Abstract: A junction structure element, a method of manufacturing the same, and an in-memory computing device including the same are disclosed. The junction structure element may include: a first polarization layer containing a material having a ferroelectric characteristic of being polarized only horizontally; a second polarization layer disposed on the first polarization layer and containing a material having a ferroelectric characteristic of being polarized only vertically; a source electrode and a drain electrode each in contact with the first polarization layer and spaced apart from each other; and a gate electrode disposed on the second polarization layer.

Abstract: This disclosure relates to a connector comprising a first RF contact; a second RF contact spaced apart from the first RF contact in a first axis direction; an insulation part; and a cover shell, wherein the first RF contact includes a (1-1)th RF linker member for connecting with an RF contact of the other connector; a (1-2)th RF linker member spaced apart from the (1-1)th RF linker member on the basis of a second axis direction perpendicular to the first; and a first RF linker member arranged between the (1-1)th RF linker member and the (1-2)th RF linker member on the basis of the second axis direction, the insulation part includes a first RF inspection window arranged between the (1-1)th RF linker member and the (1-2)th RF linker member on the basis of the second axis direction, and the first RF linker member is exposed through the first RF inspection window.

Abstract: The present invention relates to a connector comprising: a first radio frequency (RF) contact for RF signal transmission; a second RF contact which is spaced apart from the first RF contact in a first axial direction; an insulation part to which the first RF contact and the second RF contact are coupled; a cover shell to which the insulation part is coupled; a first coaxial cable which is electrically connected to the first RF contact; a second coaxial cable which is spaced apart from the first coaxial cable in the first axial direction and electrically connected to the second RF contact; and a partition wall part which is coupled to the cover shell such that, with respect to the first axial direction, the first RF contact and the first coaxial cable are disposed on one side and the second RF contact and the second coaxial cable are disposed on the other side.

Abstract: A semiconductor memory device includes; a first stacked structure including a first staircase portion, a second stacked structure on the first stacked structure and including a second staircase portion overlapping the first staircase portion, a first contact plug penetrating the first stacked structure and the second stacked structure, electrically connected to the first stacked structure and not electrically connected to the second stacked structure, and a second contact plug penetrating the first stacked structure and the second stacked structure, electrically connected to the second stacked structure and not electrically connected to the first stacked structure.

Abstract: The present invention relates to a multi-component host material and an organic electroluminescent device comprising the same. By comprising a specific combination of the multi-component host compounds, the organic electroluminescent device according to the present invention can provide high luminous efficiency and excellent lifespan characteristics.

Abstract: The present invention relates to a fusion protein comprising a SARS-CoV-2-derived receptor-binding domain and a nucleocapsid protein, and the use thereof. The fusion protein comprising a coronavirus-derived receptor-binding domain and a nucleocapsid protein is highly applicable to a multivalent vaccine composition having greatly improved in-vivo half-life and remarkably superior efficacy compared to an immunogenic composition comprising only a receptor-binding domain. In particular, the fusion protein can greatly improve the titer of the coronavirus-specific antibody formation and T-cell immune response, and is thus useful for the prevention and treatment of coronaviruses comprising SARS-CoV-2.

Abstract: The present disclosure relates to a method for providing cancer diagnosis information using a thermal analysis method and a portable cancer diagnosis device using a thermal analysis method. The method for providing cancer diagnosis information using a thermal analysis method according to the present disclosure is capable of diagnosing the type, progression, metastasis, etc. of cancer using the thermochemical reaction onset temperature, calorie change, etc. obtained by analyzing the heat flux to and from a biological sample. In addition, the portable cancer diagnosis device using a thermal analysis method of the present disclosure is capable of diagnosing the presence of cancer accurately and easily using the temperature function data depending on time measured by heating the biological sample.

Abstract: Provided is an electronic component package for electromagnetic interference shielding. The electronic component package for electromagnetic interference shielding according to an embodiment of the present invention comprises a substrate where electronic components are mounted, a molding member formed on the substrate and the electronic components, a magnetic layer formed on the molding member, and a conductive layer formed on the magnetic layer. Electromagnetic waves generated from the electronic components embeded in the molding member are absorbed in the magnetic layer to thus prevent or reduce harmful influence on other electronic components mounted in adjacent places. In addition, harmful electromagnetic waves generated from the outside may be shielded due to the conductive layer formed on the magnetic layer, thereby protecting electronic components embeded in the molding member from being influenced by the electromagnetic waves.

Abstract: A wall-mounted drum washing machine includes a housing having one or more through-holes in a rear surface thereof; and one or more fixing units having a first side or end fixed to a wall and a second side or end inserted in one of the through-hole(s), wherein each through-hole includes a guide having a cross-sectional area that decreases from a rear surface of the housing toward a front of the housing.

Abstract: Provided is an electronic device including: an electronic component; and an electromagnetic interference shielding layer formed on at least a portion of the electronic component. The electromagnetic interference shielding layer includes: magnetic particles for electromagnetic wave absorption, each of the magnetic particles having a conductive film on a surface of the magnetic particle; and a conductive portion where conductive metal particles for electromagnetic shielding are sintered and formed on the conductive film of the magnetic particles.

Abstract: A cleaning apparatus of an exhaust path of a process reaction chamber used in a manufacturing of articles including a semiconductor or an LCD. The cleaning apparatus of the exhaust path includes a housing having an inflow pipe, connected to an upstream end of the exhaust path, an outflow pipe, connected to a downstream end of the exhaust path, and a connecting pipe disposed between the inflow pipe and the outflow pipe. A radio frequency generator in the housing applies radio frequency power to the inflow pipe and to the outflow pipe via respective coils. Plasma induced within the inflow and outflow pipes from RF power applied via the respective coils causes the generation of radicals from the exhaust gas flowing within. The radicals act to dislodge accumulated particulates within the exhaust path downstream of the cleaning apparatus.

Abstract: Provided is an electronic device including: an electronic component; and an electromagnetic interference shielding layer formed on at least a portion of the electronic component. The electromagnetic interference shielding layer includes: magnetic particles for electromagnetic wave absorption, each of the magnetic particles having a conductive film on a surface of the magnetic particle; and a conductive portion where conductive metal particles for electromagnetic shielding are sintered and formed on the conductive film of the magnetic particles.

Abstract: A cleaning apparatus of an exhaust path of a process reaction chamber used in a manufacturing of articles including a semiconductor or an LCD. The cleaning apparatus of the exhaust path includes a housing having an inflow pipe, connected to an upstream end of the exhaust path, an outflow pipe, connected to a downstream end of the exhaust path, and a connecting pipe disposed between the inflow pipe and the outflow pipe. A radio frequency generator in the housing applies radio frequency power to the inflow pipe and to the outflow pipe via respective coils. Plasma induced within the inflow and outflow pipes from RF power applied via the respective coils causes the generation of radicals from the exhaust gas flowing within. The radicals act to dislodge accumulated particulates within the exhaust path downstream of the cleaning apparatus.

Abstract: Disclosed is an apparatus that prevents a degradation of image quality due to a deterioration of a driving apparatus in an organic electro-luminescence display device.

Abstract: Provided is an electronic component package for electromagnetic interference shielding. The electronic component package for electromagnetic interference shielding according to an embodiment of the present invention comprises a substrate where electronic components are mounted, a molding member formed on the substrate and the electronic components, a magnetic layer formed on the molding member, and a conductive layer formed on the magnetic layer. Electromagnetic waves generated from the electronic components embeded in the molding member are absorbed in the magnetic layer to thus prevent or reduce harmful influence on other electronic components mounted in adjacent places. In addition, harmful electromagnetic waves generated from the outside may be shielded due to the conductive layer formed on the magnetic layer, thereby protecting electronic components embeded in the molding member from being influenced by the electromagnetic waves.

Abstract: Provided is an electronic component package for electromagnetic interference shielding. The electronic component package for electromagnetic interference shielding according to an embodiment of the present invention comprises a substrate where electronic components are mounted, a molding member formed on the substrate and the electronic components, a magnetic layer formed on the molding member, and a conductive layer formed on the magnetic layer. Electromagnetic waves generated from the electronic components embeded in the molding member are absorbed in the magnetic layer to thus prevent or reduce harmful influence on other electronic components mounted in adjacent places. In addition, harmful electromagnetic waves generated from the outside may be shielded due to the conductive layer formed on the magnetic layer, thereby protecting electronic components embeded in the molding member from being influenced by the electromagnetic waves.

Abstract: Provided is an electronic component package for electromagnetic interference shielding. The electronic component package for electromagnetic interference shielding according to an embodiment of the present invention comprises a substrate where electronic components are mounted, a molding member formed on the substrate and the electronic components, a magnetic layer formed on the molding member, and a conductive layer formed on the magnetic layer. Electromagnetic waves generated from the electronic components embeded in the molding member are absorbed in the magnetic layer to thus prevent or reduce harmful influence on other electronic components mounted in adjacent places. In addition, harmful electromagnetic waves generated from the outside may be shielded due to the conductive layer formed on the magnetic layer, thereby protecting electronic components embeded in the molding member from being influenced by the electromagnetic waves.

Abstract: A VHF Z-coil semiconductor processing plasma source uses Inductively Coupled Plasma (ICP) and has a Z-shaped coil wound about a chamber in two interconnected turns. High frequency RF electric power of from 40 MHz to 120 MHz is supplied by a power source to the coil. A process gas introduced into the chamber is energized by the coil and generates plasma ions of high density suitable for semiconductor dry etching.

Abstract: A plasma reactor for generating a plasma for use in depositing a thin film on a large area wafer, such as in the manufacturing of solar cells. A plasma electrode unit in the plasma reactor is divided into a plurality of discrete electrodes, and RF electric power is sequentially applied to the divided plasma electrodes in accordance with a predefined sequence of temporal intervals as controlled by a sequence control unit. The sequential application of RF power across the divided plasma electrode unit resolves a standing wave problem in the plasma applied over a large area corresponding to a large area wafer.

Abstract: A plasma reactor for generating a plasma for use in depositing a thin film on a large area wafer, such as in the manufacturing of solar cells. A plasma electrode unit in the plasma reactor is divided into a plurality of discrete electrodes, and RF electric power is sequentially applied to the divided plasma electrodes in accordance with a phase angle detected by a phase control unit. The sequential application of high frequency RF power across the divided plasma electrode unit resolves a standing wave problem in the plasma applied over a large area corresponding to a large area wafer.