Abstract: The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to the embodiment adjusts the surface roughness characteristics of the polishing pad after polishing, whereby the polishing rate can be enhanced, and the surface residues, surface scratches, and chatter marks of the wafer can be remarkably reduced.

Abstract: A semiconductor device may include a substrate, a pad on the substrate and connected to an interconnection pattern in the substrate, and a solder resist layer on the substrate, the solder resist layer having an opening exposing the pad. A top surface of the pad having a center region, and a peripheral region surrounding the center region. The center region of the top surface of the pad may be located at a level different from the peripheral region of the top surface of the pad, and a first width of the pad may be constant regardless of a distance from the substrate.

Abstract: A polishing composition and method for semiconductor processing being applicable to a semiconductor process including a process of polishing a semiconductor wafer including a through-silicon via (TSV), being capable of implementing excellent polishing performance, being capable of minimizing defects such as dishing, erosion, and protrusion, being capable of realizing an evenly polished surface without deviation between films when polishing a surface where a plurality of different films is exposed to the outside, including abrasive grains and at least one additive, and having a value of 1.45 to 1.90 as calculated by Equation 1.

Abstract: A slidable display device includes: a display panel; and a support member supporting the display panel. The support member includes a first portion maintaining a form and a second portion adjacent to the first portion and being transformable, the second portion includes a plurality of bars, and each of the plurality of bars includes an edge side including a first side, a second side connected to the first side and being inclined from the first side, a third side including two sides forming a step, a fourth side connecting between the two sides of the third side, a fifth side including two sides facing the third side and forming a step, and a sixth side connecting between the two sides of the fifth side.

Abstract: The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to the embodiment adjusts the surface roughness characteristics of the polishing pad after polishing, whereby the polishing rate can be enhanced, and the surface residues, surface scratches, and chatter marks of the wafer can be remarkably reduced.

Abstract: A user terminal device capable of attaching and detaching a pen is provided. The device includes a detector configured to detect a user manipulation regarding a screen, and a controller configured to change a layout of the screen to correspond to a pen use mode in response to the pen being removed from the user terminal device, perform a control operation corresponding to the detected user manipulation in response to the user manipulation using the pen being detected, and restore the layout of the screen to its original state in response to the pen being remounted on the user terminal apparatus.

Abstract: A semiconductor package may include a package substrate, a support structure on the package substrate and having a cavity therein, and at least one first semiconductor chip on the package substrate in the cavity. The support structure may have a first inner sidewall facing the cavity, a first top surface, and a first inclined surface connecting the first inner sidewall and the first top surface. The first inclined surface may be inclined with respect to a top surface of the at least one first semiconductor chip.

Abstract: The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to the embodiment adjusts the surface roughness characteristics of the polishing pad after polishing, whereby the polishing rate can be enhanced, and the surface residues, surface scratches, and chatter marks of the wafer can be remarkably reduced.

Abstract: The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to the embodiment adjusts the surface roughness characteristics of the polishing pad after polishing, whereby the polishing rate can be enhanced, and the surface residues, surface scratches, and chatter marks of the wafer can be remarkably reduced.

Abstract: An electronic device is disclosed. The electronic device may include a front display and a rear display, a touch panel to sense a user input, a camera disposed on a rear surface of the electronic device, and at least one processor. The at least one processor may output an image, which is obtained by the camera in a first shooting mode, to the rear display, output the image, which is obtained by the camera in a second shooting mode, to the front display, and control the camera in response to the user input sensed to the front display. Moreover, various embodiment found through the disclosure are possible.

Abstract: Disclosed are an electronic device and a method of controlling a displayed object by an electronic device. The electronic device includes a display, a communication unit, and a processor executing instructions to implement the method. The method includes when detecting communication with an external electronic device, displaying one or more windows corresponding to one more applications, displaying selection of a window of the one or more windows responsive to a first input received from the external electronic device, when a first window of the one or more windows is selected, displaying a first user interface for controlling a first application displayed within the first window and when a second input is received from the external electronic device while the first window remains selected, and displaying scrolling of displayed content of the first application within the first window, while maintaining the first user interface on the first window.

Abstract: A semiconductor package may include a package substrate, a support structure on the package substrate and having a cavity therein, and at least one first semiconductor chip on the package substrate in the cavity. The support structure may have a first inner sidewall facing the cavity, a first top surface, and a first inclined surface connecting the first inner sidewall and the first top surface. The first inclined surface may be inclined with respect to a top surface of the at least one first semiconductor chip.

Abstract: A user terminal device is provided. The user terminal device includes a display configured to display a map screen, a detector configured to sense a user manipulation, and a controller configured to, when a location and a direction are determined by the user manipulation on the map screen, display at least one photo image corresponding to the location and the direction of the user manipulation on the map screen.

Abstract: A user terminal device is provided. The user terminal device includes a display configured to display a map screen, a detector configured to sense a user manipulation, and a controller configured to, when a location and a direction are determined by the user manipulation on the map screen, display at least one photo image corresponding to the location and the direction of the user manipulation on the map screen.

Abstract: A mobile device, a method for displaying a screen thereof, a wearable device, a method for driving the same, and a computer-readable recording medium are provided. The mobile device operating with a wearable device includes a display configured to display a private screen which is personalized to a user after authentication of the wearable device based on at least one of a user state and an operational state of the mobile device and a controller configured to control the display to display the private screen after the authentication.

Abstract: Methods and apparatuses for transmitting data to an external device are provided. The method includes establishing a communication link with the external device by using a first application, and displaying a first window that corresponds to the first application, in response to an execution request for a second application that is different from the first application, displaying a second window that corresponds to the second application as a background of the first window, receiving a sharing mode request via the first window, and in response to the sharing mode request, setting an operation mode of the device as a sharing mode, and transmitting data that is provided from the second application to the external device via the communication link.

Abstract: A mobile device, a method for displaying a screen thereof, a wearable device, a method for driving the same, and a computer-readable recording medium are provided. The mobile device operating with a wearable device includes a display configured to display a private screen which is personalized to a user after authentication of the wearable device based on at least one of a user state and an operational state of the mobile device and a controller configured to control the display to display the private screen after the authentication.

Abstract: An electronic device is disclosed. The electronic device may include a front display and a rear display, a touch panel to sense a user input, a camera disposed on a rear surface of the electronic device, and at least one processor. The at least one processor may output an image, which is obtained by the camera in a first shooting mode, to the rear display, output the image, which is obtained by the camera in a second shooting mode, to the front display, and control the camera in response to the user input sensed to the front display. Moreover, various embodiment found through the disclosure are possible.

Abstract: A mobile device, a method for displaying a screen thereof, a wearable device, a method for driving the same, and a computer-readable recording medium are provided. The mobile device operating with a wearable device includes a display configured to display a private screen which is personalized to a user after authentication of the wearable device based on at least one of a user state and an operational state of the mobile device and a controller configured to control the display to display the private screen after the authentication.

Abstract: A semiconductor package includes a first semiconductor package including a first substrate and a lower semiconductor chip mounted on the first substrate, a second semiconductor package stacked on the first semiconductor package and including a second substrate and an upper semiconductor chip mounted on the second substrate, and an interposer substrate interposed between the first semiconductor package and the second semiconductor package and having a recess recessed from a lower surface facing the lower semiconductor chip, wherein the interposer substrate includes a dummy wiring layer disposed to be adjacent to the recess, in a region overlapped with the lower semiconductor chip, and no electrical signal is applied to the dummy wiring layer.