Abstract: A multilayer capacitor is provided that includes a plurality of vias configured to receive interconnects from a die.

Abstract: A package substrate is provided that includes a core substrate and a capacitor embedded in the core substrate including a first side. The capacitor includes a first electrode and a second electrode disposed at opposite ends of the capacitor. The package also includes a first power supply metal plate extending laterally in the core substrate. The first power supply metal plate is disposed directly on the first electrode of the capacitor from the first side of the core substrate. A first via extending perpendicular to the first metal plate and connected to the first power supply metal plate from the first side of the core substrate.

Abstract: A power charging apparatus and a battery apparatus quickly charge a battery with power by separately charging each battery cell with power. The power charging apparatus includes: a power supplier supplying power; and a charging part having at least two chargers corresponding one-to-one to at least two battery cells connected to each other in parallel, each of the at least two chargers charging the corresponding battery cell with power transmitted from the power supplying unit. The battery apparatus includes: a battery having at least two battery cells connected to each other in parallel; and a charging part having at least two chargers corresponding one-to-one to the at least two battery cells and charging the at least two chargers with power received.

Abstract: Provided is a method of manufacturing a housing of an electronic device. The method includes manufacturing a housing body by successively stacking a composite material sheet with a plastic sheet applied to at least one surface of a top and a bottom surfaces of the composite material sheet and molding a plastic injection-molded product on the plastic sheet of the housing body through insert molding to connectively affix the composite material sheet with the housing body and the plastic sheet.

Abstract: Embodiments of the present invention disclose a system and method for providing pen-based content transfer between mobile computing devices. According to one embodiment, a first mobile computing device and second mobile computing device are configured to host electronic content. A pen device is operated by a user for selecting preferred electronic content from the electronic content hosted on the first computing device. Furthermore, the pen device is configured to store transfer information for facilitating transmission of the preferred electronic content from the first mobile computing device to the electronic content of the second mobile computing device based on action from the user.

Abstract: Provided is a switch control circuit for controlling a current control switch of a power supply, the power supply including a load, an inductor and the current control switch that are series-coupled to an input power. The switch control circuit includes a current measuring unit configured to measure a current flowing into the load, a current integral unit configured to integrate the measured current, a comparison unit configured to compare the integrated current value and a reference value and a control unit coupled to the current control switch, the control unit being configured to turn off the current control switch when the integrated current is substantially the same as the reference value and turn on the current control switch when a predefined off-time elapses from a time when the current control switch is turned off. The switch control circuit may quickly and accurately control an average current.

Abstract: An organic light emitting display device includes a plurality of pixels and a data driver. The plurality of pixels are configured to form n pixel columns, the plurality of pixels each including at least three sub-pixels. The data driver is configured to supply a data signal to the sub-pixels through data lines. A defective pixel of the plurality of pixels includes a dark sub-pixel and three sub-pixels. Normal pixels of the plurality of pixels include sub-pixels positioned on a same sub-pixel column as the sub-pixels of the defective pixel. And the defective pixel and the normal pixels are positioned on an i-th pixel column of the n pixel columns.

Abstract: Provided is a communication method by a management station in a wireless communication system. The method includes: receiving, from one or more stations (STAs), at least one advertising message including information on each STA; transmitting an invitation message to a specific STA among one or more STAs; establishing a link with the specific STA; and exchanging a frame with the specific STA. The link establishment includes performing association with the specific STA in order to exchange the frame with the specific STA.

Abstract: A leaky-wave antenna for a hearing device, the leaky-wave antenna including a coaxial radiator configured to receive audio signals from an external device and to indicate conductivity, and a grounding area provided in the coaxial radiator, wherein the leaky-wave antenna is connected to a housing of the hearing device.

Abstract: A display may have a liquid crystal layer sandwiched between a thin-film transistor layer and a color filter layer. An upper polarizer may be placed on top of the thin-film transistor layer. A lower polarizer may be placed under the color filter layer. Components may be bonded to bond pads on the inner surface of the thin-film transistor layer using anisotropic conductive film. Bond quality may be assessed by probing probe pads that are coupled to the bond pads or by visually inspecting the bond pads through the thin-film transistor layer. Opaque masking material in the inactive area may be provided with openings to accommodate the bond pads. Additional opaque masking material may be placed on the underside of the upper polarizer and on the upper surface of the thin-film transistor layer to block the openings from view following visual inspection.

Abstract: A semiconductor package according to some examples of the disclosure may include a substrate having a bridge embedded in the substrate, a first and second die coupled to the substrate, and a plurality of electrically conductive bridge interconnects in the substrate coupling the bridge to the first and second die. The plurality of electrically conductive bridge interconnects may have a first bridge contact layer directly coupled to the bridge, a first solder layer on the first bridge contact layer, a second bridge contact layer on the first solder layer, a second solder layer on the second bridge contact layer, and a die contact directly coupled to one of the first and second die where the plurality of electrically conductive bridge interconnects are embedded in the substrate.

Abstract: Disclosed herein are a method and architecture capable of efficiently providing virtual desktop service. A service architecture for virtual desktop service according to the present invention includes a connection broker configured to perform authentication, manage virtual machines, and perform a server monitoring and protocol coordination function, a resource pool configured to manage software resources that are delivered to a specific virtual machine in a streaming form on a specific time in order to provide on-demand virtual desktop service and are executed on the specific virtual machine and to provide provision information about the managed software resources in response to a request from the connection broker, and a virtual machine infrastructure configured to support hardware resources, generate virtual machines in which the software of a user terminal is executed, and provide the generated virtual machine as virtual desktops.

Abstract: Provided herein is an integrated device that includes a substrate, a die, a heat-dissipation layer located between the substrate and the die, and a first interconnect configured to couple the die to the heat-dissipation layer. The heat-dissipation layer may be configured to provide an electrical path for a ground signal. The first interconnect may be further configured to conduct heat from the die to the heat-dissipation layer. The integrated device may also include a second interconnect configured to couple the die to the substrate. The second interconnect may be further configured to conduct a power signal between the die and the substrate. The integrated device may also include a dielectric layer located between the heat-dissipation layer and the substrate, and a solder-resist layer located between the die and the heat-dissipation layer.

Abstract: Provided are an iridium complex represented by Formula 1 below and an organic light-emitting device including the same. Descriptions of substituents of Formula 1 are the same as described in the detailed description of the present specification.

Abstract: A circuit for correcting a power factor for an AC direct lighting apparatus that includes a valley signal generating unit configured to receive a full-wave rectified AC input voltage signal and configured to compare an internal reference voltage signal and the AC input voltage signal to generate a valley signal, a reference voltage control unit configured to receive the generated valley signal and count clock cycles of an internal clock to detect a frequency of the AC input voltage signal and configured to determine a frequency of a drive current to control a reference voltage signal based on the determined frequency of the drive current and a reference voltage control clock generating unit configured to generate a pulse width modulation signal associated with a pulse width of the reference voltage signal and configured to generate the reference voltage control clock signal based on the generated pulse width modulation signal and the controlled reference signal.

Abstract: Disclosed is an impedance matching device. Variable devices of the impedance matching device installed in a mobile terminal, such as a portable terminal, are configured to have a MEMS structure. The MEMS structure and other components are integrated as one package, so the manufacturing cost is reduced and the manufacturing efficiency is improved.

Abstract: Disclosed is a thermoplastic rubber composition comprising, based on 100 parts by weight of a block terpolymer (A) of an aromatic vinyl compound and an alkene compound, 50 to 100 parts by weight of a paraffin oil (B), 30 to 70 parts by weight of an inorganic additive (C), 5 to 30 parts by weight of a polyolefin-based resin (D), and 30 to 70 parts by weight of an acryl-based resin (E). The hardness of the thermoplastic rubber composition may be freely adjusted and the thermoplastic rubber composition has a bonding strength of 2 to 4 N/mm as measured using a UTM according to a KS M 6518 peeling test method. Accordingly, bonding strength thereof to a thermoplastic resin is increased even without addition of an adhesive.

Abstract: An air conditioning apparatus includes an air conditioning housing and a mode door. The air conditioning housing has a discharge chamber through which conditioned air is discharged out of the air conditioning housing. The discharge chamber includes a defrost vent, a main vent, floor vents and a rear seat vent. The floor vents are formed on opposite sides of a rear portion of the air conditioning housing. The rear seat vent is formed between the floor vents. The mode door has a front opening hole which is formed in a front portion of the mode door, a pair of main opening holes which are formed in a rear portion of the mode door at positions spaced apart from each other, and a rear-end opening hole which is formed behind a first portion provided between the main opening holes.

Abstract: A secure communication apparatus may include a security module for generating an encrypted bitstream by encrypting at least a portion of data forming a bitstream and inserting at least a portion of key information used in the encryption into the bitstream and for decrypting encrypted data by acquiring at least a portion of key information for the decryption from a received encrypted bitstream, and a communication module for transmitting and receiving the encrypted bitstream.

Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.