Patents by Inventor In Seop So
In Seop So has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9966806Abstract: The present invention provides an electricity generation device using a neodymium magnet having a helical structure that generates more electricity from the same torque during the same amount of time than common electricity generation devices using magnets, by helically arranging neodymium magnets, which has magnetic force significantly larger than common magnets, outside a unit coil, and that has improved performance of generating electricity by transmitting magnetic fields in vortexes to the unit coil. The electricity generation device using a neodymium magnet having a helical structure includes a first neodymium magnet, a second neodymium magnet, a third neodymium magnet, a first side magnet, a second magnet, a rod, and a unit coil. The electricity generation device using a neodymium magnet having a helical structure further includes a case, a first cover, a second cover, a cradle, a side gear, a first gear, and a handle.Type: GrantFiled: September 18, 2014Date of Patent: May 8, 2018Inventor: Mun Seop So
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Patent number: 9920105Abstract: A fusion polypeptide, including a first polypeptide fragment including 5 to 30 amino acids, the first polypetide fragment is fused between a first amino acid and a fifth amino acid of a fourth loop of a human-derived ferritin monomer.Type: GrantFiled: August 7, 2015Date of Patent: March 20, 2018Assignee: Kyungpook National University Industry-Academic Cooperation FoundationInventors: Eunsung Jun, Jaeog Jeon, Soyoun Kim, In-Seop So, In-San Kim, Sun-Ji Kim
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Publication number: 20160254708Abstract: The present invention provides an electricity generation device using a neodymium magnet having a helical structure that generates more electricity from the same torque during the same amount of time than common electricity generation devices using magnets, by helically arranging neodymium magnets, which has magnetic force significantly larger than common magnets, outside a unit coil, and that has improved performance of generating electricity by transmitting magnetic fields in vortexes to the unit coil. The electricity generation device using a neodymium magnet having a helical structure includes a first neodymium magnet, a second neodymium magnet, a third neodymium magnet, a first side magnet, a second magnet, a rod, and a unit coil. The electricity generation device using a neodymium magnet having a helical structure further includes a case, a first cover, a second cover, a cradle, a side gear, a first gear, and a handle.Type: ApplicationFiled: September 18, 2014Publication date: September 1, 2016Inventor: Mun Seop SO
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Publication number: 20160060307Abstract: A fusion polypeptide, including a first polypeptide fragment including 5 to 30 amino acids, the first polypetide fragment is fused between a first amino acid and a fifth amino acid of a fourth loop of a human-derived ferritin monomer.Type: ApplicationFiled: August 7, 2015Publication date: March 3, 2016Inventors: Eunsung JUN, Jaeog Jeon, Soyoun Kim, In-Seop So, In-San Kim, Sun-Ji Kim
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Patent number: 8975369Abstract: The present invention relates to a novel protein skeletal module which increases the binding affinity or binding specificity of active polypeptides. More particularly, the present invention relates to a protein skeletal module comprising polypeptides consisting of the 1st to 19th amino acids of the amino acid sequence expressed in sequence number 1; polypeptides comprising active polypeptides; and polypeptides consisting of the 29th to 86th amino acids of the amino acid sequence expressed in sequence number 1. The present invention also relates to a method for preparing the protein skeletal module. The protein skeletal module of the present invention increases the binding affinity or binding specificity of active polypeptides embedded therein, and therefore is effective in diagnosing and treating diseases.Type: GrantFiled: October 18, 2013Date of Patent: March 10, 2015Assignee: Kyungpook National Univrsity Industry-Academic Cooperation FoundationInventors: Kiweon Cha, In-Seop So, Soyoun Kim, Byung-Heon Lee, In San Kim
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Publication number: 20140079643Abstract: The present invention relates to a novel protein skeletal module which increases the binding affinity or binding specificity of active polypeptides. More particularly, the present invention relates to a protein skeletal module comprising polypeptides consisting of the 1st to 19th amino acids of the amino acid sequence expressed in sequence number 1; polypeptides comprising active polypeptides; and polypeptides consisting of the 29th to 86th amino acids of the amino acid sequence expressed in sequence number 1. The present invention also relates to a method for preparing the protein skeletal module. The protein skeletal module of the present invention increases the binding affinity or binding specificity of active polypeptides embedded therein, and therefore is effective in diagnosing and treating diseases.Type: ApplicationFiled: October 18, 2013Publication date: March 20, 2014Applicant: KYUNGPOOK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATIONInventors: Kiweon CHA, In-Seop So, Soyoun Kim, Byung-Heon Lee, In San Kim
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Patent number: 8373180Abstract: A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved.Type: GrantFiled: September 21, 2007Date of Patent: February 12, 2013Assignee: Seoul Semiconductor Co., Ltd.Inventors: Hwa Ja Kim, Nam Young Kim, Myung Hee Lee, Kyoung Bo Han, Tae Kwang Kim, Ji Seop So
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Patent number: 8129740Abstract: Disclosed is a side view LED package that can be more accurately mounted onto a surface of a substrate such as a printed circuit board without distortion includes a first portion of a body allowing light to be emitted in front thereof, the first portion having a horizontal plane formed on a top or bottom side thereof; and a second portion of the body positioned backward with respect to a back end boundary line of the first portion, the second portion being formed with an inclined plane that is adjacent to the horizontal plane and has height decreased from the back end boundary line, wherein the inclined plane is partially formed with an added thickness portion that is flush with the horizontal plane.Type: GrantFiled: March 26, 2009Date of Patent: March 6, 2012Assignee: Seoul Semiconductor Co., Ltd.Inventors: Jong Bum Choi, Myung Hee Lee, Won Il Kim, Ji Seop So
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Patent number: 7999280Abstract: Disclosed is a light emitting diode (LED) package employing a lead terminal with a reflecting surface. The package includes first and second lead terminals that are spaced apart from each other. The first lead terminal has a lower portion with an LED chip mounting area, and at least one reflecting surface formed by being bent from the lower portion. Meanwhile, a package body supports the first and second lead terminals and forms a cavity through which the LED chip mounting area and the reflecting surface of the first lead terminal and a part of the second lead terminal are exposed. The first and second lead terminals extend outside of the package body. Accordingly, light emitted from an LED chip can be reflected on the reflecting surface with high reflectivity, so that the optical efficiency of the package can be improved.Type: GrantFiled: July 19, 2007Date of Patent: August 16, 2011Assignee: Seoul Semiconductor Co., Ltd.Inventors: Hwa Ja Kim, Nam Young Kim, Myung Hee Lee, Kyoung Bo Han, Tae Kwang Kim, Ji Seop So
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Patent number: 7968081Abstract: A peptide for diagnosing, preventing and treating atherosclerosis, and a use thereof, comprising an amino acid sequence as set forth in SEQ ID NO: 1 or SEQ ID NO: 2, and a use thereof. The peptide effectively targets atherosclerotic plaques, and binds to IL-4R to thereby exhibit antagonistic effects on IL-4-mediated signaling of cellular inflammatory reaction and survival reaction. The peptide of the present invention can be used for diagnosis of atherosclerosis, prevention and treatment of IL-4-induced inflammatory reaction and prevention and treatment of atherosclerosis which is primarily caused by the inflammatory reaction, as well as for prevention or treatment of atherosclerosis via conjugation with an anti-atherosclerotic drug.Type: GrantFiled: January 18, 2008Date of Patent: June 28, 2011Assignee: Kyungpook National University Industry—Academic Cooperation FoundationInventors: Byung Heon Lee, In San Kim, Hai Yan Hong, In Seop So
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Publication number: 20100096653Abstract: A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved.Type: ApplicationFiled: September 21, 2007Publication date: April 22, 2010Applicant: Seoul Semiconductor Co. Ltd.Inventors: Hwa Ja Kim, Nam Young Kim, Myung Hee Lee, Kyoung Bo Han, Tae Kwang Kim, Ji Seop So
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Publication number: 20090242920Abstract: Disclosed is a side view LED package that can be more accurately mounted onto a surface of a substrate such as a printed circuit board without distortion includes a first portion of a body allowing light to be emitted in front thereof, the first portion having a horizontal plane formed on a top or bottom side thereof; and a second portion of the body positioned backward with respect to a back end boundary line of the first portion, the second portion being formed with an inclined plane that is adjacent to the horizontal plane and has height decreased from the back end boundary line, wherein the inclined plane is partially formed with an added thickness portion that is flush with the horizontal plane.Type: ApplicationFiled: March 26, 2009Publication date: October 1, 2009Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Jong Bum CHOI, Myung Hee Lee, Won Il Kim, Ji Seop So
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Publication number: 20090074663Abstract: A peptide for diagnosing, preventing and treating atherosclerosis, and a use thereof, comprising an amino acid sequence as set forth in SEQ ID NO: 1 or SEQ ID NO: 2, and a use thereof. The peptide effectively targets atherosclerotic plaques, and binds to IL-4R to thereby exhibit antagonistic effects on IL-4-mediated signaling of cellular inflammatory reaction and survival reaction. The peptide of the present invention can be used for diagnosis of atherosclerosis, prevention and treatment of IL-4-induced inflammatory reaction and prevention and treatment of atherosclerosis which is primarily caused by the inflammatory reaction, as well as for prevention or treatment of atherosclerosis via conjugation with an anti-atherosclerotic drug.Type: ApplicationFiled: January 18, 2008Publication date: March 19, 2009Inventors: Byung Heon Lee, In San Kim, Hai Yan Hong, In Seop So
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Patent number: 7473430Abstract: The inventive chimeric ligand in the form of a fusion polypeptide of a single-chain antibody specific for Tag-72 surface antigen and GaLV envelope glycoprotein shows high transduction efficiency to cancer cells, specifically infects target cells and efficiently delivers a therapeutic gene. Accordingly, the inventive chimeric ligand can be effectively used for gene therapy to inhibit tumor growth and metastasis.Type: GrantFiled: March 15, 2004Date of Patent: January 6, 2009Assignee: Inje UniversityInventors: Yeon-Soo Kim, In Seop So, Young-Kwan Lee, Jongpil Kim, Moonkyung Kang, Hyojeong Hong
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Publication number: 20080048201Abstract: Disclosed is a light emitting diode (LED) package employing a lead terminal with a reflecting surface. The package includes first and second lead terminals that are spaced apart from each other. The first lead terminal has a lower portion with an LED chip mounting area, and at least one reflecting surface formed by being bent from the lower portion. Meanwhile, a package body supports the first and second lead terminals and forms a cavity through which the LED chip mounting area and the reflecting surface of the first lead terminal and a part of the second lead terminal are exposed. The first and second lead terminals extend outside of the package body. Accordingly, light emitted from an LED chip can be reflected on the reflecting surface with high reflectivity, so that the optical efficiency of the package can be improved.Type: ApplicationFiled: July 19, 2007Publication date: February 28, 2008Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Hwa Ja KIM, Nam Young KIM, Myung Hee LEE, Kyoung Bo HAN, Tae Kwang KIM, Ji Seop SO
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Publication number: 20070244032Abstract: The inventive chimeric ligand in the form of a fusion polypeptide of a single-chain antibody specific for Tag-72 surface antigen and GaLV envelope glycoprotein shows high transduction efficiency to cancer cells, specifically infects target cells and efficiently delivers a therapeutic gene. Accordingly, the inventive chimeric ligand can be effectively used for gene therapy to inhibit tumor growth and metastasis.Type: ApplicationFiled: March 15, 2004Publication date: October 18, 2007Inventors: Yeon-Soo Kim, In Seop So, Young-Kwan Lee, Jongpil Kim, Moonkyung Kang, Hyojeong Hong
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Patent number: D605610Type: GrantFiled: November 24, 2008Date of Patent: December 8, 2009Assignee: Seoul Semiconductor Co., Ltd.Inventors: Jeong A. Han, Ji Seop So