Patents by Inventor In-Soo Chung

In-Soo Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240178848
    Abstract: The present disclosure relates to a multi-chip clock synchronization device and a method capable of reducing an operating frequency and power consumption when a plurality of chips share clocks for multi-chip clock synchronization, which may include a reference clock supply unit connected to a plurality of chips and supplying a reference clock of a first frequency to each chip and a target clock generation unit generating a target clock of a second frequency based on the reference clock of the first frequency, wherein the reference clock supply unit may generate the reference clock of the first frequency which is N times lower than the second frequency of the target clock to supply the generated reference clock to each chip, and the target clock generation unit may multiply the first frequency of the reference clock by N times when the reference clock of the first frequency is input to generate the target clock of the second frequency.
    Type: Application
    Filed: November 24, 2023
    Publication date: May 30, 2024
    Applicant: LX SEMICON CO., LTD.
    Inventors: Jae Hwan LEE, Yoon Hoe KIM, Ji Hye KIM, Seung Chan JUNG, Hyun Soo CHUNG
  • Patent number: 11996563
    Abstract: Provided is a secondary battery which includes an electrode assembly having an electrode tab extended from an electrode current collector, wherein the electrode tab is provided with an insulation coating layer containing an inorganic filler and a binder, the binder has an electrolyte uptake more than 0% and less than 50%, and the electrolyte uptake is determined by a predetermined method. In the secondary battery according to the present disclosure, the insulation coating layer provided in the electrode tab includes a binder having a low electrolyte uptake, and thus the insulation coating layer has improved adhesion and is prevented from detachment from the electrode tab. As a result, it is possible to maintain an excellent insulation state and to minimize an internal short-circuit in a secondary battery, thereby ensuring safety.
    Type: Grant
    Filed: August 29, 2023
    Date of Patent: May 28, 2024
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Joo-Sung Lee, Myung-Soo Ko, Joo-Young Chung, Shin-Hyo Cho, Sun-Mi Jin
  • Patent number: 11986197
    Abstract: An autonomous endoscopic system capable of controlling movement of an endoscope inserted into a protective sheath installed in the body of a patient includes: an endoscope operating device capable of operating a relative position of the endoscope with respect to the protective sheath, a rolling angle of the endoscope, and a bending angle of a bending portion which is located at the end of the endoscope and is bendable; and a control unit for controlling the endoscope operating device, wherein the control unit controls the endoscope operating device on the basis of a driving record of the endoscope.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: May 21, 2024
    Assignees: ROEN Surgical, Inc., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Byung Sik Cheon, Dong Soo Kwon, Deok Gyoon Chung
  • Publication number: 20240161705
    Abstract: A light-emitting display device includes a display panel including a plurality of subpixels each including a light-emitting element, a data driver configured to supply a data voltage and a reset voltage to each of the subpixels, and a scan driver configured to output an emission signal for controlling a non-emission period and an emission period of the light-emitting element and a reset signal for controlling a reset period of each of the subpixels, wherein the scan driver outputs the emission signal a plurality of times in one frame period and outputs the reset signal a plurality of times in a non-emission period according to the emission signal, and at least one of a plurality of emission signals or a plurality of reset signals has at least one of a different delay period or a different pulse width.
    Type: Application
    Filed: June 16, 2023
    Publication date: May 16, 2024
    Inventors: Woo Kyu SANG, Moon Soo CHUNG, Tae Hun KIM
  • Patent number: 11981736
    Abstract: Antibodies that selectively bind to glycosylated PD-1 relative to unglycosylated PD-1 are provided. In some aspects, PD-1 polypeptides comprising glycosylated amino acid positions are also provided. Methods for making and using such antibodies and polypeptides (e.g., for the treatment of cancer) are also provided.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: May 14, 2024
    Assignees: ST CUBE INC., BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM
    Inventors: Stephen S. Yoo, Ezra M. Chung, Yong-Soo Kim, Seung-Oe Lim, Chia-Wei Li, Mien-Chie Hung
  • Patent number: 11985855
    Abstract: A light emitting display device including a first pixel including a first driving transistor, a first input transistor, a first initialization transistor, a first storage capacitor, and a first light emitting diode (LED); and a second pixel including a second driving transistor, a second input transistor, a second initialization transistor, a second storage capacitor, and a second light emitting diode (LED. The first pixel further includes a first gate electrode connecting member connecting a first gate electrode of the first driving transistor and the first input transistor; the second pixel further includes a second gate electrode connecting member connecting a second gate electrode of the second driving transistor and the second input transistor; the first light emitting diode (LED) includes a first anode; the second light emitting diode (LED) includes a second anode; and the first gate electrode connecting member does not overlap the second anode in a plan view.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: May 14, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Chang-Soo Lee, Bo Yong Chung, Tak-Young Lee
  • Patent number: 11975076
    Abstract: The present invention relates to antibody-drug conjugates (ADCs) wherein a plurality of active agents are conjugated to an antibody through at least one branched linker. The branched linker may comprise a branching unit, and two active agents are coupled to the branching unit through a secondary linker and the branching unit is coupled to the antibody by a primary linker. The active agents may be the same or different. In certain such embodiments, two or more such branched linkers are conjugated to the antibody, e.g., 2-4 branched linkers, which may each be coupled to a different C-terminal cysteine of a heavy or light chain of the antibody. The branched linker may comprise one active agent coupled to the branching unit by a first branch and a second branch that comprises a polyethylene glycol moiety coupled to the branching unit. In certain such embodiments, two or more such branched linkers are conjugated to the antibody, e.g.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: May 7, 2024
    Assignee: LegoChem Biosciences, Inc.
    Inventors: Yong Zu Kim, Yeong Soo Oh, Jeiwook Chae, Ho Young Song, Chul-Woong Chung, Yun Hee Park, Hyo Jung Choi, Kyung Eun Park, Hyoungrae Kim, Jinyeong Kim, Ji Young Min, Sung Min Kim, Byung Soo Lee, Dong Hyun Woo, Ji Eun Jung, Su In Lee
  • Publication number: 20240136331
    Abstract: A semiconductor package may include a circuit board, an interposer structure on the circuit board, a mold layer, and a first semiconductor chip and a second semiconductor chip spaced apart from each other in a first direction on a center region of the interposer structure and electrically connected to the interposer structure. The interposer structure may include a plurality of trenches in an edge region of the interposer structure and extending through the interposer structure. The mold layer may be in the plurality of trenches and may wrap the first and second semiconductor chips. The mold layer may include a penetrating portion in the plurality of trenches and a stack portion on the interposer structure. A bottom surface of the penetrating portion of the mold layer may be on a same plane as a bottom surface of the interposer structure.
    Type: Application
    Filed: October 8, 2023
    Publication date: April 25, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hyun Soo CHUNG, Young Lyong KIM
  • Publication number: 20240127748
    Abstract: A display device includes a scan driver to supply scan signals to first and second scan lines, a data driver to supply a data signal to data lines, a sensor connected to sensing lines, and pixels including a light-emitting element, a driving transistor to control an amount of current supplied to the light-emitting element in response to a voltage of a first node, a switching transistor between a j-th data line and the first node, and including a gate electrode coupled to an i-th first scan line, and a sensing transistor coupled between a second node, which is between the light-emitting element and the driving transistor, and a k-th sensing line, and including a gate electrode coupled to an i-th second scan line, and wherein the sensor is to sense deterioration information of the light-emitting element in a state in which the switching and sensing transistors are turned on.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 18, 2024
    Inventors: Hyuk KIM, Jong Hee KIM, Doo Young LEE, Chang Soo LEE, Sang Uk LIM, Bo Yong CHUNG
  • Patent number: 11955464
    Abstract: A semiconductor package including a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip, and a third semiconductor chip disposed on the second semiconductor chip. A first pad is disposed on a top surface of the second semiconductor chip, and includes a first portion and a second portion protruding in a vertical direction from the first portion. A width of the first portion in a first horizontal direction is greater than a width of the second portion in the first horizontal direction. A second pad is disposed on a bottom surface of the third semiconductor chip facing the top surface of the second semiconductor chip, and a solder ball is disposed as surrounding a sidewall of the second portion of the first pad between the first pad and the second pad.
    Type: Grant
    Filed: January 4, 2023
    Date of Patent: April 9, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Myung Kee Chung, Hyun Soo Chung, Tae Won Yoo
  • Publication number: 20240109419
    Abstract: The present disclosure relates to a DC-DC converter, a vehicle, and a control method including the same, and more particularly, to a DC-DC converter, a vehicle, and a control method including the same capable of effectively detecting and responding to an interlock failure of a connector.
    Type: Application
    Filed: May 9, 2023
    Publication date: April 4, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Jae Hun JEONG, Mun Soo CHUNG, Kyu Won JEONG, Tae Woo KIM, Jong Dae KIM, Beom Sik KIM, Sang Don LEE
  • Patent number: 11945744
    Abstract: Disclosed are a method and apparatus for reusing wastewater. The method for reusing wastewater disclosed herein includes: generating a mixed wastewater by mixing multiple types of wastewater (S20); performing a first purification by passing the mixed wastewater through a flocculation-sedimentation unit (S40); performing a second purification by passing an effluent of the flocculation-sedimentation unit through a membrane bioreactor (MBR) (S60); performing a third purification by passing an effluent of the MBR through a reverse-osmosis membrane unit (S80); and reusing an effluent of the reverse-osmosis membrane unit as cooling water or industrial water (S100).
    Type: Grant
    Filed: April 14, 2023
    Date of Patent: April 2, 2024
    Assignees: SAMSUNG ENGINEERING CO., LTD., SAMSUNG ELECTRONICS CO., LTD
    Inventors: Seok Hwan Hong, Dae Soo Park, Seung Joon Chung, Yong Xun Jin, Jae Hyung Park, Jae Hoon Choi, Jae Dong Hwang, Jong Keun Yi, Su Hyoung Cho, Kyu Won Hwang, June Yurl Hur, Je Hun Kim, Ji Won Chun
  • Publication number: 20240092187
    Abstract: A direct current to direct current (DC-DC) converter, a vehicle including the converter, and a controlling method thereof are proposed. The DC-DC converter is capable of efficiently detecting and responding to miscoupling of a connector. The DC-DC converter includes a first inlet corresponding to a first DC terminal, a transformation circuit connected to the first DC terminal and a second DC terminal while being located therebetween, and a converter controller, wherein when receiving a voltage command corresponding to the first DC terminal from an external controller, the converter controller is configured to determine whether or not a connector coupled to the first inlet is miscoupled thereto based on whether or not a voltage of the first DC terminal follows the voltage command.
    Type: Application
    Filed: July 10, 2023
    Publication date: March 21, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Kyu Won Jeong, Mun Soo Chung, Jae Hun Jeong, Beom Sik Kim, Tae Woo Kim
  • Publication number: 20240092224
    Abstract: A method for controlling a vehicle includes determining the number of driving legs according to an output current target value of a DC-DC converter; selecting one or more legs to be switched as many as the number of the driving legs from among a plurality of legs included in the DC-DC converter based on accumulated operation time for each of the plurality of legs; and controlling an output current value of the DC-DC converter to follow the output current target value by switching the selected one or more legs.
    Type: Application
    Filed: March 6, 2023
    Publication date: March 21, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Jae Hun JEONG, Kyu Won JEONG, Beom Sik KIM, Mun Soo CHUNG
  • Publication number: 20240096820
    Abstract: A method for manufacturing a semiconductor package includes mounting semiconductor chips on an interposer, forming a molding part between the semiconductor chips, surrounding a plurality of bumps between the semiconductor chips and the interposer with a first underfill, forming a sacrificial layer that covers the semiconductor chips, forming a wafer level molding layer that covers the sacrificial layer, performing a planarization process to expose upper sides of the semiconductor chips, form the sacrificial layer into a sacrificial pattern, and form the wafer level molding layer into a wafer level molding pattern, removing the sacrificial pattern, performing a sawing process to remove an outer edge of the semiconductor package, mounting the interposer on a side of a package board, surrounding a plurality of bumps between the package board and the interposer with a second underfill, and attaching a stiffener to an outer portion of the package board.
    Type: Application
    Filed: June 13, 2023
    Publication date: March 21, 2024
    Inventors: Young Lyong KIM, Hyun Soo CHUNG, In Hyo HWANG
  • Publication number: 20240097566
    Abstract: A DC-DC converter, a vehicle including the converter, and a controlling method thereof are provided. The DC-DC converter includes a first capacitor connected to a first DC terminal, a second capacitor connected to a second DC terminal, a plurality of converting circuits each including at least an inductor and a plurality of switching elements, and connected to each other in parallel between the first capacitor and the second capacitor, and a controller configured to control an ON/OFF state of the plurality of switching elements provided of each of the converting circuits. When external power connection with respect to each of the first DC terminal and the second DC terminal is disconnected, the controller is configured to control states of the plurality of switching elements to sequentially provide a plurality of different discharge paths between opposite terminals of the second capacitor via the plurality of converting circuits.
    Type: Application
    Filed: July 3, 2023
    Publication date: March 21, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Beom Sik KIM, Kyu Won JEONG, Tae Woo KIM, Jae Hun JEONG, Mun Soo CHUNG, Sang Don LEE
  • Publication number: 20240097168
    Abstract: A vehicle is provided that includes a DC converter having a first end connected to a fuel cell, a second end connected to a high-voltage battery, and at least one switching element connected between the first end and the second end, a fuel cell control unit which controls an activation state of a running command for start of the fuel cell based on an on-off state of vehicle start, and a converter controller which controls a running state of the DC converter according to an initial start sequence, a shutdown sequence, or a restart sequence for the fuel cell based on the activation state of the running command.
    Type: Application
    Filed: March 8, 2023
    Publication date: March 21, 2024
    Inventors: Beom Sik KIM, Kyu Won JEONG, Tae Woo KIM, Jae Hun JEONG, Mun Soo CHUNG, Sang Don LEE
  • Patent number: 11935482
    Abstract: A pixel circuit includes a first switch element turned on by a gate-on voltage of a first scan pulse to apply a data voltage to a first node; a second switch element turned on by a gate-on voltage of a second scan pulse to connect a second node to a third node; a third switch element turned on by a gate-on voltage of a light-emitting control pulse to apply a reference voltage to the first node; a fourth switch element turned on by the gate-on voltage of the light-emitting control pulse to connect the third node to a fourth node; and a fifth switch element turned on by a gate-on voltage of the second scan pulse to apply the reference voltage to the fourth node. A voltage higher than or equal to the pixel driving voltage is applied to the third node before generation of the first scan pulse.
    Type: Grant
    Filed: September 27, 2022
    Date of Patent: March 19, 2024
    Assignee: LG Display Co., Ltd.
    Inventors: Woo Kyu Sang, Moon Soo Chung
  • Patent number: 11933786
    Abstract: Antibodies that selectively bind to glycosylated PD-1 relative to unglycosylated PD-1 are provided. In some aspects, PD-1 polypeptides comprising glycosylated amino acid positions are also provided. Methods for making and using such antibodies and polypeptides (e.g., for the treatment of cancer) are also provided.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: March 19, 2024
    Assignees: STCUBE, INC., BOARD OF REGENTS, THE UNIVERSITY OF TEXAS
    Inventors: Stephen S. Yoo, Ezra M. Chung, Yong-Soo Kim, Mien-Chie Hung, Chia-Wei Li, Seung-Oe Lim
  • Publication number: 20240088784
    Abstract: A DC-DC converter may include a first capacitor connected to a first DC end, a second capacitor connected to a second DC end, a power conversion circuit connected between the first capacitor and the second capacitor and including at least one switching element, and a controller determining, when the second capacitor is charged as the battery is connected to the second DC end, whether the at least one switching element has failed based on a first voltage that is a voltage between opposite ends of the first capacitor and a second voltage that is a voltage between opposite ends of the second capacitor.
    Type: Application
    Filed: March 10, 2023
    Publication date: March 14, 2024
    Inventors: Jae Hun Jeong, Kyu Won Jeong, Beom Sik Kim, Mun Soo Chung