Patents by Inventor In-sik Chang

In-sik Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145527
    Abstract: A method for fabricating a semiconductor device includes: forming a mold structure including a mold layer and a supporter layer over a semiconductor substrate; forming an opening penetrating the mold structure; forming a protective layer on a bottom surface and a sidewall of the opening; forming a lower electrode over the protective layer; selectively etching the supporter layer to form a supporter that supports the lower electrode; removing the mold layer to define a non-exposed portion and an exposed portion of an outer wall of the protective layer; and selectively trimming the exposed portion of the protective layer to form a protective layer pattern between the supporter and the lower electrode.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Inventors: Jun Hyuk SEO, Myoung Sik CHANG
  • Publication number: 20240137821
    Abstract: Disclosed is a technique for switching from a master node to a secondary node in a communication system. A method of a first communication node may comprise: adding the first communication node as a primary secondary cell (PSCell) to a second communication node through dual connectivity (DC); generating a first user plane path for smart dynamic switching (SDS) and a first instance for supporting the first user plane path according to a request from the second communication node; transmitting information on the first user plane path and the first instance to a terminal; receiving user data based on the first user plane path from the terminal as the first instance; and transmitting the user data to a core network using the first user plane path.
    Type: Application
    Filed: October 22, 2023
    Publication date: April 25, 2024
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Soon Gi PARK, Young-Jo KO, IL GYU KIM, Jung Im KIM, Jun Sik KIM, Sung Cheol CHANG, Sun Mi JUN, Yong Seouk CHOI
  • Patent number: 11967783
    Abstract: A receptacle connector having a stable contact point structure and a rigid structure, and a connector assembly including the same, is provided. The receptacle connector includes a receptacle housing, a plurality of receptacle terminals which are retained and supported in the receptacle housing in a first direction, and one pair of receptacle metal members which are provided on both ends of the receptacle housing in the first direction.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: April 23, 2024
    Assignee: Molex, LLC
    Inventors: Sang Yong Ko, Jin Hyup Chang, Kwang Sik Kim
  • Patent number: 11964932
    Abstract: Provided are a tricyclodecane dimethanol composition, in which a ratio of structural isomers is controlled, and a preparation method thereof.
    Type: Grant
    Filed: May 20, 2022
    Date of Patent: April 23, 2024
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Hee Il Chae, Ju-Sik Kang, Jeong Ho Park, Song Lee, Yu Mi Chang
  • Patent number: 11961551
    Abstract: A bitline sense amplifier including: an amplifier which is connected between a first sensing bitline and a second sensing bitline, and detects and amplifies a voltage difference between a first bitline and a second bitline in response to a first control signal and a second control signal; and an equalizer which is connected between a first supply line through which the first control signal is supplied and a second supply line through which the second control signal is supplied, and pre-charges the first bitline and the second bitline with a precharge voltage in response to an equalizing control signal, wherein the equalizer includes an equalizing enable transistor in which a source terminal is connected to the first supply line and performs equalizing in response to the equalizing control signal.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Soo Bong Chang, Young-Il Lim, Bok-Yeon Won, Seok Jae Lee, Dong Geon Kim, Myeong Sik Ryu, In Seok Baek, Kyoung Min Kim, Sang Wook Park
  • Patent number: 11926127
    Abstract: Disclosed is a window film for a display device including a light transmitting substrate including a polyamide including a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, and a hard coating layer laminated on one surface of the light transmitting substrate: in Chemical Formula 1 and Chemical Formula 2, each of A1, A2, B, and D is the same as defined in the detailed description.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: March 12, 2024
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG SDI CO., LTD.
    Inventors: Chanjae Ahn, Sun Jin Song, Won Suk Chang, Boreum Jeong, A Ra Jo, Kyeong-Sik Ju, Sungwon Choi
  • Patent number: 11912915
    Abstract: The present invention relates to a phosphine precursor for the preparation of a quantum dot, and a quantum dot prepared therefrom. Using the phosphine precursor for the preparation of a quantum dot of the present invention, a quantum dot with improved luminous efficiency and higher luminous color purity can be provided.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: February 27, 2024
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Hee Il Chae, Jeong Ho Park, Kyung Sil Yoon, Ju-Sik Kang, Yu Mi Chang, Nam-Choul Yang, Jae Kyun Park, Song Lee
  • Patent number: 11901403
    Abstract: A method for fabricating a semiconductor device includes: forming a mold structure including a mold layer and a supporter layer over a semiconductor substrate; forming an opening penetrating the mold structure; forming a protective layer on a bottom surface and a sidewall of the opening; forming a lower electrode over the protective layer; selectively etching the supporter layer to form a supporter that supports the lower electrode; removing the mold layer to define a non-exposed portion and an exposed portion of an outer wall of the protective layer; and selectively trimming the exposed portion of the protective layer to form a protective layer pattern between the supporter and the lower electrode.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: February 13, 2024
    Assignee: SK hynix Inc.
    Inventors: Jun Hyuk Seo, Myoung Sik Chang
  • Publication number: 20230356652
    Abstract: A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.
    Type: Application
    Filed: April 27, 2023
    Publication date: November 9, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, BS TECHNICS CO., LTD., NIFCO KOREA INC., HYUNDAI MOBIS CO., LTD., ALPS ELECTRIC KOREA CO., LTD.
    Inventors: Jun Sik Kim, Jung Sik Choi, Young Do Kim, Tae Kyoung Jung, Seung-Sik Han, Hong-Sik Chang, Kwang-Pyo Cho, Young-Ju Lee, Jong-Hyun Park, Jin-Won Lee, Jun-Geun Oh, Cheon-Ho Kim, Young-Jai Im, Sun-Mi Oh, Kang-Sun Lee, Sae-Ah Kim, Jong-Eun Park, Kwan-Woo Lee, Jong-Chae Lee, Jun-Hyun Park, Won-Il Lee, Dae-Woo Park
  • Publication number: 20230084592
    Abstract: A slidable console box includes a rail frame fixedly coupled between a driver seat and a passenger seat of a vehicle, a rail unit slidably coupled to the rail frame along a length direction, and a movement controller coupled to the rail unit and configured to control a position of the rail unit.
    Type: Application
    Filed: September 15, 2022
    Publication date: March 16, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, KBI DONGKOOK IND. CO., LTD.
    Inventors: Dong Il Son, Dong Yong Choi, Chang Bok Park, Sun Kyung Kim, Jung-hoon Woo, Hong-sik Chang, Kwan-woo Lee, Jeong-won Seo
  • Publication number: 20220415028
    Abstract: A method for fabricating a semiconductor device includes: forming a mold structure including a mold layer and a supporter layer over a semiconductor substrate; forming an opening penetrating the mold structure; forming a protective layer on a bottom surface and a sidewall of the opening; forming a lower electrode over the protective layer; selectively etching the supporter layer to form a supporter that supports the lower electrode; removing the mold layer to define a non-exposed portion and an exposed portion of an outer wall of the protective layer; and selectively trimming the exposed portion of the protective layer to form a protective layer pattern between the supporter and the lower electrode.
    Type: Application
    Filed: August 30, 2022
    Publication date: December 29, 2022
    Inventors: Jun Hyuk SEO, Myoung Sik CHANG
  • Publication number: 20220346919
    Abstract: Disclosed is a method for providing a dental abutment by using data about a customized abutment, comprising the steps of: receiving oral data about a patient; and acquiring a standardized abutment from a standardized abutment group generated from the customized abutment in correspondence with the inputted oral data about the patient.
    Type: Application
    Filed: June 5, 2020
    Publication date: November 3, 2022
    Applicant: OSSTEMIMPLANT CO., LTD.
    Inventors: Young Seok LEE, Jae Chan HEO, Keun Sik CHANG, Tae Gwan EOM, Kyoo Ok CHOI
  • Patent number: 11456352
    Abstract: A method for fabricating a semiconductor device includes: forming a mold structure including a mold layer and a supporter layer over a semiconductor substrate; forming an opening penetrating the mold structure; forming a protective layer on a bottom surface and a sidewall of the opening; forming a lower electrode over the protective layer; selectively etching the supporter layer to form a supporter that supports the lower electrode; removing the mold layer to define a non-exposed portion and an exposed portion of an outer wall of the protective layer; and selectively trimming the exposed portion of the protective layer to form a protective layer pattern between the supporter and the lower electrode.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: September 27, 2022
    Assignee: SK hynix Inc.
    Inventors: Jun Hyuk Seo, Myoung Sik Chang
  • Patent number: 11434191
    Abstract: Disclosed is a method for preparing methyl methacrylate (MMA), the method including: (1) separating isobutene containing saturated hydrocarbon (n-butane and iso-butane), via a catalytic distillation process from a stream of C4 hydrocarbons containing butadiene, n-butene, and isobutene; (2) producing methacrolein via a first oxidation reaction of the separated isobutene; (3) producing methacrylic acid via a second oxidation reaction of the produced methacrolein; and (4) esterifying the produced methacrylic acid with methanol. By having a high heat capacity, the amount of nitrogen added is minimized to reduce the size of the reactor and the amount of gas production at a rear end, which has a high economic feasibility due to the effect of reducing investment and investment cost.
    Type: Grant
    Filed: October 21, 2020
    Date of Patent: September 6, 2022
    Assignee: Hanwha Total Petrochemical Co., Ltd.
    Inventors: Hyun Chul Choi, Ho Sik Chang, Jin Suk Lee, Yo Han Choi
  • Patent number: 11407106
    Abstract: An electronic device is provided. The electronic device includes at least one processor and a memory. The memory stores instructions that, when executed, cause the at least one processor to identify a task corresponding to a task execution instruction acquired by an input device of the electronic device, identify user information corresponding to the task, identify a target spot of the electronic device for executing the task, based on the task and the user information, with respect to a position of a user corresponding to the identified user information, and control a driving circuit of the electronic device to move the electronic device to the identified target spot.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: August 9, 2022
    Inventors: Jin-Won Kim, Jung-Gap Kuk, Seung-Beom Han, Dong-Sik Chang
  • Publication number: 20210408225
    Abstract: A method for fabricating a semiconductor device includes: forming a mold structure including a mold layer and a supporter layer over a semiconductor substrate; forming an opening penetrating the mold structure; forming a protective layer on a bottom surface and a sidewall of the opening; forming a lower electrode over the protective layer; selectively etching the supporter layer to form a supporter that supports the lower electrode; removing the mold layer to define a non-exposed portion and an exposed portion of an outer wall of the protective layer; and selectively trimming the exposed portion of the protective layer to form a protective layer pattern between the supporter and the lower electrode.
    Type: Application
    Filed: January 26, 2021
    Publication date: December 30, 2021
    Inventors: Jun Hyuk SEO, Myoung Sik CHANG
  • Publication number: 20210139407
    Abstract: Disclosed is a method for preparing methyl methacrylate (MMA), the method including: (1) separating isobutene containing saturated hydrocarbon (n-butane and iso-butane), via a catalytic distillation process from a stream of C4 hydrocarbons containing butadiene, n-butene, and isobutene; (2) producing methacrolein via a first oxidation reaction of the separated isobutene; (3) producing methacrylic acid via a second oxidation reaction of the produced methacrolein; and (4) esterifying the produced methacrylic acid with methanol. By having a high heat capacity, the amount of nitrogen added is minimized to reduce the size of the reactor and the amount of gas production at a rear end, which has a high economic feasibility due to the effect of reducing investment and investment cost.
    Type: Application
    Filed: October 21, 2020
    Publication date: May 13, 2021
    Inventors: Hyun Chul CHOI, Ho Sik CHANG, Jin Suk LEE
  • Patent number: 10700799
    Abstract: The method and apparatus for broadcast signal transmission are provided. A method of adjusting points of time when output packets are to be provided, performed by a stream generation device which provides an output stream, including the output packets, to a decoding device, according to an embodiment may include obtaining a first output packet and a second output packet; assigning a first multiplexing time to the first output packet and assigning a second multiplexing time different from the first multiplexing time to the second output packet; and providing the first output packet and the second output packet in the output stream to the decoding device by multiplexing the first output packet and the second output packet on the basis of the first multiplexing time and the second multiplexing time.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: June 30, 2020
    Assignee: DS BROADCAST, INC.
    Inventors: Hyun Sik Chang, Joo Yeon Hwang
  • Publication number: 20190207696
    Abstract: The method and apparatus for broadcast signal transmission are provided. A method of adjusting points of time when output packets are to be provided, performed by a stream generation device which provides an output stream, including the output packets, to a decoding device, according to an embodiment may include obtaining a first output packet and a second output packet; assigning a first multiplexing time to the first output packet and assigning a second multiplexing time different from the first multiplexing time to the second output packet; and providing the first output packet and the second output packet in the output stream to the decoding device by multiplexing the first output packet and the second output packet on the basis of the first multiplexing time and the second multiplexing time.
    Type: Application
    Filed: July 11, 2018
    Publication date: July 4, 2019
    Applicant: DS BROADCAST, INC.
    Inventors: Hyun Sik Chang, Joo Yeon Hwang
  • Patent number: 10332672
    Abstract: Provided is a heat radiation unit for radiating heat generated during operation of a wireless power transmitting or receiving device and includes a plurality of thermally conductive metal layers stacked in two or more layers and an adhesive layer for attaching the thermally conductive metal layers, to prevent lowering of the charging efficiency and improve the heat radiation performance.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: June 25, 2019
    Assignee: AMOGREENTECH CO., LTD.
    Inventors: Kil Jae Jang, Dong Hoon Lee, Seung Jae Hwang, Min Sik Chang, Hwi Chul Shin