Abstract: A packaged semiconductor device may include a substrate including at least one device layer and at least one connector arranged thereon, and a resin cover covering each side of the substrate, the resin cover on at least one side of the substrate including an opening exposing the connector and the resin cover on at least one other side of the substrate exposing a portion of the substrate.

Abstract: The present invention provides a bleach activator which is at least one macrocyclic manganese complex selected from the group consisting of [MnIII(rac-14-decane)X2]Y, [MnIII(mes-14-decane)X2]Y.H2O and [MnIII(mes-14-decane)X2]Y represented by Formulas 1-3, as well as a preparation method thereof. Also, the invention provides a bleaching composition and bleaching detergent composition comprising the bleach activator. The bleach activator comprising the manganese complex is used in a granulated form. wherein X is at least one selected from chlorine (—Cl) and acetate (—OOCCH3), and Y is an anion selected from Cl?, Br?, F?, NO3?, ClO4?, OH?, NCS?, N3?, and PF6?.

Abstract: A package substrate may include an insulating substrate, a circuit pattern and a mold gate pattern. The insulating pattern may have a mold gate region through which a molding member may pass. The circuit pattern may be formed on the insulating substrate. The mold gate pattern may be formed on the mold gate region of the insulating substrate. The mold gate pattern may include a polymer having relatively strong adhesion strength with respect to the insulating substrate and relatively weak adhesion strength with respect to the molding member. Thus, costs of the package substrate and the semiconductor package may be decreased.

Abstract: A packaged semiconductor device may include a substrate including at least one device layer and at least one connector arranged thereon, and a resin cover covering each side of the substrate, the resin cover on at least one side of the substrate including an opening exposing the connector and the resin cover on at least one other side of the substrate exposing a portion of the substrate.

Abstract: A herb medicine extract-containing non-bleeding striped dentifrice composition, consisting essentially of a striped dentifrice component and a base dentifrice component, each component comprising the following ingredients at the substantially same amount: a. an abrasive that has a BET surface area of 10 m.sup.2 /g or less and an average particle diameter of 1 to 30 .mu.m upon measurement by Coulter Counter method, and shows oil absorption (linseed oil, ml/100 g) of 50 or less; b. a binder selected from the group consisting of xanthan gum, carrageenan, sodium carboxymethylcellulose, and the mixtures thereof; c. an alkyl sulfonate of anionic surfactants; and d. a humectant, and said striped dentifrice component containing herb medicine extracts at an amount of 0.001 to 10% by weight, on the basis of dry solid substance. It is non-bleeding by virtue of the substantially same formulation in the two components and the herb medicine extracts allow the dentifrice composition to suppress the formation of plaque.

Abstract: A semiconductor device package is equipped with devices for preventing the formulation of air traps in its encapsulated package body. These devices include dummy block leads formed on the outermost inner lead of each row of inner leads, and extended portions formed on each tie bar. Each dummy block lead extends from the end of an outermost inner lead and is integrally formed therewith. The tie bar extended portions are separated into several parts defined by spaces between the parts, and the several parts are formed integral with each other and with the tie bar. The dummy block leads and the tie bar extended portions may be formed so as to be inclined relative to horizontal and with jagged edges at their side surfaces. The dummy block leads and tie bar extended portions serve to reduce the velocity of the potting resin which forms the encapsulate, as it enters the die cavity for encapsulation, but before the resin actually contacts the chip or the inner leads.

Abstract: A semiconductor device package includes a semiconductor chip and a plurality of inner leads, each having at least one slot formed along an upper surface of the inner lead. An adhesive layer is used to attach a bottom surface of the semiconductor chip to the upper surface of the inner lead. An encapsulant is allowed to flow in a package body mold, around the inner leads and through the slot. The slots prevent the production of turbulence along a side surface of the inner lead opposite to the flow direction, thereby avoiding problems associated with incomplete encapsulation such as the internal voids.

Abstract: An improved mold for forming a semiconductor package, having a molding compound injection gate having a height not greater than the thickness of the lead frame of the semiconductor assembly placed in the mold.

Abstract: A method of making the connection of a call in a private exchange to connect a call directly and promptly with a respective subscriber regardless of whether the called subscriber extension is absent from or present at the vicinity of an extension line (telephone), and for reducing the operating cost and increasing the efficiency of an extension line by coping with a loss of an existing call and a time consuming connection of a call, and utilizing a pager system. This disclosed method for connects a private exchange with a private pager system and connect a call according to a certain response after sending a radio paging to a respective pager corresponding to a specific number of extension the called subscriber.