Patents by Inventor In-Chull Yang

In-Chull Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dual memory card socket
    Patent number: 9190788
    Abstract: The Present Disclosure relates to mold a micro SIM card connecting terminal and a micro SD card connecting terminal by means of an integrated terminal mold, so as to significantly reduce the whole length of the dual memory card socket and manufacturing method thereof. The Present Disclosure is formed by a structure manufactured by molding the micro SIM card connecting terminal and the micro SD card connecting terminal by means of an integrated terminal mold, and then separating them by a cutting process.
    Type: Grant
    Filed: April 30, 2013
    Date of Patent: November 17, 2015
    Assignee: Molex, LLC
    Inventors: In-Ho You, In-Chull Yang
  • DUAL MEMORY CARD SOCKET
    Publication number: 20130288535
    Abstract: The Present Disclosure relates to mold a micro SIM card connecting terminal and a micro SD card connecting terminal by means of an integrated terminal mold, so as to significantly reduce the whole length of the dual memory card socket and manufacturing method thereof. The Present Disclosure is formed by a structure manufactured by molding the micro SIM card connecting terminal and the micro SD card connecting terminal by means of an integrated terminal mold, and then separating them by a cutting process.
    Type: Application
    Filed: April 30, 2013
    Publication date: October 31, 2013
    Applicant: Molex Incorporated
    Inventors: In-Ho YOU, In-Chull YANG
  • Inseparable PCB module in a sub body of a device
    Patent number: 7458833
    Abstract: Provided is an inseparable PCB module installed in a sub body of a device including a main body and the sub body performing predetermined opening and closing operations with respect to the main body. In the inseparable PCB module, a body part having a predetermined area, and a main body connecting part extending from the body part to a predetermined length and electrically connected to the main body are integrally formed, thereby reducing the entire volume and thickness of the device.
    Type: Grant
    Filed: February 8, 2007
    Date of Patent: December 2, 2008
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Dong-In Ha, Jae-Ho Kim, In-Chull Yang
  • Inseparable PCB module
    Publication number: 20070202720
    Abstract: Provided is an inseparable PCB module installed in a sub body of a device including a main body and the sub body performing predetermined opening and closing operations with respect to the main body. In the inseparable PCB module, a body part having a predetermined area, and a main body connecting part extending from the body part to a predetermined length and electrically connected to the main body are integrally formed, thereby reducing the entire volume and thickness of the device.
    Type: Application
    Filed: February 8, 2007
    Publication date: August 30, 2007
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-In Ha, Jae-Ho Kim, In-Chull Yang