Patents by Inventor In Seong KIM

In Seong KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11926488
    Abstract: A fastening component supplying apparatus is disclosed. The disclosed fastening component supplying apparatus according to an exemplary embodiment of the present invention for supplying a plurality of bolts aligned by a bolt aligning device to a fastening portion of a fastening target part includes: a bolt picking unit rotatably installed to an arm front end of a handling robot and picking a plurality of bolts aligned in the bolt aligning device; and a bolt drop unit installed to an arm front end side of the handling robot and dropping the bolts picked by the bolt picking unit to the fastening portion.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: March 12, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Jongmin Park, Jung Pyo Kim, Jeong Seong An, Junhyeok Bae
  • Publication number: 20240078710
    Abstract: Disclosed herein are a method, an apparatus and a storage medium for encoding/decoding using a transform-based feature map. An optimal basis vector is extracted from one or more feature maps, and a transform coefficient is acquired through a transform using the basis vector. The basis vector and the transform coefficient may be transmitted through a bitstream. In an embodiment, one or more feature maps are reconstructed using the basis vector and the transform coefficient, which are decoded from the bitstream.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 7, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Youn-Hee KIM, Jooyoung LEE, Se-Yoon JEONG, Jin-Soo CHOI, Dong-Gyu SIM, Na-Seong KWON, Seung-Jin PARK, Min-Hun LEE, Han-Sol CHOI
  • Publication number: 20240076226
    Abstract: Provided is a glass substrate heat chamfering method. An edge of a glass substrate (100) is chamfered by applying thermal shock to the edge of the glass substrate (100), thereby peeling a strip (100a) off from the edge of the glass substrate (100). The strip is cut at a predetermined point thereon before being broken due to the weight thereof. The strip (100a) is cut by applying at least one of heat and a laser beam to the predetermined point or by applying a flame (300a) of a torch (300) to the predetermined point. The application of the thermal shock includes brining a heating element (210) into contact with the edge of the glass substrate (100). In the chamfering, the heating element (210) is relatively moved along the edge of the glass substrate (100) while being brought into contact with the edge of the glass substrate (100).
    Type: Application
    Filed: December 17, 2021
    Publication date: March 7, 2024
    Inventors: Dipakbin Qasem Chowdhury, EuiHo Kim, Euisoo Kim, Seong-ryong Ryoo
  • Patent number: 11923615
    Abstract: The present invention relates to a clamping apparatus for an antenna, the clamping apparatus including a rotation unit configured to rotate an antenna in a horizontal direction, a tilting unit configured to rotate the antenna in a vertical direction, and a rotation/vibration prevention unit configured to adjust a direction of the antenna by rotating at least one of the rotation unit and the tilting unit and prevent the antenna from arbitrarily rotating after the direction of the antenna is adjusted, in which the rotation/vibration prevention unit includes a rotation motor, a worm gear configured to be rotated by the rotation motor, a shaft configured to define at least one rotation center, and a worm wheel gear installed on an outer peripheral surface of the shaft and configured to rotate at least one of the rotation unit and the tilting unit while being rotated by the worm gear, thereby easily adjusting the direction of the antenna by controlling the rotation motor and preventing the antenna with the adjuste
    Type: Grant
    Filed: February 21, 2022
    Date of Patent: March 5, 2024
    Assignee: KMW INC.
    Inventors: In Ho Kim, Seong Man Kang
  • Patent number: 11922282
    Abstract: An inference system applies a machine-learning transformer model to a batch of requests with variable input length or variable target length or variable internal sate length by selectively batching a subset of operations in the transformer model but processing requests in the batch individually for a subset of operations in the transformer model. In one embodiment, the operation to be processed individually is an attention operation of an encoder or a decoder of the transformer model. By selective batching, the inference system can allow batching operations to be performed for a batch of requests with variable input or target length or internal state length to utilize the parallel computation capabilities of hardware accelerators while preventing unnecessary computations that occur for workarounds that restrain the data of a batch of requests to a same length.
    Type: Grant
    Filed: September 19, 2022
    Date of Patent: March 5, 2024
    Assignee: FRIENDLIAI INC.
    Inventors: Gyeongin Yu, Geon-Woo Kim, Joo Seong Jeong, Soojeong Kim, Byung-Gon Chun
  • Patent number: 11922624
    Abstract: An apparatus for providing brain lesion information based on an image includes a magnetic resonance angiography (MRA) provider configured to provide an environment capable of displaying 3D time-of-flight magnetic resonance angiography (3D TOF MRA) using user input, a brain lesion input unit configured to generate and manage a brain lesion image, a maximum intensity projection (MIP) converter configured to configure MIP image data including at least one image frame corresponding to a projection position of the brain lesion image, a noise remover configured to remove noise of brain lesion information and to configure corrected MIP image data, from which the noise is removed, and an MRA reconfiguration unit configured to reconfigure a corrected brain lesion image by back-projecting the corrected MIP image data.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: March 5, 2024
    Assignee: JLK INC.
    Inventors: Won Tae Kim, Shin Uk Kang, Myung Jae Lee, Dong Min Kim, Jin Seong Jang
  • Publication number: 20240070980
    Abstract: An automated method for generating a prosthesis from a 3D scan data, the method includes automatically extracting tooth information of a tooth included in the 3D scan data from the 3D scan data, automatically extracting a margin line of a prepared tooth, generating a plurality of two dimensional (ā€œ2Dā€) images including the prepared tooth and an adjacent tooth adjacent to the prepared tooth, automatically generating a 3D temporary prosthesis data based on the plurality of 2D images and deforming a single tooth model corresponding to the prepared tooth using the margin line and the 3D temporary prosthesis data to generate a 3D prosthesis data.
    Type: Application
    Filed: August 10, 2023
    Publication date: February 29, 2024
    Applicant: IMAGOWORKS INC.
    Inventors: Junseong AHN, So Jeong CHEON, Seong Jun TAK, Bonjour SHIN, Dong Uk KAM, Jung-Min HWANG, Jeonghwa KIM, Taeseok LEE, Jinhyeok CHOI
  • Publication number: 20240072238
    Abstract: A negative electrode includes a lithium-lanthanum alloy. The negative electrode can be applied to a negative electrode for a lithium-sulfur battery. The lithium-sulfur battery including the alloy negative electrode has improved life characteristics and improved electrochemical efficiency.
    Type: Application
    Filed: August 31, 2023
    Publication date: February 29, 2024
    Applicant: LG Energy Solution, Ltd.
    Inventors: Yun-Jung Kim, Ki-Hyun Kim, Myeong-Seong Kim, Do-Joong Lee
  • Publication number: 20240066707
    Abstract: An apparatus for automatically fastening a chemical coupler to a connector of an automatic clean quick coupler (ACQC) system, includes a main body, a multi-degree of freedom (DOF) robot arm on the main body, a gripper on the multi-DOF robot arm that is configured to grip the chemical coupler, a vision sensor on the multi-DOF robot arm, and a controller connected to the gripper, the multi-DOF robot arm, and the vision sensor. The controller uses information about an environment surrounding the multi-DOF robot arm acquired by the vision sensor, to control an operation of the multi-DOF robot arm and an operation of the gripper.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 29, 2024
    Applicants: SAMSUNG ELECTRONICS CO., LTD., Industry-Academic Cooperation Foundation of Kyungnam University
    Inventors: Shibaek PARK, Han Sung KIM, Jooha MAENG, Youngsuk PARK, Gi Seong KIM, Sung Hun JEONG
  • Publication number: 20240072249
    Abstract: A negative electrode includes a lithium-alkaline earth metal alloy, and can be used in a lithium-sulfur battery. Furthermore, a method to obtain said negative electrode, and a lithium-sulfur battery containing the negative electrode.
    Type: Application
    Filed: August 31, 2023
    Publication date: February 29, 2024
    Applicant: LG Energy Solution, Ltd.
    Inventors: Myeong-Seong Kim, Ki-Hyun Kim, Yun-Jung Kim, Do-Joong Lee
  • Patent number: 11911014
    Abstract: An articulating structure includes a joint unit including a front segment and a rear segment that are connected in series and perform relative rotation with respect to a rotation portion, and an elastic member interposed between the front segment and the rear segment, and a wire that passes through the front segment and the rear segment in a lengthwise direction of the joint unit, wherein the front segment rotates relative to the rear segment in one direction when the wire is pulled rearward, and the elastic member elastically deforms by a pressing force by the rotation of the front segment to provide a force that resists the pressing force.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: February 27, 2024
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Keri Kim, Seong Il Kwon, Jeongryul Kim
  • Publication number: 20240055767
    Abstract: An antenna substrate and an antenna module including the same are provided. The antenna substrate includes an antenna unit including first and second pattern layers adjacent to each other and disposed on different levels and a first insulating layer providing a first insulating region between the first and second pattern layers, and a feed unit including third and fourth pattern layers adjacent to each other and disposed on different levels and a second insulating layer providing a second insulating region between the third and fourth pattern layers. Each of the first and second pattern layers includes an antenna pattern, and each of the third and fourth pattern layers includes a feed pattern. The antenna unit is disposed on the feed unit. The first insulating region is thicker than the second insulating region.
    Type: Application
    Filed: October 24, 2023
    Publication date: February 15, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Moon Hee YI, Tae Seong KIM
  • Patent number: 11897327
    Abstract: The present invention relates to a transmission of an agricultural work vehicle, the transmission comprising: a pre-shift part for performing speed shifting on driving transmitted from an engine of an agricultural work vehicle; a clutch part connected to the pre-shift part so as to selectively output driving transmitted from the pre-shift part; an adjusting part connected to the clutch part so as to perform speed shifting on driving transmitted from the clutch part; and a subsequent shift part connected to the adjusting part so as to perform speed shifting on driving transmitted from the adjusting part.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: February 13, 2024
    Assignee: LS MTRON LTD.
    Inventors: Jung Su Han, Ki Taeg Lee, Won Woo Park, Ji Hun Yu, Taek Seong Kim, Young-Gyu Lee
  • Patent number: 11903129
    Abstract: A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chi Seong Kim, Won Seok Lee, Guh Hwan Lim, Jin Uk Lee, Jin Oh Park
  • Patent number: 11901348
    Abstract: A semiconductor package includes a mold substrate, at least one first semiconductor chip in the mold substrate and including chip pads, wiring bonding pads formed at a first surface of the mold substrate and connected to the chip pads by bonding wires, and a redistribution wiring layer covering the first surface of the mold substrate and including redistribution wirings connected to the wiring bonding wirings.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: February 13, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae-Ho Kang, Bo-Seong Kim
  • Publication number: 20240043654
    Abstract: A resin composition for a semiconductor package according to an embodiment includes a resin composition that is a composite of a resin and a filler disposed in the resin, wherein the filler includes at least one concave portion provided on a surface, wherein a content of the filler has a range of 10 vol. % to 40 vol % of a total volume of the resin composition, and wherein a porosity corresponds to a volume occupied by the concave portion in a total volume of the filler and has a range of 20% to 35%.
    Type: Application
    Filed: August 17, 2021
    Publication date: February 8, 2024
    Inventors: Byeong Kyun CHOI, Min Young HWANG, Moo Seong KIM, Jin Seok LEE
  • Patent number: 11894179
    Abstract: The present disclosure relates to a coil assembly including a bobbin including a winding part in which a passing hole is formed on an inner surface thereof and the coil is wound along an outer surface thereof, and an upper frame provided on an upper side of the winding part to limit an upper winding range of the coil, a lower case coupled to a lower side of the winding part and directly in contact with the coil to limit a lower winding range of the coil, and an upper case coupled to the lower case to surround an outer surface of the bobbin together with the lower case.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: February 6, 2024
    Assignee: HL MANDO CORPORATION
    Inventor: Min Seong Kim
  • Patent number: 11889703
    Abstract: A magnetic junction memory device is provided. The magnetic junction memory device including a sensing circuit including a sensing node, the sensing node being connected to a first end of a transistor and configured to change a voltage of the sensing node in accordance with a resistance of a magnetic junction memory cell, a gating voltage generator circuit configured to generate a gating voltage of the transistor using a reference resistor and a reference voltage, and a read circuit configured to read data from the magnetic junction memory cell using the reference voltage and the voltage of the sensing node.
    Type: Grant
    Filed: October 27, 2022
    Date of Patent: January 30, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chan Kyung Kim, Eun Ji Lee, Ji Yean Kim, Tae Seong Kim, Jae Wook Joo
  • Patent number: 11881430
    Abstract: A semiconductor device including a first interlayer insulating film; a conductive pattern in the first interlayer insulating film; a resistance pattern on the conductive pattern; an upper etching stopper film spaced apart from the resistance pattern, extending in parallel with a top surface of the resistance pattern, and including a first metal; a lower etching stopper film on the conductive pattern, extending in parallel with a top surface of the first interlayer insulating film, and including a second metal; and a second interlayer insulating film on the upper etching stopper film and the lower etching stopper film, wherein a distance from a top surface of the second interlayer insulating film to a top surface of the upper etching stopper film is smaller than a distance from the top surface of the second interlayer insulating film to a top surface of the lower etching stopper film.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: January 23, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Jin Kang, Jong Min Baek, Woo Kyung You, Kyu-Hee Han, Han Seong Kim, Jang Ho Lee, Sang Shin Jang
  • Publication number: 20240019255
    Abstract: The present disclosure relates to a method and apparatus for generating a travel route. The method according to an embodiment of the present disclosure may include obtaining first information related to first group points, calculating first estimated required times for moving between the first group points, based on the first information, and recording the first estimated required times in a first area of a weight matrix. In addition, the method may further include obtaining second information related to a second group point, calculating, based on the first information and the second information, second estimated required times including estimated required times for moving from the first group points to the second group point, and estimated required times for moving from the second group point to the first group points, and recording the second estimated required times in a second area of the weight matrix.
    Type: Application
    Filed: December 8, 2021
    Publication date: January 18, 2024
    Inventor: Ji Seong KIM