Patents by Inventor In-sub KWAK

In-sub KWAK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solid state drive apparatus including electrostatic prevention structure
    Patent number: 11974420
    Abstract: A solid state drive apparatus includes a case including a base and side walls extending upward along a circumference of the base, an electrostatic prevention structure of a metal pillar spaced apart from the side walls and protruding from at least a partial surface of the base and an electrostatic absorbing member on at least a partial surface of the metal pillar, a package substrate module mounted on the electrostatic prevention structure in the case, and a cover covering the case and the package substrate module.
    Type: Grant
    Filed: January 4, 2023
    Date of Patent: April 30, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-ki Lee, In-sub Kwak, Il-han Yun
  • SOLID STATE DRIVE APPARATUS INCLUDING ELECTROSTATIC PREVENTION STRUCTURE
    Publication number: 20230142313
    Abstract: A solid state drive apparatus includes a case including a base and side walls extending upward along a circumference of the base, an electrostatic prevention structure of a metal pillar spaced apart from the side walls and protruding from at least a partial surface of the base and an electrostatic absorbing member on at least a partial surface of the metal pillar, a package substrate module mounted on the electrostatic prevention structure in the case, and a cover covering the case and the package substrate module.
    Type: Application
    Filed: January 4, 2023
    Publication date: May 11, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sung-ki LEE, In-sub KWAK, Il-han YUN
  • Solid state drive apparatus including electrostatic prevention structure
    Patent number: 11576287
    Abstract: A solid state drive apparatus includes a case including a base and side walls extending upward along a circumference of the base, an electrostatic prevention structure of a metal pillar spaced apart from the side walls and protruding from at least a partial surface of the base and an electrostatic absorbing member on at least a partial surface of the metal pillar, a package substrate module mounted on the electrostatic prevention structure in the case, and a cover covering the case and the package substrate module.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: February 7, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-ki Lee, In-sub Kwak, Il-han Yun
  • Memory device including a conductive plate with a shielding region
    Patent number: 11310905
    Abstract: Provided is a memory device. The memory device includes a module board on which one or more semiconductor devices are disposed and a conductive plate mounted on a first side of the module board. The conductive plate includes a shielding region and a non-shielding region. A pad is disposed in the shielding region of the conductive plate.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: April 19, 2022
    Assignee: SAMSUNG ELECTRONICS CO, LTD.
    Inventors: Chung Hyun Ryu, In Sub Kwak, Min Woo Gu
  • MEMORY DEVICE INCLUDING A CONDUCTIVE PLATE WITH A SHIELDING REGIOIN
    Publication number: 20200413528
    Abstract: Provided is a memory device. The memory device includes a module board on which one or more semiconductor devices are disposed and a conductive plate mounted on a first side of the module board. The conductive plate includes a shielding region and a non-shielding region. A pad is disposed in the shielding region of the conductive plate.
    Type: Application
    Filed: March 18, 2020
    Publication date: December 31, 2020
    Inventors: Chung Hyun Ryu, In Sub Kwak, Min Woo Gu
  • SOLID STATE DRIVE APPARATUS INCLUDING ELECTROSTATIC PREVENTION STRUCTURE
    Publication number: 20200077547
    Abstract: A solid state drive apparatus includes a case including a base and side walls extending upward along a circumference of the base, an electrostatic prevention structure of a metal pillar spaced apart from the side walls and protruding from at least a partial surface of the base and an electrostatic absorbing member on at least a partial surface of the metal pillar, a package substrate module mounted on the electrostatic prevention structure in the case, and a cover covering the case and the package substrate module.
    Type: Application
    Filed: March 12, 2019
    Publication date: March 5, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sung-ki LEE, In-sub KWAK, Il-han YUN