the dielectric layer. The antenna conductive layer includes a radiator, first and second transmission lines extending in different directions to be connected to the radiator, an upper parasitic element adjacent to an upper portion of the radiator in a planar view, and a lower parasitic element adjacent to a lower portion of the radiator, the first transmission line and the second transmission line in the planar view.
    Type: Application
    Filed: February 16, 2022
    Publication date: August 18, 2022
    Inventors: Jong Min KIM, Dong Pil PARK, Won Hee LEE, In Seok JANG, Beak Jun SEONG, Jung Woo LEE, Seong Tae JEONG, In Kyung HONG, John Joonho PARK
  • Patent number: 11397666
    Abstract: The present disclosure may be directed to a system for generating and modifying data for modules. The system may include receiving, from a user via a proxy server, a request and user information associated with the user; based on the determination that the request comprises a test, calling a mobile application programming interface. The mobile application programming interface may be configured to perform steps including retrieving data; performing the test on the module using the retrieved data; performing a verification on responses from the test to predetermined responses; and sending results of the performed verification to the user. The system may include implementing the module based on the performed verification.
    Type: Grant
    Filed: November 11, 2020
    Date of Patent: July 26, 2022
    Assignee: Coupang Corp.
    Inventors: Jeong Hoon Lee, Yong Seok Jang
  • Patent number: 11389092
    Abstract: An apparatus for estimating bio-information according to an embodiment of the present disclosure includes a processor configured to obtain spectra from an object, obtain a component produced based on a change in pressure applied to the object, correct the spectra based on the obtained component produced based on the change in pressure, and estimate bio-information of the object based on the corrected spectra.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: July 19, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Mo Ahn, Hyeong Seok Jang, Sang Kyu Kim, Jin Young Park, Jun Ho Lee
  • Publication number: 20220199690
    Abstract: A display device is provided. A display device including a plurality of light-output areas through which incident light is emitted and a light-blocking area which blocks the incident light, the display device includes a substrate, a bank layer which is disposed in the light-blocking area on the substrate and defines a plurality of openings, each of which is disposed in one of the plurality of light-output areas, and a color control pattern disposed in the opening of the bank layer, wherein the bank layer includes a first bank area which has a first thickness and defines the plurality of openings and a second bank area which is disposed between the plurality of openings and has a second thickness smaller than the first thickness.
    Type: Application
    Filed: September 23, 2021
    Publication date: June 23, 2022
    Inventors: Seon Uk LEE, Hwa Yeul OH, Seung Kil YANG, Song Ee LEE, Yoo Seok JANG, Jeong Ki KIM, Jong Hoon KIM, Ju Yong KIM, Ji Seong YANG, Jun Hwi LIM, Sang Yeon Hwang
  • Patent number: 11363959
    Abstract: A bio-signal measuring apparatus includes an optical sensor including a photodetector and a light source array disposed around the photodetector, a first electrode disposed between the photodetector and the light source array, and a second electrode disposed on an outer periphery of the light source array. The bio-signal measuring apparatus further includes an impedance measurer configured to measure an impedance of an object, using the first electrode and the second electrode, and a processor configured to determine a contact state between the object and the optical sensor, based on the measured impedance.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: June 21, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyun Seok Moon, Seung Jun Lee, Jae Wook Shim, Hyeong Seok Jang
  • Publication number: 20220183763
    Abstract: An ultrasonic probe that acquires an ultrasonic image to diagnose or treat an object, and an ultrasonic imaging apparatus including the same, wherein the ultrasonic probe includes a case, a transducer disposed inside the case to generate ultrasonic waves, a biopsy needle inserted into an object in the vicinity of the case, and a sensor unit including a sensor provided to measure a position of the biopsy needle and disposed inside the transducer, wherein the transducer includes a piezoelectric layer configured to generate ultrasonic waves, a sound absorbing layer disposed on one side of the piezoelectric layer to absorb the ultrasonic waves generated from the piezoelectric layer, and a sound absorbing member disposed on one side of the sound absorbing layer, and the sensor unit is disposed inside the sound absorbing member.
    Type: Application
    Filed: November 20, 2019
    Publication date: June 16, 2022
    Applicant: SAMSUNG MEDISON CO., LTD.
    Inventors: Won-Soon Hwang, Min Seon Seo, Won Seok Jang
  • Publication number: 20220179000
    Abstract: The present disclosure provides a control device for charging and auto teaching of a wafer type sensor, a control program executed by the control device, a wafer type sensor storage device, a wafer type sensor charging device, and a semiconductor device manufacturing facility. The control program is a program executed by a control device equipped with a processor, and monitors a semiconductor device manufacturing facility and its part using a wafer type sensor, and monitors the remaining battery level of the wafer type sensor.
    Type: Application
    Filed: December 7, 2021
    Publication date: June 9, 2022
    Inventors: Yong Seok Jang, In Kyu Park
  • Publication number: 20220170734
    Abstract: Provided is a gap measuring method capable of accurately measuring a gap between adjacent members.
    Type: Application
    Filed: November 23, 2021
    Publication date: June 2, 2022
    Inventors: Chung Woo Lee, Sung Youn Jeon, In Kyu Park, Yong Seok Jang
  • Publication number: 20220160888
    Abstract: The presented invention relates to a CP2c-targeting peptide-based anticancer agent. A CP2c-targeting peptide according to the presented invention binds to transcription factor CP2c to inhibit the formation of transcription factor CP2c complexes (CP2c homotetramer and CP2c/CP2b/PIAS1 heterohexamer), thereby inducing cancer cell-specific cell death. A fatty acid is bound to the peptide to ensure stability enabling long-term sustenance in vivo.
    Type: Application
    Filed: April 1, 2020
    Publication date: May 26, 2022
    Applicants: Industry-University Cooperation Foundation Hanyang University, Konkuk University Glocal Industry-Academic Collaboration Foundation, Korea National University of Education Industry-Academy Cooperation Foundation
    Inventors: Chul Geun KIM, Min Young KIM, Chan Gil KIM, Seung Han SON, Ji Sook KIM, Sung Woo CHOI, Seol Eui LEE, Min Sung CHUNG, Dong Sun PARK, Sang Won LEE, Jae Min JEONG, Dong Ho CHOI, Ki Seok JANG