Abstract: A low profile flat bombe for Liquefied Petroleum Gas (LPG) storage and method for manufacturing the same, may include a flat bombe body including an upper plate having a plurality of first piercing holes and a pump installation hole formed therethrough, a lower plate having a plurality of second piercing holes formed therethrough at positions vertically coinciding with the plurality of first piercing holes, and side plates integrally connecting first and second side end portions of the upper and lower plates, end plates mounted at front and rear openings in the flat bombe body, and support pipes, wherein upper end portions of the support pipes are welded to internal circumferential portions of the plurality of first piercing holes and lower end portions thereof are welded to internal circumferential portions of the plurality of second piercing holes to maintain a vertical distance between the upper and lower plates.

Abstract: Provided is a heating patch. The heating patch includes: a flexible plate-shaped base substrate; an electrode portion including a pair of lead electrodes formed on at least one surface of the base substrate along a longitudinal direction to be spaced apart along a width direction of the base substrate, and a pair of branch electrodes extending from the lead electrodes along the width direction of the base substrate to be not electrically connected to each other and to be overlapped with each other; a heating portion including a conductive heating material disposed in an overlapped part between the branch electrodes which have a predetermined area and face each other to generate heat while conducting the pair of branch electrodes to each other; and a pair of cover members disposed on both sides of the base substrate to prevent the electrode portion and the heating portion from being exposed externally.

Abstract: An embodiment of the present invention provides a window cover for a sensor package and a sensor package including the same, the window cover comprising: a body; an element receiving unit disposed in the body so as to receive a light emitting element and a light receiving element of the sensor package; and a radiating unit disposed at a position corresponding to the light emitting element in the element receiving unit so as to change light generated from the light emitting element to a predetermined beam range and radiate the same.

Abstract: The proposed technology relates to a window cover for a sensor package, in which a partition wall is provided between a light emitting device and a light receiving device to improve sensing accuracy and reliability of the sensor package. The proposed window cover includes: a base disposed in a direction in which light is emitted from a light source; a light emitting device cover extending from a first surface of the base and disposed at an upper portion of a light emitting device of the sensor package; and a light receiving device cover having the first surface of the base as a bottom surface thereof, and disposed at an upper portion of a light receiving device of the sensor package, wherein an outer circumference of the light emitting device cover extends in a direction opposite to the direction in which the light is emitted to form a partition wall.

Abstract: The present disclosure relates to an apparatus for sensing touch pressure. The apparatus for sensing touch pressure, according to one mode of the present disclosure, includes: a first substrate provided with a first electrode unit formed thereon; a second substrate provided with a second electrode unit formed thereon; and a porous membrane member provided between the first substrate and the second substrate and deformed or restored according to touch pressure applied to the first substrate.

Abstract: An embodiment of the present invention provides a window cover for a sensor package and a sensor package including the same, the window cover comprising: a body; an element receiving unit disposed in the body so as to receive a light emitting element and a light receiving element of the sensor package; and a radiating unit disposed at a position corresponding to the light emitting element in the element receiving unit so as to change light generated from the light emitting element to a predetermined beam range and radiate the same.

Abstract: Provided is a heating patch. The heating patch includes: a flexible plate-shaped base substrate; an electrode portion including a pair of lead electrodes formed on at least one surface of the base substrate along a longitudinal direction to be spaced apart along a width direction of the base substrate, and a pair of branch electrodes extending from the lead electrodes along the width direction of the base substrate to be not electrically connected to each other and to be overlapped with each other; a heating portion including a conductive heating material disposed in an overlapped part between the branch electrodes which have a predetermined area and face each other to generate heat while conducting the pair of branch electrodes to each other; and a pair of cover members disposed on both sides of the base substrate to prevent the electrode portion and the heating portion from being exposed externally.

Abstract: The proposed technology relates to a window cover for a sensor package, in which a partition wall is provided between a light emitting device and a light receiving device to improve sensing accuracy and reliability of the sensor package. The proposed window cover includes: a base disposed in a direction in which light is emitted from a light source; a light emitting device cover extending from a first surface of the base and disposed at an upper portion of a light emitting device of the sensor package; and a light receiving device cover having the first surface of the base as a bottom surface thereof, and disposed at an upper portion of a light receiving device of the sensor package, wherein an outer circumference of the light emitting device cover extends in a direction opposite to the direction in which the light is emitted to form a partition wall.

Abstract: The present disclosure relates to an apparatus for sensing touch pressure. The apparatus for sensing touch pressure, according to one mode of the present disclosure, includes: a first substrate provided with a first electrode unit formed thereon; a second substrate provided with a second electrode unit formed thereon; and a porous membrane member provided between the first substrate and the second substrate and deformed or restored according to touch pressure applied to the first substrate.

Abstract: An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

Abstract: An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

Abstract: In a direct-type backlight unit, a board has upper and lower surfaces defining a thickness therebetween. A plurality of unit light sources are disposed on the board. Here, in each of the unit light sources, a wiring pattern is formed on the board. A light emitting device is disposed on the wiring pattern to electrically connect thereto. A non-conductive side wall surrounds, without interruption, the light emitting device at a predetermined interval therefrom, the non-conductive side wall having a height lower than that of the light emitting device. Also, an encapsulant is formed in a dome shape inside the side wall. In this fashion, the light emitting devices are mounted on the board by a chip-on-board technique.

Abstract: An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

Abstract: A method of manufacturing a vertical GaN-based LED comprises forming a light emission structure in which an n-type GaN-based semiconductor layer, an active layer, and a p-type GaN-based semiconductor layer are sequentially laminated on a substrate; etching the light emission structure such that the light emission structure is divided into units of LED; forming a p-electrode on each of the divided light emission structures; filling a non-conductive material between the divided light emission structures; forming a metal seed layer on the resulting structure; forming a first plated layer on the metal seed layer excluding a region between the light emission structures; forming a second plated layer on the metal seed layer between the first plated layers; separating the substrate from the light emission structures; removing the non-conductive material between the light emission structures exposed by separating the substrate; forming an n-electrode on the n-type GaN-based semiconductor layer; and removing portions

Abstract: An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

Abstract: A method of manufacturing a vertical GaN-based LED comprises forming a light emission structure in which an n-type GaN-based semiconductor layer, an active layer, and a p-type GaN-based semiconductor layer are sequentially laminated on a substrate; etching the light emission structure such that the light emission structure is divided into units of LED; forming a p-electrode on each of the divided light emission structures; filling a non-conductive material between the divided light emission structures; forming a metal seed layer on the resulting structure; forming a first plated layer on the metal seed layer excluding a region between the light emission structures; forming a second plated layer on the metal seed layer between the first plated layers; separating the substrate from the light emission structures; removing the non-conductive material between the light emission structures exposed by separating the substrate; forming an n-electrode on the n-type GaN-based semiconductor layer; and removing portions

Abstract: In a direct-type backlight unit, a board has upper and lower surfaces defining a thickness therebetween. A plurality of unit light sources are disposed on the board. Here, in each of the unit light sources, a wiring pattern is formed on the board. A light emitting device is disposed on the wiring pattern to electrically connect thereto. A non-conductive side wall surrounds, without interruption, the light emitting device at a predetermined interval therefrom, the non-conductive side wall having a height lower than that of the light emitting device. Also, an encapsulant is formed in a dome shape inside the side wall. In this fashion, the light emitting devices are mounted on the board by a chip-on-board technique.

Abstract: An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.