Abstract: Disclosed herein is a camera module for mobile communication terminals. The module comprises an image capture device unit for focusing an image of a subject, a LED (light emitting diode) unit for emitting light to the subject, a FPC (flexible printed circuit) electrically connected between the image capture device unit and the LED unit, and a connector unit for applying an electric signal to the image capture device unit.

Abstract: Disclosed is a method for packaging a pickup device, which is used for a digital optical instrument, and particularly a method for fabricating an image sensor module connected to a flexible PCB. The method according to the invention includes the steps of forming a printed circuit of a predetermined pattern on an upper surface of a transparent medium, forming a first bump and a second bump on the upper surface of the transparent medium, first bonding the first bump with a pattern of an image chip so as to be electrically connected to each other, secondly bonding the second bump with a circuit of a flexible PCB so as to be electrically connected to each other, and molding a rear surface of the flexible PCB, on which an image chip is mounted, by means of epoxy resin. The method according to the invention provides an effect of reducing weight, thickness, length and size of the module in comparison with the module fabricated under the conventional wire bonding method.

Abstract: Disclosed herein is a camera module for mobile communication terminals. The module comprises an image capture device unit for focusing an image of a subject, a LED (light emitting diode) unit for emitting light to the subject, a FPC (flexible printed circuit) electrically connected between the image capture device unit and the LED unit, and a connector unit for applying an electric signal to the image capture device unit.

Abstract: Disclosed herein is an embedded type camera module. The embedded type camera module includes a transparent plate, an image sensor chip, a digital signal processing chip, and one or more peripheral chips. A circuit pattern is formed on one surface of the transparent plate which is connected with a connector. The image sensor chip is electrically connected to the circuit pattern and constructed to receive image signals inputted from the outside. The digital signal processing chip converts signals received from the image sensor chip into digital signals. The peripheral chips are mounted a printed circuit board formed in a product to be disposed in conjunction with the image sensor chip and the digital signal processing chip. The transparent plate, the image sensor chip, the digital signal processing chip and the peripheral chips are packaged together.

Abstract: The present invention relates to a mobile phone, comprising: a camera module including a camera for taking pictures and an interface unit; a main body having a processor for driving the camera module; and a battery that is detachably connected to one side of the main body. Using the battery mounted with the camera module, users are now able to use the camera any time regardless of the folder being opened or not. The mobile phone of the present invention lightens economical burden of both the users and the mobile phone producers in that the users can selectively purchase the camera only and the mobile phone producers can continue to produce a single model mobile phone with no obligation of attaching the camera to the mobile phone.

Abstract: Disclosed is a method for packaging a pickup device, which is used for a digital optical instrument, and particularly a method for fabricating an image sensor module connected to a flexible PCB. The method according to the invention includes the steps of forming a printed circuit of a predetermined pattern on an upper surface of a transparent medium, forming a first bump and a second bump on the upper surface of the transparent medium, first bonding the first bump with a pattern of an image chip so as to be electrically connected to each other, secondly bonding the second bump with a circuit of a flexible PCB so as to be electrically connected to each other, and molding a rear surface of the flexible PCB, on which an image chip is mounted, by means of epoxy resin. The method according to the invention provides an effect of reducing weight, thickness, length and size of the module in comparison with the module fabricated under the conventional wire bonding method.