Patents by Inventor In-won O

In-won O has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190207062
    Abstract: A light emitting device package according to an embodiment includes: a body including an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface, and first and second openings passing through the upper surface and the lower surface; and a light emitting device including first and second bonding portions disposed on the first and second openings, respectively, wherein the body may include a recess provided on the lower surface, the recess may be vertically overlapped with the first opening and the second opening, and the recess may be exposed at the side surface of the body.
    Type: Application
    Filed: January 2, 2019
    Publication date: July 4, 2019
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Won Jung KIM, June O SONG, Ki Seok KIM, Chang Man LIM
  • Publication number: 20190190132
    Abstract: Disclosed is a patch antenna module, which receives a signal for position information and a signal for vehicle communication by using one patch antenna, thereby minimizing a mounting space. The disclosed patch antenna module includes a dielectric; an upper patch formed on one surface of the dielectric and for receiving a signal for position information; a lower patch formed on the other surface of the dielectric; and a feed pin for penetrating the dielectric, the upper patch, and the lower patch, formed in a length within a predetermined range, and for receiving a signal for vehicle communication.
    Type: Application
    Filed: August 16, 2017
    Publication date: June 20, 2019
    Inventors: Chul HWANG, In-Jo JEONG, Sang-O KIM, Dong-Hwan KOH, Won-Hee LEE, Hyun-Woo OH
  • Publication number: 20190183976
    Abstract: This invention relates to inhibitors of CXC receptor 4 (CXCR4)-G protein-coupled receptor (GPCR) heteromers (CXCR4-GPCR heteromers) associated with cancers, where CXCR4 forms a functional heteromer with other G protein-coupled receptors (GPCRx). More specifically, this invention relates to GPCRx that form heteromers with CXCR4, which upon co-stimulation with CXCR4 agonists and GPCRx agonists leads to enhanced signaling downstream of CXCR4. This invention also provides for the use of inhibitors of the interacting GPCR partner of the CXCR4-GPCRx heteromer or CXCR4-GPCRx heteromer-specific inhibitors including inhibitors of the formation of the CXCR4-GPCRx heteromer and CXCR4-GPCRx heteromer-specific antibodies, and in the diagnosis and/or therapy for cancer.
    Type: Application
    Filed: December 18, 2018
    Publication date: June 20, 2019
    Applicant: GPCR THERAPEUTICS, INC.
    Inventors: DongSeung SEEN, Eunhee KIM, Jae-Yeon JEONG, Chang Soo YANG, Milim LEE, SoHui KIM, Won-Ki HUH, Yong Bhum SONG, Chul O PARK, Hyeryung PARK, Jiyeong LEE
  • Publication number: 20190166056
    Abstract: Systems and methods of site traffic control are disclosed. In some example embodiments, a request for an online service to perform an operation is received from a user on a client device, and at least one overload condition for the online service is detected, or otherwise determined, with the overload condition(s) corresponding to a request time of the request. A standard of restriction is selected from a plurality of standards of restriction based on the overload condition(s), and the selected standard of restriction is used as a basis for either denying or permitting the user access to the operation of the online service.
    Type: Application
    Filed: December 28, 2018
    Publication date: May 30, 2019
    Inventors: Yu Tang, Bryant Genepang Luk, Jennifer T. Robertson, Robert He, Christopher Diebold O'Toole, Jason Ziaja, Ananya Das, Jun Ho Cho, Zi Won Ahn
  • Patent number: 10297725
    Abstract: The embodiment relates to a semiconductor device package, a method of manufacturing the semiconductor device package, and a light source apparatus. According to another embodiment, there is provided a light emitting device package which includes a package body (110) including a frame (111, 112) and a body (113); a light emitting device (120) including first and second bonding parts (121, 122) and disposed on the body (113); a reflective resin layer disposed between the light emitting device and a side surface of a cavity (C) formed in the body; a transparent resin layer on the light emitting device; and a phosphor layer disposed on the transparent resin layer while being spaced apart from the light emitting device.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: May 21, 2019
    Assignee: LG Innotek Co., Ltd.
    Inventors: Ki Seok Kim, Won Jung Kim, June O Song, Chang Man Lim
  • Publication number: 20190148968
    Abstract: An electronic device includes a battery, a power regulator electrically connected with the battery and including an input terminal and an output terminal, a connector electrically connected with the input terminal, a wireless power transmitting circuit electrically connected with the output terminal, a switch electrically connected between the connector and the wireless power transmitting circuit, and a controller configured to identify an approaching external electronic device or a wireless charging-related request, identify whether power is provided from an external power supply via the connector in response to the identification, in response to identifying that power is not provided from the external power supply, supply power from the battery via the power regulator to the wireless power transmitting circuit, and in response to identifying that power is provided from the external power supply, supply the power provided from the external power supply to the wireless power transmitting circuit via the switc
    Type: Application
    Filed: November 13, 2018
    Publication date: May 16, 2019
    Inventors: Dong Zo KIM, Kwang Seob KIM, Ji Won KIM, Hye Won KIM, Chang Hak O, Kyung Woo LIM, Byeong Hyun JANG, Kuk Hwan JUNG, Hyung Koo CHUNG, Se Hyun CHO, Min Cheol HA, Yong Sang YUN
  • Patent number: 9542978
    Abstract: A semiconductor package includes: a plurality of memory packages which are arranged on a substrate; and a logic chip, which has a rhombus shape including first through fourth corners and first through fourth sides connecting the first through fourth corners, is arranged adjacent to the plurality of memory packages, and includes a plurality of terminals that are electrically connected to the plurality of memory packages, as seen on a plan view of the semiconductor package, wherein the plurality of terminals include system address terminals which are adjacent to the first corner of the logic chip and first and second system data terminals which are respectively arranged on the first and second sides contacting the first corner. Another semiconductor package and a method of fabrication are disclosed.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: January 10, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-won Lee, Jang-mee Seo, In-won O
  • Publication number: 20160049176
    Abstract: A semiconductor package includes: a plurality of memory packages which are arranged on a substrate; and a logic chip, which has a rhombus shape including first through fourth corners and first through fourth sides connecting the first through fourth corners, is arranged adjacent to the plurality of memory packages, and includes a plurality of terminals that are electrically connected to the plurality of memory packages, as seen on a plan view of the semiconductor package, wherein the plurality of terminals include system address terminals which are adjacent to the first corner of the logic chip and first and second system data terminals which are respectively arranged on the first and second sides contacting the first corner. Another semiconductor package and a method of fabrication are disclosed.
    Type: Application
    Filed: June 2, 2015
    Publication date: February 18, 2016
    Inventors: Jong-won LEE, Jang-mee SEO, In-won O
  • Patent number: 9059067
    Abstract: A semiconductor device includes an interposer mounting a semiconductor chip. The interposer includes a silicon substrate having a recessed region formed on a first surface, a first through via penetrating a first region of the silicon substrate from the first surface to an opposing second surface, an insulator disposed in the recessed region, and a first wire pattern at least partially disposed on the insulator and electrically connecting the first through via to the semiconductor chip.
    Type: Grant
    Filed: September 19, 2011
    Date of Patent: June 16, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yun-seok Choi, So-young Lim, In-won O
  • Patent number: 8981514
    Abstract: A semiconductor package includes a light transmissive cover having a conductive pattern, a substrate having a cavity, a semiconductor chip in the cavity of the substrate and electrically connected to the conductive pattern arranged on the light transmissive cover, and a blocking pattern between the light transmissive cover and the substrate.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: March 17, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Han-Sung Ryu, Byoung-Rim Seo, In-Won O
  • Patent number: 8823185
    Abstract: Provided is a semiconductor package including: a semiconductor chip mounted on a die pad; at least one lead connected electrically to the semiconductor chip; and a flexible film substrate including a metal wiring, which electrically connects the semiconductor chip and the at least one lead, wherein the semiconductor chip is electrically connected to the film substrate through a first connection member which contacts the semiconductor chip and the metal wiring; and the film substrate is electrically connected to the at least one lead through a second connection member which contacts the metal wiring and the at least one lead.
    Type: Grant
    Filed: September 24, 2011
    Date of Patent: September 2, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: In Won O, Woojae Kim, YoungHoon Ro, HanShin Youn, Yechung Chung, YunSeok Choi
  • Publication number: 20130264703
    Abstract: A semiconductor package includes a holder covering or encapsulating an edge part of a semiconductor chip. Thus, it may be possible to isolate the edge part on which contaminants may easily exist from a pixel part. As a result, the contaminants from the edge part do not contaminate the pixel part, so that distortion of an image may be prevented.
    Type: Application
    Filed: February 27, 2013
    Publication date: October 10, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yujung TAE, ByoungRim SEO, IN WON O
  • Publication number: 20130181314
    Abstract: A semiconductor package includes a light transmissive cover having a conductive pattern, a substrate having a cavity, a semiconductor chip in the cavity of the substrate and electrically connected to the conductive pattern arranged on the light transmissive cover, and a blocking pattern between the light transmissive cover and the substrate.
    Type: Application
    Filed: September 12, 2012
    Publication date: July 18, 2013
    Inventors: Han-Sung RYU, Byoung-Rim SEO, In-Won O
  • Publication number: 20120168918
    Abstract: Provided is a semiconductor package including: a semiconductor chip mounted on a die pad; at least one lead connected electrically to the semiconductor chip; and a flexible film substrate including a metal wiring, which electrically connects the semiconductor chip and the at least one lead, wherein the semiconductor chip is electrically connected to the film substrate through a first connection member which contacts the semiconductor chip and the metal wiring; and the film substrate is electrically connected to the at least one lead through a second connection member which contacts the metal wiring and the at least one lead.
    Type: Application
    Filed: September 24, 2011
    Publication date: July 5, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: In Won O, Woojae KIM, YoungHoon RO, HanShin YOUN, Yechung CHUNG, YunSeok CHOI
  • Publication number: 20120091468
    Abstract: A semiconductor device includes an interposer mounting a semiconductor chip.
    Type: Application
    Filed: September 19, 2011
    Publication date: April 19, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yun-seok Choi, So-young Lim, In-won O
  • Patent number: D384344
    Type: Grant
    Filed: October 3, 1995
    Date of Patent: September 30, 1997
    Assignee: LG Electronics, Inc.
    Inventor: Won O Doo