Patents by Inventor In-Shieh Liu

In-Shieh Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DIE BONDING APPARATUS AND METHOD OF OPERATING THE SAME
    Publication number: 20070137773
    Abstract: A die bonding apparatus comprising a tape transfer device and a bonding device is provided. The tape transfer device includes a roller tape and a first roller axle. The roller tape comprises a plurality of glue layers and a first releasing film. Both surfaces of the glue layers are adhesive. The first releasing film covers one of the surfaces of the glue layers. The first roller axle is used for rolling up the first releasing film so as to rotate the roller tape. The bonding device is disposed at the front end of the tape transfer device. The bonding device includes at least a robotic arm and a controller. The controller controls the rotation and movement of the robotic arm.
    Type: Application
    Filed: December 16, 2005
    Publication date: June 21, 2007
    Inventors: Yung-Fong Chen, Cheng-Wen Ou, In-Shieh Liu