Abstract: A method for making an antimicrobial composite film can include forming a first coating layer by applying a first coating material on a substrate and forming a second coating layer by applying a second coating material on the first coating layer. The first coating material can comprise a first resin. The second coating material can comprise an antimicrobial material in a second resin or a dispersion. The first coating material can have a lower concentration of the antimicrobial material than the second coating material. The first and second coating layers can cooperatively define a composite film. The antimicrobial material can be asymmetrically dispersed in the composite film such that the antimicrobial material is concentrated closer to the outer surface of the composite film than to the inner surface of the composite film.

Abstract: A washing machine includes a lower balancer assembled by a fastening member that connects a hub and tub base, thereby reducing manufacturing process and manufacturing cost. The fastening member passes through the tub base and the lower balancer and is coupled to the hub.

Abstract: A semiconductor chip package test socket may include a socket housing; a plurality of probe needles in the socket housing; a conductive pad on the probe needles; a floating guide configured to cover an edge of the conductive pad and configured to provide a semiconductor chip package on the conductive pad; and/or clamps fixed at the socket housing. The clamps may combine the floating guide with the socket housing.

Abstract: A semiconductor chip package test socket may include a socket housing; a plurality of probe needles in the socket housing; a conductive pad on the probe needles; a floating guide configured to cover an edge of the conductive pad and configured to provide a semiconductor chip package on the conductive pad; and/or clamps fixed at the socket housing. The clamps may combine the floating guide with the socket housing.

Abstract: A thermal detection device having hot and cold regions, first and second thermocouples disposed across the hot and cold regions each with terminals at the cold region, a thermal absorber disposed at the hot region and in thermal communication with the first and second thermocouples, and a base header having a support surface and a non-support surface. A portion of the support surface opposes a portion of the cold region, and a portion of the non-support surface opposes a portion of the hot region. The second thermocouple has a polarity opposite to the polarity of the first thermocouple.

Abstract: Thermopile detector and method for fabricating the same, the method including the steps of (1) forming a diaphragm film on a substrate, (2) forming thermocouples in a given region on the diaphragm film, (3) forming a protection film on the thermocouples, (4) forming photoresist on the protection film and removing the photoresist from a given region, (5) forming a black body on an entire surface including the photoresist and removing remained photoresist and the black body on the photoresist, and (6) removing a portion of the substrate from a given region of a back-side of the substrate, to expose the diaphragm film, thereby facilitating a compatibility of fabrication process with an existing semiconductor fabrication process (a CMOS fabrication process), whereby improving a mass production capability, preventing a damage to the diaphragm film occurred in formation of the black body, and controlling a property of the black body uniform.

Abstract: Thermopile detector and method for fabricating the same, the method including the steps of (1) forming a diaphragm film on a substrate, (2) forming thermocouples in a given region on the diaphragm film, (3) forming a protection film on the thermocouples, (4) forming photoresist on the protection film and removing the photoresist from a given region, (5) forming a black body on an entire surface including the photoresist and removing remained photoresist and the black body on the photoresist, and (6) removing a portion of the substrate from a given region of a back-side of the substrate, to expose the diaphragm film, thereby facilitating a compatibility of fabrication process with an existing semiconductor fabrication process(a CMOS fabrication process), whereby improving a mass production capability, preventing a damage to the diaphragm film occurred in formation of the black body, and controlling a property of the black body uniform.

Abstract: Thermopile detector and method for fabricating the same, the method including the steps of (1) forming a diaphragm film on a substrate, (2) forming thermocouples in a given region on the diaphragm film, (3) forming a protection film on the thermocouples, (4) forming a photoresist on the protection film and removing the photoresist from a given region, (5) forming a black body on an entire surface including the photoresist and removing the remaining photoresist and the black body on the photoresist, and (6) removing a portion of the substrate from a given region of a back-side of the substrate, to expose the diaphragm film, thereby facilitating a compatibility of fabrication process with an existing semiconductor fabrication process#(a CMOS fabrication process), whereby improving a mass production capability, preventing a damage to the diaphragm film occurred in formation of the black body, and controlling a property of the black body uniform.