Abstract: A deposition source includes a first frame including a lower space of a first crucible, a lower space of a second crucible, and a first partition wall disposed between the lower space of the first crucible and the lower space of the second crucible; and a second frame including an upper space of the first crucible, an upper space of the second crucible, a first nozzle connected to the first crucible, a second nozzle connected to the second crucible, and a second partition wall disposed between the upper space of the first crucible and the upper space of the second crucible, wherein an exhaust passage is disposed between the first partition wall of the first frame and the second partition wall of the second frame, and the first partition wall contacts the second partition wall.

Abstract: A deposition mask includes a mask main body and a coating layer. The mask main body includes a plurality of slits penetrating the mask main body. The coating layer is coated on an entire surface of the mask main body. The coating layer is made of a material different from a material of the main body, and it has a magnetic force stronger than that of the main body. Each of the slits has an open area, and a thickness of the coating layer controls a width of the open area. A photolithography process is used to form the plurality of slits.