Patents by Inventor In-su Yang

In-su Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11976105
    Abstract: The present application provides antibody-TCR chimeric constructs comprising an antibody moiety that specifically binds to a target antigen fused to a TCRM capable of recruiting at least one TCR-associated signaling module. Also provided are methods of making and using these constructs.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: May 7, 2024
    Assignee: EUREKA THERAPEUTICS, INC.
    Inventors: Jingwei Lu, Zhiyuan Yang, Cheng Liu, Hong Liu, Yiyang Xu, Su Yan, Vivien Wai-Fan Chan, Lucas Horan
  • Patent number: 11977830
    Abstract: Demand-based deployment of a font server to an edge device is facilitated by identifying a need for font-related data that is currently unavailable at a user device. The process also includes deploying a font server to an edge device of the computing environment to facilitate distribution of the font-related data to the user device.
    Type: Grant
    Filed: September 13, 2022
    Date of Patent: May 7, 2024
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Su Liu, Luis Osvaldo Pizana, Boyi Tzen, Fan Yang
  • Publication number: 20240143114
    Abstract: A driving circuit includes: a display driver to generate a horizontal synchronization signal and a vertical synchronization signal according to a first clock signal of a first oscillator; a sensor driver to generate a touch signal according to a second clock signal of a second oscillator; and a determination circuit to detect a cycle of at least one of the horizontal synchronization signal or the vertical synchronization signal according to the second clock signal, and output a detection signal when the cycle is out of a range. The determination circuit is a part of the display driver or the sensor driver.
    Type: Application
    Filed: June 26, 2023
    Publication date: May 2, 2024
    Inventors: Jun Young KO, Tae Hyeon YANG, Han Su CHO, Tae Joon KIM, Hyun Wook CHO, Jae Woo CHOI
  • Patent number: 11973027
    Abstract: A semiconductor device and a method of forming the same are provided. The semiconductor device includes a substrate, a gate structure, a dielectric structure and a contact structure. The substrate has source/drain (S/D) regions. The gate structure is on the substrate and between the S/D regions. The dielectric structure covers the gate structure. The contact structure penetrates through the dielectric structure to connect to the S/D region. A lower portion of a sidewall of the contact structure is spaced apart from the dielectric structure by an air gap therebetween, while an upper portion of the sidewall of the contact structure is in contact with the dielectric structure.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pei-Yu Chou, Jr-Hung Li, Liang-Yin Chen, Su-Hao Liu, Tze-Liang Lee, Meng-Han Chou, Kuo-Ju Chen, Huicheng Chang, Tsai-Jung Ho, Tzu-Yang Ho
  • Patent number: 11973081
    Abstract: An integrated circuit includes a first standard cell including a first first-type transistor, a first second-type transistor, a third second-type transistor, and a third first-type transistor, a second standard cell including a second first-type transistor, a second second-type transistor, a fourth second-type transistor and a fourth first-type transistor, a plurality of wiring layers which are disposed on the first and second standard cells and includes a first wiring layer, a second wiring layer, and a third wiring layer sequentially stacked. A source contact of the first first-type transistor and a source contact of the second first-type transistor are electrically connected through a first power rail of the plurality of wiring layers, and a source contact of the third first-type transistor and a source contact of the fourth first-type transistor are electrically connected through a second power rail of the plurality of wiring layers.
    Type: Grant
    Filed: December 24, 2021
    Date of Patent: April 30, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyeon Gyu You, In Gyum Kim, Gi Young Yang, Ji Su Yu, Jin Young Lim, Hak Chul Jung
  • Patent number: 11973209
    Abstract: A positive electrode active material for a secondary battery includes a lithium composite transition metal oxide including nickel (Ni), cobalt (Co), and manganese (Mn), wherein the lithium composite transition metal oxide has a layered crystal structure of space group R3m, includes the nickel (Ni) in an amount of 60 mol % or less based on a total amount of transition metals, includes the cobalt (Co) in an amount greater than an amount of the manganese (Mn), and is composed of single particles.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: April 30, 2024
    Assignee: LG Chem, Ltd.
    Inventors: Eun Hee Lee, Seong Bae Kim, Young Su Park, Yi Rang Lim, Hong Kyu Park, Song Yi Yang, Byung Hyun Hwang, Woo Hyun Kim
  • Publication number: 20240125974
    Abstract: The present disclosure relates to humidity sensitive nano-photonics and a manufacturing method thereof, and more particularly to humidity sensitive nano-photonics including a metasurface and a method for manufacturing the same. The humidity sensitive nano-photonics and the manufacturing method thereof according to an embodiment of the present disclosure include a metasurface that are capable of expanding and contracting depending on changes in the relative humidity of the surrounding environment, and have the advantage of being easily manufactured, mass-produced at low cost, capable of effectively adjusting the phase and intensity of light, and applicable to various materials and various shapes of surfaces as well.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 18, 2024
    Inventors: Jun Suk RHO, Byoung Su KO, Young Hwan YANG, Jae Kyoung KIM, Trevon Badloe
  • Publication number: 20240130171
    Abstract: A display may include flexible substrate, a blocking layer on the flexible substrate, a pixel on the flexible substrate and the blocking layer, and a scan line, a data line, a driving voltage line, and an initialization voltage line connected to the pixel. The pixel may include an organic light emitting diode, a switching transistor connected to the scan line, and a driving transistor to apply a current to the organic light emitting diode. The blocking layer is in an area that overlaps the switching transistor on a plane, and between the switching transistor and the flexible substrate, and receives a voltage through a contact hole that exposes the blocking layer.
    Type: Application
    Filed: December 8, 2023
    Publication date: April 18, 2024
    Applicant: Samsung Display Co., Ltd.
    Inventors: Seong Min WANG, Young-In HWANG, Yong Ho YANG, Yong Su LEE, Jae Seob LEE, Gyoo Chul JO
  • Publication number: 20240118513
    Abstract: A lens assembly includes a first D-cut lens and a lens barrel surrounding a portion of a side surface of the first D-cut lens. The side surface of the first D-cut lens includes a linear portion, and the lens barrel is configured to expose at least a portion of the linear portion of the first D-cut lens in a direction perpendicular to an optical axis.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 11, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: So Mi YANG, Jae Hyuk HUH, Byung Hyun KIM, Ji Su LEE
  • Patent number: 11946542
    Abstract: A system and method for operating an electric vehicle. In another exemplary embodiment, a system for operating an electric vehicle is disclosed. The system includes a first motor and a transmission coupled to the first motor. The transmission is configured to shift gears when a speed of the electric vehicle crosses a shift threshold. The shift threshold is independent of a position of an acceleration pedal of the electrical vehicle.
    Type: Grant
    Filed: November 10, 2022
    Date of Patent: April 2, 2024
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Dongxu Li, Chunhao J. Lee, Thomas Weglarz, Su-Yang Shieh, Paul Guillermo Otanez
  • Patent number: 11939360
    Abstract: The present invention relates to a pharmaceutical composition and a health functional food composition for preventing, alleviating or treating inflammatory diseases, including Toxoplasma gondii GRA9 protein or a gene encoding the protein as an active ingredient. The present inventors have identified the C-terminal region essential for the NLRP3-mediated mechanism of action and function of Toxoplasma gondii GRA9 in macrophages, which are host immune cells and confirmed the substantial anti-inflammatory and antibacterial effects and the antiseptic effect in vivo. Accordingly, Toxoplasma gondii GRA9 protein or a gene encoding the protein is expected to be usefully utilized in the field of prevention or treatment of inflammatory diseases caused by an abnormal NLRP3-mediated inflammatory response, including sepsis.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: March 26, 2024
    Assignee: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS
    Inventors: Chul-Su Yang, Jae-Sung Kim
  • Patent number: 11939698
    Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: March 26, 2024
    Assignee: SENIC INC.
    Inventors: Jong Hwi Park, Jung-Gyu Kim, Eun Su Yang, Byung Kyu Jang, Jung Woo Choi, Yeon Sik Lee, Sang Ki Ko, Kap-Ryeol Ku
  • Publication number: 20240094513
    Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens sequentially disposed on an optical axis from an object side toward an image side. A distance from an object-side surface of the first lens to an imaging plane of an image sensor is TTL, an overall focal length of an optical system including the first to sixth lenses is F, and TTL/F?0.83. An optical axis distance between the second lens and the third lens is D23, an optical axis distance between the third lens and the fourth lens is D34, and 2.2<D23/D34<5.4.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwa SON, Young Su JIN, Dong Shin YANG, Yong Joo JO
  • Publication number: 20240095348
    Abstract: Provided are a computer program product, system, and method for detection of a homoglyph attack in code reviewed in an augmented reality display. A determination is made whether a line of code of source code includes a non-coding script character in a non-coding script that is a homoglyph of a coding script character in a coding script as indicated in a homoglyph pair. Valid statements in a computer language in which the source code is written are formed from characters in the coding script and not from characters in the non-coding script. In response to determining that the line of code includes the non-coding script character in the homoglyph pair, transmitting information on the homoglyph pair to cause the augmented reality display to render information on indication of the homoglyph.
    Type: Application
    Filed: September 15, 2022
    Publication date: March 21, 2024
    Inventors: Su LIU, Boyi TZEN, Fan YANG, Saraswathi Sailaja PERUMALLA
  • Publication number: 20240096848
    Abstract: A method of manufacturing a semiconductor device includes forming a first bonding layer over a substrate of a first wafer, the first wafer including a first semiconductor die and a second semiconductor die, performing a first dicing process to form two grooves that extend through the first bonding layer, the two grooves being disposed between the first semiconductor die and the second semiconductor die, performing a second dicing process to form a trench that extends through the first bonding layer and partially through the substrate of the first wafer, where the trench is disposed between the two grooves, and thinning a backside of the substrate of the first wafer until the first semiconductor die is singulated from the second semiconductor die.
    Type: Application
    Filed: January 4, 2023
    Publication date: March 21, 2024
    Inventors: Chih-Wei Wu, Ching-Feng Yang, Ying-Ching Shih, An-Jhih Su, Wen-Chih Chiou
  • Publication number: 20240086617
    Abstract: Demand-based deployment of a font server to an edge device is facilitated by identifying a need for font-related data that is currently unavailable at a user device. The process also includes deploying a font server to an edge device of the computing environment to facilitate distribution of the font-related data to the user device.
    Type: Application
    Filed: September 13, 2022
    Publication date: March 14, 2024
    Inventors: Su LIU, Luis Osvaldo PIZANA, Boyi TZEN, Fan YANG
  • Publication number: 20240075740
    Abstract: An inkjet head unit capable of performing high-resolution pixel printing on a large-size substrate and a substrate treatment apparatus including the inkjet head unit are provided. The substrate treatment apparatus includes: a processing unit supporting and moving a substrate; an inkjet head unit performing pixel printing on the substrate; and a gantry unit moving the inkjet head unit over the substrate, wherein the inkjet head unit includes head packs, which include a plurality of nozzles ejecting a substrate treatment liquid onto the substrate, and a head base, in which the head packs are installed and the head packs are disposed in a single row in the head base.
    Type: Application
    Filed: July 24, 2023
    Publication date: March 7, 2024
    Inventors: Jang Mi WOO, Jin Hyuck Yang, Yong Kyu Cho, Cheon Su Cho, Ki Hoon Choi
  • Publication number: 20240076799
    Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.
    Type: Application
    Filed: November 1, 2023
    Publication date: March 7, 2024
    Applicant: SENIC INC.
    Inventors: Jong Hwi PARK, Jung-Gyu KIM, Eun Su YANG, Byung Kyu JANG, Jung Woo CHOI, Yeon Sik LEE, Sang Ki KO, Kap-Ryeol KU
  • Patent number: 11856678
    Abstract: Example embodiments relate to a method of measurement, an apparatus for measurement, and an ingot growing system that measure properties relating an induction heating characteristic of a graphite article. The method of measurement comprises an arranging step of arranging a graphite article to the coil comprising a winded conducting wire; and a measuring step of applying power for measurement to the coil through means of measurement connected electronically to the coil, and measuring electromagnetic properties induced in the coil. The method of measurement and the like measure electromagnetic properties of graphite articles like an ingot growing container, and an insulating material, and provide data required for selecting so that further enhanced reproducibility for growth of an ingot can be secured.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: December 26, 2023
    Assignee: SENIC INC.
    Inventors: Eun Su Yang, Jong Hwi Park, Jung Woo Choi, Byung Kyu Jang, Sang Ki Ko, Jongmin Shim, Kap-Ryeol Ku, Jung-Gyu Kim
  • Publication number: 20230354564
    Abstract: A multi path cooling system is provided that includes a first cooling path in which a refrigerant is circulated by a first pump and a second cooling path in which the refrigerant is circulated by a second pump. A reservoir tank is provided through which the refrigerant circulating through the first cooling path enters or exits. An air separator is disposed on the second cooling path to separate air from the passing refrigerant when the refrigerant circulating through the second cooling path passes. The reservoir tank and the air separator communicate with each other.
    Type: Application
    Filed: July 5, 2023
    Publication date: November 2, 2023
    Inventors: Kyung Ho Kim, Sang Wan Kim, Dong Su Yang, Young Tae Yang