Abstract: A method of providing a search index based on a Bloom filter in a distributed data sharing environment based a block chain includes generating, by a data generating device, Bloom filters used as the search index on the basis of a hash value calculated by applying a hash function to a keyword set for searching for data which is to be shared, generating, by a block providing server, a new block on the basis of the Bloom filters and the data received from the data generating device and performing proof of work (PoW) on the new block, for adding the new block to the block chain, and distributing, by a block distributing server, block chain data including the new block added to the block chain.

Abstract: A DNA sequencing device, and related method, which include an electrode and a plurality of spaced apart alignment structures. The electrode defines an electrode gap, the electrode being operable to detect a change in tunneling current as a DNA strand passes through the electrode gap. The plurality of spaced apart alignment structures are arranged to position nucleotides of the DNA strand in a predetermined orientation as the DNA strand passes through the electrode gap.

Abstract: An apparatus is provided which comprises: a package substrate, an integrated circuit device coupled to a surface of the package substrate, a first material on the surface of the package substrate, the first material contacting one or more lateral sides of the integrated circuit device, the first material extending at least to a surface of the integrated circuit device opposite the package substrate, two or more separate fins over a surface of the integrated circuit device, the two or more fins comprising a second material having a different composition than the first material, and a third material having a different composition than the second material, the third material over the surface of the integrated circuit device and between the two or more fins. Other embodiments are also disclosed and claimed.

Abstract: Apparatus and methods to identify nucleotides of a DNA strand. The method includes exposing the DNA strand to a first dye or peptide, attaching the first dye or peptide to a first type of nucleotide (A,T,C,G) of the DNA strand, the first dye or peptide changing a conductance of the first type of nucleotide to which the first dye or peptide is attached, and measuring a tunneling current signal for all nucleotides of the DNA strand, the changed conductance of the first type of nucleotide providing amplified tunneling current discrimination of the nucleotides of the DNA strand.

Abstract: A heat dissipation device may be formed having a planar structure with a first surface and a surface area enhancement structure projecting from or extending into the first surface of the planar structure. In one embodiment, an integrated circuit package may be formed with the heat dissipation device, wherein the heat dissipation device and at least one integrated circuit device are brought into thermal contact with a thermal interface material between the at least one integrated circuit device and the heat dissipation device and wherein the surface area enhancement structure of the heat dissipation device directly contacts the thermal interface material.

Abstract: A DNA sequencing device, and related methods, include a nanochannel sized to receive a DNA strand, a first electrode member exposed within the nanochannel, and a second electrode member exposed within the nanochannel and spaced apart from the first electrode to form an electrode gap. The second electrode member has a wedge shaped profile, and the first and second electrode members are operable to detect a change in electronic signal as the DNA strand passes through the electrode gap.

Abstract: An apparatus for estimating bio-information may include a sensor configured to emit light to an object and detect light scattered or reflected from the object and a processor configured to acquire, based on an intensity of the detected light, a first absorbance coefficient change and a first scattering coefficient change, relative to a reference time point, acquire a second scattering coefficient change based on the first absorbance coefficient change, and correct the first scattering coefficient change based on the acquired second scattering coefficient change.

Abstract: A DNA sequencing device, and related methods, include a nanopore or nanochannel structure, and a nanoelectrode. The nanoelectrode includes electrode members having free ends exposed within the nanopore or nanochannel structure, an electrode gap defined between of the free ends, and plated portions formed on the free ends to provide a reduced sized for the electrode gap.

Abstract: An apparatus incorporating a multi-surface heat sink may comprise an integrated circuit die, a heat spreader, a plate element, and a heat sink. The heat spreader may be positioned above the IC die. The plate element may be positioned above the heat spreader. A bottom surface of the heat sink may have a first region positioned above the plate element. One or more spring elements may be positioned between the plate element and the first region of the bottom surface of the heat sink. The one or more spring elements may be under a compressive load between the plate element and the heat sink. One or more thermal conduit elements may be secured to both the plate element and the heat sink. The one or more thermal conduit elements may apply at least a part of the compressive load between the plate element and the heat sink.

Abstract: A DNA sequencing device and related methods, wherein the device includes a substrate, a nanochannel formed in the substrate, a first electrode positioned on a first side of the nanochannel, and a second electrode. The second electrode is positioned on a second side of the nanochannel opposite the first electrode, and is spaced apart from the first electrode to form an electrode gap that is exposed in the nanochannel. At least a portion of first electrode is movable relative to the second electrode to decrease a size of the electrode gap.

Abstract: Embodiments include a cooling solution having a first array of fins, where the first array of fins extend vertically from the substrate, and where adjacent individual fins of the first array are separated from each other by a microchannel. A second array of fins extend vertically from the substrate, where a channel region is between the first array of fins and the second array of fins.

Abstract: An apparatus for measuring a bio-signal may include an interstitial fluid extraction assembly configured to extract interstitial fluid from skin of a user, a sensor configured to measure at least one of an impedance and an optical characteristic of the extracted interstitial fluid, and a processor configured to estimate a concentration of an analyte based on at least one of the impedance and the optical characteristic.

Abstract: Thermal management technology is disclosed. A thermal management component in accordance with the present disclosure can comprise a heat spreader having a plurality of microchannels. The thermal management component can also comprise a plurality of fins directly coupled to the heat spreader to provide surface area for heat transfer. In another aspect, a thermal management component can comprise a heat spreader having a plurality of microchannels, and an inlet port and an outlet port in fluid communication with the plurality of microchannels. The thermal management component can also comprise a plurality of fins coupled to the heat spreader to provide surface area for heat transfer. Additionally, the thermal management component can comprise a fluid conduit thermally coupled to the plurality of fins and fluidly coupled to the outlet port and the inlet port to facilitate flow of a heat transfer fluid through the microchannels and the fluid conduit.

Abstract: A heat exchange module, comprising an array of microchannels, where the array of microchannels extends in a first direction, and are separated from one another by a first sidewall. The array of microchannels is over a cold plate. A first array of fluid distribution channels is stacked over the array of microchannels and extend in a second direction that is substantially orthogonal to the first direction. The first array of fluid distribution channels extends from the first manifold and terminate between a first manifold and a second manifold. A second array of fluid distribution channels is stacked over the array of microchannels. The first array of fluid distribution channels and the second array of the fluid distribution channels are fluidically coupled to the microchannel array. A wall extends into the microchannel array below a second sidewall separating ones of the first array and ones of the second array of fluid distribution channels.

Abstract: An integrated circuit assembly may be formed using a phase change material as an electromagnetic shield and as a heat dissipation mechanism for the integrated circuit assembly. In one embodiment, the integrated circuit assembly may comprise an integrated circuit package including a first substrate having a first surface and an opposing second surface, and at least one integrated circuit device having a first surface and an opposing second surface, wherein the at least one integrated circuit device is electrically attached by the first surface thereof to the first surface of the first substrate; and a phase change material formed on the integrated circuit package.

Abstract: An integrated circuit structure may be formed using a phase change material to substantially fill at least one chamber within the integrated circuit assembly to increase thermal capacitance. The integrated circuit assembly may comprise a substrate, at least one integrated circuit device electrically attached to the substrate, a heat dissipation device, a thermal interface material between the integrated circuit device and the heat dissipation device, a chamber defined by the heat dissipation device, the substrate, and the integrated circuit device, and a phase change material within the chamber.

Abstract: A microelectronic device may include a substrate, a first component, a second component, a slug, a heat spreader, and a heatsink. The substrate may include a plurality of electrically conductive elements. The first component may be coupled to the substrate. The second component may be coupled to the substrate. The slug may be thermally coupled to the second component. The heat spreader may be in contact with the substrate, where the heat spreader may be thermally coupled to the first component. The heatsink may be thermally coupled to the heat spreader and the slug.

Abstract: The present invention provides a production method of copper-carbon nanofibers, which can realize oxidation-resistant characteristics and process simplification, the production method comprising the steps of: forming a metal precursor-organic nanofiber comprising a metal precursor and an organic substance; and forming a metal-carbon nanofiber by performing a selective oxidation heat treatment to the metal precursor-organic nanofiber so as to simultaneously oxidize carbon of the organic substance and reduce the metal precursor to a metal, wherein the metal has a lower oxidation resistance than the carbon; the selective oxidation heat treatment is performed through a singly heat treatment step, not a plurality of heat treatment steps; and metal-carbon nanofibers with different structures may be formed according to the amount of partial oxygen pressure under which the selective oxidation heat treatment is performed.

Abstract: Provided are a wavelength conversion layer and a display device. A color conversion element comprises: a wavelength conversion layer; one or more low refractive layers which are disposed on and/or under the wavelength conversion layer and have a lower refractive index than the wavelength conversion layer; and one or more capping layers which are disposed between the wavelength conversion layer and the low refractive layers and/or on a surface opposite to a surface of each of the low refractive layers which faces the wavelength conversion layer.

Abstract: An integrated circuit die includes a device side and a backside opposite the device side, wherein the backside includes a heat transfer enhancement configuration formed therein or a heat transfer enhancement structure formed thereon each of which enhance a heat transfer area or a boiling nucleation site density over a planar backside surface. A method of forming an integrated circuit assembly includes disposing a heat exchanger on a multi-chip package, the multi-chip package including at least one integrated circuit die including a device side and an opposite backside includes a heat transfer enhancement configuration formed therein or a heat enhancement structure formed thereon; and contacting the backside of the at least one integrated circuit die with water or other cooling fluids, such as a mixture of water and antifreeze, alcohol, inert fluorinated hydrocarbon, helium, and/or other suitable cooling fluid (either liquid or gas).