Patents by Inventor In-won O

In-won O has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package with terminals adjacent sides and corners
    Patent number: 9542978
    Abstract: A semiconductor package includes: a plurality of memory packages which are arranged on a substrate; and a logic chip, which has a rhombus shape including first through fourth corners and first through fourth sides connecting the first through fourth corners, is arranged adjacent to the plurality of memory packages, and includes a plurality of terminals that are electrically connected to the plurality of memory packages, as seen on a plan view of the semiconductor package, wherein the plurality of terminals include system address terminals which are adjacent to the first corner of the logic chip and first and second system data terminals which are respectively arranged on the first and second sides contacting the first corner. Another semiconductor package and a method of fabrication are disclosed.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: January 10, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-won Lee, Jang-mee Seo, In-won O
  • SEMICONDUCTOR PACKAGE
    Publication number: 20160049176
    Abstract: A semiconductor package includes: a plurality of memory packages which are arranged on a substrate; and a logic chip, which has a rhombus shape including first through fourth corners and first through fourth sides connecting the first through fourth corners, is arranged adjacent to the plurality of memory packages, and includes a plurality of terminals that are electrically connected to the plurality of memory packages, as seen on a plan view of the semiconductor package, wherein the plurality of terminals include system address terminals which are adjacent to the first corner of the logic chip and first and second system data terminals which are respectively arranged on the first and second sides contacting the first corner. Another semiconductor package and a method of fabrication are disclosed.
    Type: Application
    Filed: June 2, 2015
    Publication date: February 18, 2016
    Inventors: Jong-won LEE, Jang-mee SEO, In-won O
  • Semiconductor device with interposer and method manufacturing same
    Patent number: 9059067
    Abstract: A semiconductor device includes an interposer mounting a semiconductor chip. The interposer includes a silicon substrate having a recessed region formed on a first surface, a first through via penetrating a first region of the silicon substrate from the first surface to an opposing second surface, an insulator disposed in the recessed region, and a first wire pattern at least partially disposed on the insulator and electrically connecting the first through via to the semiconductor chip.
    Type: Grant
    Filed: September 19, 2011
    Date of Patent: June 16, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yun-seok Choi, So-young Lim, In-won O
  • Semiconductor package having a blocking pattern between a light transmissive cover and a substrate, and method for fabricating the same
    Patent number: 8981514
    Abstract: A semiconductor package includes a light transmissive cover having a conductive pattern, a substrate having a cavity, a semiconductor chip in the cavity of the substrate and electrically connected to the conductive pattern arranged on the light transmissive cover, and a blocking pattern between the light transmissive cover and the substrate.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: March 17, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Han-Sung Ryu, Byoung-Rim Seo, In-Won O
  • SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20130181314
    Abstract: A semiconductor package includes a light transmissive cover having a conductive pattern, a substrate having a cavity, a semiconductor chip in the cavity of the substrate and electrically connected to the conductive pattern arranged on the light transmissive cover, and a blocking pattern between the light transmissive cover and the substrate.
    Type: Application
    Filed: September 12, 2012
    Publication date: July 18, 2013
    Inventors: Han-Sung RYU, Byoung-Rim SEO, In-Won O
  • SEMICONDUCTOR DEVICE WITH INTERPOSER AND METHOD MANUFACTURING SAME
    Publication number: 20120091468
    Abstract: A semiconductor device includes an interposer mounting a semiconductor chip.
    Type: Application
    Filed: September 19, 2011
    Publication date: April 19, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yun-seok Choi, So-young Lim, In-won O