Abstract: Disclosure is an underbody for a vehicle. The underbody includes side members formed long at opposite lateral portions of a vehicle body in a longitudinal direction of the vehicle body, and hollow cross members formed long in a transverse direction of the vehicle body, and integrally connected to the two side members.

Abstract: Disclosed is fucosyllactose having antiviral activity and inhibitory activity against viral infection, and a method for preventing or treating a viral infection by administering a composition including fucosyllactose as an active ingredient to a subject in need thereof. It was found that 2?-fucosyllactose and 3-fucosyllactose, which are human milk oligosaccharides (HMOs), have antiviral activity, and in particular, 3-fucosyllactose in vitro and in vivo exhibits much higher antiviral activity and inhibitory activity against viral infection compared to 2?-fucosyllactose and is thus useful as an antiviral agent.

Abstract: A semiconductor memory device includes a mold structure including gate electrodes stacked on a first substrate, a channel structure that penetrates a first region of the mold structure to cross the gate electrodes, a first through structure that penetrates a second region of the mold structure, and a second through structure that penetrates a third region of the mold structure. The mold structure further includes memory cell blocks extending in a first direction and spaced apart in a second direction, and a dummy block extending in the first direction and disposed between the memory cell blocks. Each of the memory cell blocks and the dummy block includes a cell region and an extension region arranged in the first direction. The first region is the cell region of one of the memory cell blocks, the second region is the extension region of the one of the memory cell blocks, and the third region is the extension region of the dummy block.

Abstract: Proposed are a non-contact image-based blood pressure measurement method and system based on advanced visual intelligence, wherein a blood pressure measurement model is created by performing neural network training with an image sequence obtained by a webcam in a non-contact manner, and the blood pressure of a measurement subject is estimated with the blood pressure measurement model. Accordingly, since the webcam for obtaining a video, that is, an image sequence, in a non-contact manner is used, blood pressure is continuously estimated during the recording with the webcam without contact with a device or another person, and blood pressure is estimated just by being in front of the webcam, so the system is easy to use, inexpensive, and secures sufficient precision by using a neural network algorithm.

Abstract: A mold structure includes gate electrodes stacked on a first substrate, a channel structure penetrating a first region of the mold structure to cross the gate electrodes, a first through structure penetrating a second region of the mold structure, and a second through structure penetrating a third region of the mold structure. The mold structure includes memory cell blocks extending in a first direction and spaced apart in a second direction, and a dummy block extending in the first direction and disposed between the memory cell blocks. Each of the memory cell and dummy blocks includes a cell region and an extension region arranged in the first direction. The first region is the cell region of one of the memory cell blocks, the second region is the extension region of the one of the memory cell blocks, and the third region is the extension region of the dummy block.

Abstract: A sensor integration module for detecting vehicle interior information and an operation method thereof are provided. The sensor integration module includes: a first sensor enabled based on first operation information and providing a sensing result as first sensing information; a second sensor enabled based on second operation information and providing a sensing result as second sensing information; a first communication device that transmits and receives information with electronic devices in a vehicle; and a controller that generates the first and second operation information for selectively enabling the first and second sensors based on information provided from the first communication device and provides the first communication device with the result determined based on the first and second sensing information.

Abstract: Embodiments in accordance with the present inventive concept disclose a chip bonding apparatus that includes a stage configured to support a substrate and a heater that is disposed above the stage. The heater includes a heat generating portion and a body portion. The chip bonding apparatus further includes a bonding tool assembly fixing unit having a first portion connected to the body portion of the heater, and a second portion configured to receive the heat generating portion. The chip bonding apparatus further includes a first bonding tool connected to the heat generating portion; and a first bonding tool fixing unit having a third portion that is connected to the first portion, and a fourth portion configured to receive the first bonding tool. The bonding tool fixing unit may be attached by an electrostatic force or by coupling between a notch gripper and a corresponding notch.

Abstract: Embodiments in accordance with the present inventive concept disclose a chip bonding apparatus that includes a stage configured to support a substrate and a heater that is disposed above the stage. The heater includes a heat generating portion and a body portion. The chip bonding apparatus further includes a bonding tool assembly fixing unit having a first portion connected to the body portion of the heater, and a second portion configured to receive the heat generating portion. The chip bonding apparatus further includes a first bonding tool connected to the heat generating portion; and a first bonding tool fixing unit having a third portion that is connected to the first portion, and a fourth portion configured to receive the first bonding tool. The bonding tool fixing unit may be attached by an electrostatic force or by coupling between a notch gripper and a corresponding notch.

Abstract: A bonding apparatus includes a detecting unit configured to determine whether a bonding head and a stage, on which a package substrate is disposed, are sufficiently parallel to each other during a bonding process, wherein the bonding head is configured to bond a semiconductor chip to the package substrate, and a correcting unit configured to adjust at least one of the bonding head or the stage based on the determination of the detecting unit during the bonding process.

Abstract: Semiconductor module testing equipment includes a test board, a plurality of pipe structures extending from an upper surface of the test board in a first direction and spaced apart from one another in a second direction that intersects the first direction, wherein the first and second directions are substantially parallel to a plane of the test board, at least one semiconductor module socket disposed between a pair of neighboring pipe structures of the plurality of pipe structures, and a plurality of nozzles disposed on each pipe structure of the plurality of pipe structures, wherein the plurality of nozzles is configured to discharge a fluid laterally.

Abstract: A bonding apparatus can include a console which controls bonding of at least one wire, a first bonding unit disposed on the console to bond a first wire to a first substrate, a second bonding unit disposed on the first bonding unit to bond a second wire to a second substrate different from the first substrate, and a vibration damping unit connected to the second bonding unit preventing vibrations generated in the second bonding unit from transmitting to the first bonding unit.

Abstract: Semiconductor module testing equipment includes a test board, a plurality of pipe structures extending from an upper surface of the test board in a first direction and spaced apart from one another in a second direction that intersects the first direction, wherein the first and second directions are substantially parallel to a plane of the test board, at least one semiconductor module socket disposed between a pair of neighboring pipe structures of the plurality of pipe structures, and a plurality of nozzles disposed on each pipe structure of the plurality of pipe structures, wherein the plurality of nozzles is configured to discharge a fluid laterally.

Abstract: A bonding apparatus includes a detecting unit configured to determine whether a bonding head and a stage, on which a package substrate is disposed, are sufficiently parallel to each other during a bonding process, wherein the bonding head is configured to bond a semiconductor chip to the package substrate, and a correcting unit configured to adjust at least one of the bonding head or the stage based on the determination of the detecting unit during the bonding process.

Abstract: An apparatus and method for detecting an object using a multi-directional integral image are disclosed. The apparatus includes an area segmentation unit, an integral image calculation unit, and an object detection unit. The area segmentation unit places windows having a size of x*y on a full image having w*h pixels so that they overlap each other at their edges, thereby segmenting the full image into a single area, a double area and a quadruple area. The integral image calculation unit calculates a single directional integral image for the single area, and calculates multi-directional integral images for the double and quadruple areas. The object detection unit detects an object for the full image using the single directional integral image and the multi-directional integral images.

Abstract: Provided are a method and a control apparatus for cooperative cleaning using multiple cleaning robots, including monitoring an overall cleaning condition of an extensive space and automatically assigning multiple cleaning robots to a space required to be cleaned, and when a cleaning area is fixed based on a cooperative cleaning method, data on an amount of garbage generated from the cleaning area or a cleaning condition of the cleaning area may be accumulated to facilitate easier management of the cleaning.

Abstract: Disclosed are an apparatus for measuring position of other apparatus and a method for the same. The apparatus may comprise at least one light emitting part transmitting a photo signal, at least one light receiving part receiving a photo signal transmitted from other apparatus, and a signal processing part controlling the at least one light emitting part to transmit the photo signal including identification information of itself, acquiring identification information of the other apparatus based on the photo signal received from the other apparatus, and acquiring a positional information of the other apparatus based on the acquired identification information of the other apparatus. Thus, the apparatus located in an arbitrary space may accurately acquire relative positional information of counterpart apparatuses.

Abstract: Disclosed are a conjugate of a metal nanoparticle including a magnetic core and at least one light emitting material linked to the metal nanoparticle through a linker, wherein the linker has an affinity for a biological material and has changed structure after contacting a biological material, a biosensor including the conjugate, and a method of measuring a concentration of specific biological material in a biological sample using the conjugate or the biosensor.

Abstract: An aligning guide, a semiconductor package comprising an aligning guide, and a method of manufacturing a semiconductor package comprising an aligning guide are provided. The semiconductor package may comprise a circuit board and an aligning guide mounted on the circuit board. The aligning guide may have a plurality of stepped portions. A plurality of semiconductor chips may be stacked on the circuit board and engage with the stepped portions of the aligning guide. According to the disclosed semiconductor package, a large number of semiconductor chips may be stacked with high accuracy and sufficient margin. Therefore, the rate of failure and defects in the chip stacking process may be reduced and the reliability and stability of the semiconductor package may be enhanced.

Abstract: An apparatus and method for detecting an object using a multi-directional integral image are disclosed. The apparatus includes an area segmentation unit, an integral image calculation unit, and an object detection unit. The area segmentation unit places windows having a size of x*y on a full image having w*h pixels so that they overlap each other at their edges, thereby segmenting the full image into a single area, a double area and a quadruple area. The integral image calculation unit calculates a single directional integral image for the single area, and calculates multi-directional integral images for the double and quadruple areas. The object detection unit detects an object for the full image using the single directional integral image and the multi-directional integral images.

Abstract: Disclosed are an object tracking system using a robot and an object tracking method using a robot. The present invention provides an object tracking system using a robot and an object tracking method using a robot capable of continuously performing object tracking without missing the corresponding object even when the object deviates from a viewing angle of a camera, in tracking an image based object (person) using a robot.