Abstract: A lighting module may be provided that includes a light guide plate; a first case coupled to one side of the light guide plate; a first light source which is disposed in the first case and emits light to the one side of the light guide plate; a second case coupled to the other side of the light guide plate; and a second light source which is disposed in the second case and emits light to the other side of the light guide plate. An amount of light which is emitted through a top surface of the light guide plate is equal to or not equal to an amount of light which is emitted through a bottom surface of the light guide plate.

Abstract: An EEPROM cell including a transfer gate that can suppress a data disturbance phenomenon of the EEPROM cell is provided. The EEPROM cell includes: an inverter; a control plate; a tunneling plate; a data output metal oxide semiconductor field effect transistor (MOSFET) that is connected to the inverter; a floating plate that is connected to the inverter; a tunneling capacitor area that is formed between the floating plate and the tunneling plate; and a transfer gate that is connected to the tunneling plate. As the transfer gate is added between a bit line and the tunneling plate of the EEPROM cell, in a standby (or unselected) operation of the EEPROM cell, the tunneling plate is floated.

Abstract: In an EEPROM cell, as a storage capacitor is added between a control plate and a tunneling plate, after the storage capacitor is charged for a time that is relatively smaller than a time necessary for writing or erasing data of the EEPROM cell, the EEPROM cell that can perform operation of writing or erasing data of the EEPROM cell using a charge voltage that is stored at the storage capacitor is provided. Therefore, operation of writing or erasing data of the EEPROM cell within a short time using the EEPROM cell can be performed, and thus entire productivity of the EEPROM can be improved.

Abstract: An organic light emitting diode (OLED) and a method for manufacturing the same are provided. In the OLED, patterned metal electrodes are positioned on one or more of upper and lower portions of a light emission layer to allow light generated from the light emission layer to emit to an area between the patterned metal electrodes.

Abstract: An electrically erasable programmable read-only memory includes a first polysilicon layer, a second polysilicon layer and a third polysilicon layer, the first polysilicon layer and the third polysilicon layer forming a control gate and the second polysilicon layer forming a floating gate. The first polysilicon layer is horizontally disposed in series with the second polysilicon layer and is connected to the third polysilicon layer, so that the control gate encloses all of the floating gate except for a tunnel surface of the floating gate.

Abstract: The lighting module includes: a case including an opening from which light is emitted, a base portion corresponding to the opening, and a seat on at least one side of the base portion; a light source unit disposed on the seat; a light guide plate placed within the case and optically connected with the light source unit; and a diffusing plate placed within the case and placed below the light guide plate, wherein the lighting source unit includes a substrate, a plurality of light emitting diodes (LEDs) disposed on the substrate, and a sub-reflector which is disposed on the substrate and covers the plurality of the LEDs, and wherein at least 90% of the light emitted from the LEDs is directly irradiated onto the light guide plate.

Abstract: The lighting device includes: a light emitting module including a substrate and a light emitting device disposed on the substrate; a member disposed on the light emitting module, the member including: a base having a hole configured to receive the light emitting device; a projection configured to reflect light from the light emitting device; and a predetermined inclined surface coupled to an outer circumference of the base, a cover surrounding the light emitting module and the member; and a heat sink including a flat surface on which the light emitting module is disposed, and coupled to the cover.

Abstract: The lighting module includes: a case including an opening from which light is emitted, a base portion corresponding to the opening, and a seat on at least one side of the base portion; a light source unit disposed on the seat; a light guide plate placed within the case and optically connected with the light source unit; and a diffusing plate placed within the case and placed below the light guide plate, wherein the lighting source unit includes a substrate, a plurality of light emitting diodes (LEDs) disposed on the substrate, and a sub-reflector which is disposed on the substrate and covers the plurality of the LEDs, and wherein at least 90% of the light emitted from the LEDs is directly irradiated onto the light guide plate.

Abstract: Disclosed is an LED lighting device which is easily assembled and disassembled and has a stable assemblability without structural shaking. The LED lighting device is able to improve a heat radiating characteristic and optical efficiency. The LED lighting device according to the embodiment includes a lower case; a light source unit disposed on one side of the lower case; a light guide plate disposed in parallel with the light source unit; and an upper case disposed on the light guide plate and coupled to the lower case in an attachable and removable way.

Abstract: Disclosed is a CMOS image sensor and a manufacturing method thereof. According to an aspect of the present invention, each pixel of CMOS image sensor includes a photo detector that includes an electon Collection layer doped with a concentration of 5×1015/cm3 to 2×1016/cm3; and a transfer transistor that is connected to the photo detector and is formed of a vertical type trench gate of which the equivalent oxide thickness is 120 ? or more.

Abstract: A lighting module includes a case including an opening where a light emits from, a base portion corresponding to the opening, and a seat on at least one side of the base portion. The lighting module further includes a light source unit disposed on the seat, a light guide plate placed within the case and optically connected with the light source unit, and a diffusing plate placed within the case and placed below the light guide plate.

Abstract: A lighting device includes a light emitting module, a member disposed on the light emitting module, a cover surrounding the light emitting module and the member, and a heat sink. The light emitting module includes a substrate and a light emitting diode disposed on the substrate. The member includes a base having a hole configured to receive the light emitting diode and a projection configured to reflect light from the light emitting diode. A diameter of the base is greater than a maximum diameter of the projection. The heat sink includes an upper portion having a flat surface on which the substrate is disposed and a lower portion having a plurality of grooves formed on a side surface of the heat sink.

Abstract: A lighting module may be provided that includes a light guide plate; a first case coupled to one side of the light guide plate; a first light source which is disposed in the first case and emits light to the one side of the light guide plate; a second case coupled to the other side of the light guide plate; and a second light source which is disposed in the second case and emits light to the other side of the light guide plate. An amount of light which is emitted through a top surface of the light guide plate is equal to or not equal to an amount of light which is emitted through a bottom surface of the light guide plate.

Abstract: A lighting module includes: a case having a main base a first and a second extension parts extending from both sides of the main base in perpendicular direction to the surface of the main base, and a first and a second auxiliary bases extending from the first and the second extension parts respectively toward the center of the main base; a substrate seated in a cavity formed by structurally connecting the main base, the first and the second extension parts and the first and the second auxiliary bases; a plurality of light emitting devices disposed on one side of the substrate in the longitudinal direction of the substrate; and a driving driver disposed on the other side of the substrate, wherein at least one of the first and the second extension parts has an opening such that the driving driver is inserted into the first and the second extension parts.

Abstract: Disclosed is a lighting device. The lighting device includes: a light emitting module including a substrate and a light emitting diode disposed on the substrate; a member being disposed on the light emitting module and including a hole into which the light emitting diode is inserted and a projection that reflects light from the light emitting diode; a cover surrounding the light emitting module and the member; and a heat sink including a top surface thereof disposed under the light emitting module and radiating heat from a plurality of the light emitting devices.

Abstract: Disclosed is a lighting module. The lighting module includes: a case including an opening where a light emits from, a base portion corresponding to the opening, and a seat on at least one side of the base portion; a light source unit disposed on the seat; a light guide plate placed within the case and optically connected with the light source unit; and a diffusing plate placed within the case and placed below the light guide plate.

Abstract: A complementary metal-oxide semiconductor (CMOS)-based planar type avalanche photo diode (APD) using a silicon epitaxial layer and a method of manufacturing the APD, the photo diode including: a substrate; a well layer of a first conductivity type formed in the substrate; an avalanche embedded junction formed in the well layer of the first conductivity type by low energy ion implantation; the silicon epitaxial layer formed in the avalanche embedded junction; a doping area of a second conductivity type opposite to the first conductive type, formed from a portion of a surface of the well layer of the first conductivity type in the avalanche embedded junction and forming a p-n junction; positive and negative electrodes formed on the doping area of the second conductivity type and the well layer of the first conductivity type separated from the doping area of the second conductivity type, respectively; and an oxide layer formed on an overall surface excluding a window where the positive and negative electrodes ar

Abstract: Provided is a technology for forming a conductive via hole to implement a three dimensional stacked structure of an integrated circuit. A method for forming a conductive via hole according to an embodiment of the present invention comprises: filling inside of a via hole structure that is formed in one or more of an upper portion and a lower portion of a substrate with silver by using a reduction and precipitation of silver in order to connect a plurality of stacked substrates by a conductor; filling a portion that is not filled with silver inside of the via hole structure by flowing silver thereinto; and sublimating residual material of silver oxide series, which is generated during the flowing, on an upper layer inside of the via hole structure filled with silver.