Abstract: A substrate cleaning line and a substrate cleaning system including the same are disclosed. The substrate cleaning line may include a chamber portion including a plurality of cleaning chambers to clean a substrate, and a first return robot to load, unload, or transfer the substrate from or to the plurality of cleaning chambers, wherein the cleaning chambers may be stacked on each other in a vertical direction.

Abstract: A semiconductor device includes a memory bank including a first memory block, a second memory block, and a redundancy memory block, and a column line selection circuit configured, when a fail occurs in a first column line of the first memory block, to replace the first column line of the first memory block with a first redundancy line of the redundancy memory block, and replace a second column line of the second memory block with a second redundancy line of the redundancy memory block.

Abstract: A wide viewing angle liquid crystal display includes color filters having a quantum dot and scattering particles and liquid crystal layer disposed in a microcavity, a distance between the color filter and the liquid crystal layer being sized to minimize display deterioration due to parallax.

Abstract: A display apparatus according to an embodiment of the disclosure includes a communicator configured to receive content from an external apparatus; a display; and a controller configured to determine whether tag information related to a component of the received content matches predetermined apparatus information, and determine whether to display the content based on the determined result.

Abstract: Disclosed herein is an electrochemical device forming a chip-capacitor or a super-capacitor. The electrochemical device includes: a ceramic substrate having a nonconductive ceramic layer, a current collecting layer disposed on a nonconductive ceramic layer and made of ceramic or cermet, and a metal layer arranged on outer surfaces of the nonconductive ceramic layer and the current collecting layer; an electrode having a positive electrode and a negative electrode and formed on the current collecting layer; and a nonconductive ceramic packaging module located on the ceramic substrate to accommodate electrolyte therein, wherein the metal layer is exposed to the outside of the nonconductive ceramic packaging module.

Abstract: A substrate polishing method for polishing a substrate through a polishing pad according to an embodiment may comprise: a preheating step of increasing the temperature of the polishing pad by supplying heated pure water to the polishing pad before polishing the substrate; and a temperature control step of controlling the temperature of the polishing pad by adjusting the temperature of the slurry supplied to the polishing pad in a polishing process of the substrate.

Abstract: The present invention relates to an electronic device and, more particularly, to an electronic device and a method for transmitting and receiving signals.

Abstract: A storage device includes a memory device and a controller. The memory device stores attribute information associated with a host memory buffer allocated on a host memory. The controller communicates with the host memory such that a plurality of pieces of data associated with operations of the memory device is buffered, based on the attribute information, in a plurality of host memory buffers allocated on the host memory. The controller communicates with the host memory such that first data corresponding to a first attribute group managed in the attribute information is buffered in a first host memory buffer among the plurality of host memory buffers and second data corresponding to a second attribute group different from the first attribute group is buffered in a second host memory buffer separate from the first host memory buffer.

Abstract: A substrate polishing system may include a substrate transfer unit comprising a shaft to rotate on a rotation axis perpendicular to a ground and at least one transfer arm to support a bottom surface of a substrate and transfer the substrate while forming a transfer orbit by rotation of the shaft, and at least one carrier to perform polishing the substrate transferred by the substrate transfer unit.

Abstract: A substrate polishing system may include a substrate transfer unit to support a bottom surface of a substrate and transfer the substrate while forming a transfer orbit in a circle by a rotational motion, at least one carrier to perform polishing on the substrate received from the substrate transfer unit, and a loader to load the substrate which is seated on the substrate transfer unit to the carrier or unload a substrate placed on the carrier to the substrate transfer unit.

Abstract: A substrate transferring system may include a first transfer unit to transfer a substrate along a circular first orbit while rotating on a first axis perpendicular to a ground, and a second transfer unit to transfer a substrate along a circular second orbit while rotating on a second axis perpendicular to the ground, wherein the first orbit and the second orbit may overlap with each other at a first point, and at the first point, a substrate may be transferred from the first transfer unit to the second transfer unit or from the second transfer unit to the first transfer unit.

Abstract: A substrate polishing apparatus according to an example embodiment may include a substrate carrier configured to grasp and move a substrate, a polishing pad configured to come into contact with a polishing target surface of the substrate and polish the polishing target surface of the substrate, and a spray unit including a spray member configured to spray a fluid toward the substrate carrier.

Abstract: A wide viewing angle liquid crystal display includes color filters having a quantum dot and scattering particles and liquid crystal layer disposed in a microcavity, a distance between the color filter and the liquid crystal layer being sized to minimize display deterioration due to parallax.

Abstract: The multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and first and second internal electrodes disposed inside the ceramic body, and disposed to oppose each other with the dielectric layer interposed therebetween. When an average thickness of the dielectric layer is referred to as td and a standard deviation of a thickness of the dielectric layer in each position is referred to as ?td, while an average thickness of the first and second internal electrodes is referred to as to and a standard deviation of a thickness of a pre-determined region of any layer of the internal electrodes in each position is referred to as ?te, a ratio (?te/?td) of the standard deviation of the internal electrodes in each position to the standard deviation of the thickness of the dielectric layer in each position satisfies 1.10??te/?td?1.35.

Abstract: The multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and first and second internal electrodes disposed inside the ceramic body, and disposed to oppose each other with the dielectric layer interposed therebetween. When an average thickness of the dielectric layer is referred to as td and a standard deviation of a thickness of the dielectric layer in each position is referred to as ?td, while an average thickness of the first and second internal electrodes is referred to as te and a standard deviation of a thickness of a pre-determined region of any layer of the internal electrodes in each position is referred to as ?te, a ratio (?te/?td) of the standard deviation of the internal electrodes in each position to the standard deviation of the thickness of the dielectric layer in each position satisfies 1.10??te/?td?1.35.

Abstract: The present invention relates to an electronic device and, more particularly, to an electronic device and a method for transmitting and receiving signals.

Abstract: The multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and first and second internal electrodes disposed inside the ceramic body, and disposed to oppose each other with the dielectric layer interposed therebetween. When an average thickness of the dielectric layer is referred to as td and a standard deviation of a thickness of the dielectric layer in each position is referred to as ?td, while an average thickness of the first and second internal electrodes is referred to as to and a standard deviation of a thickness of a pre-determined region of any layer of the internal electrodes in each position is referred to as ?te, a ratio (?te/?td) of the standard deviation of the internal electrodes in each position to the standard deviation of the thickness of the dielectric layer in each position satisfies 1.10??te/?td?1.35.

Abstract: A substrate processing system includes a front-end module, a first processing line including a first polishing line and a first cleaning line, a second processing line including a second polishing line and a second cleaning line and disposed in parallel to the first processing line, a first stage disposed between the first processing line and the second processing line, and a first retransfer robot configured to transfer a substrate from the front-end module to the first stage.

Abstract: A substrate processing system includes a front-end module, a first processing line including a first polishing line and a first cleaning line, a second processing line including a second polishing line and a second cleaning line and disposed in parallel to the first processing line, a first stage disposed between the first cleaning line and the second cleaning line, a first retransfer robot configured to transfer a substrate from the front-end module to the first stage, a second stage disposed between the first polishing line and the second polishing line, and a second retransfer robot configured to transfer the substrate between at least two locations of the first cleaning line, the second cleaning line, the first stage, and the second stage.