Abstract: A display device may include: a light-emitting-element layer disposed on a substrate, and including an anode electrode, a cathode electrode, a first sub-pixel including a first emission structure, a second sub-pixel including a second emission structure, and a third sub-pixel including a third emission structure; and a lens-array layer on the light-emitting-element layer, and including lenses including first, second, and third lenses provided to respectively overlap the first, second, and third emission structures. In the first sub-pixel, first base light provided from the first emission structure may pass through the first lens and be provided as first light. In the second sub-pixel, second base light provided from the second emission structure may pass through the second lens and be provided as second light. In the third sub-pixel, third base light provided from the third emission structure may pass through the third lens and be provided as third light.

Abstract: Disclosed are an apparatus and method for constructing an intrusion detection system applied to CAN communication. The method for constructing an intrusion detection system applied to CAN communication may include extracting standard information by parsing an input file associated with CAN communication, setting a policy rule by applying at least one of a static ruleset and a custom ruleset using the extracted standard information, and creating a policy file to be applied to the intrusion detection system by packing the standard information and the policy rule.

Abstract: A random number generation method and random number generator using a ZnS scintillator. The random number generator includes: a radioisotope emission layer emitting an alpha particle or a beta particle that is emitted when an atomic nucleus decays; a polymer layer disposed under the radioisotope emission layer; an inorganic scintillator layer disposed between the radioisotope emission layer and the polymer layer and applied with an inorganic scintillator substance; and a wafer layer disposed under the polymer layer and including a photodiode detecting light produced from the inorganic scintillator layer.

Abstract: A light emitting element that includes a first semiconductor layer; a second semiconductor layer disposed on the first semiconductor layer; an active layer disposed between the first semiconductor layer and the second semiconductor layer; a first insulating film at least partially surrounding the first semiconductor layer, the second semiconductor layer, and the active layer; a second insulating film surrounding the first insulating film; and a third insulating film surrounding the second insulating film, wherein a bond dissociation energy of the second insulating film may be less than each of a bond dissociation energy of the first insulating film and a bond dissociation energy of the third insulating film.

Abstract: Embodiments in accordance with the present inventive concept disclose a chip bonding apparatus that includes a stage configured to support a substrate and a heater that is disposed above the stage. The heater includes a heat generating portion and a body portion. The chip bonding apparatus further includes a bonding tool assembly fixing unit having a first portion connected to the body portion of the heater, and a second portion configured to receive the heat generating portion. The chip bonding apparatus further includes a first bonding tool connected to the heat generating portion; and a first bonding tool fixing unit having a third portion that is connected to the first portion, and a fourth portion configured to receive the first bonding tool. The bonding tool fixing unit may be attached by an electrostatic force or by coupling between a notch gripper and a corresponding notch.

Abstract: Embodiments in accordance with the present inventive concept disclose a chip bonding apparatus that includes a stage configured to support a substrate and a heater that is disposed above the stage. The heater includes a heat generating portion and a body portion. The chip bonding apparatus further includes a bonding tool assembly fixing unit having a first portion connected to the body portion of the heater, and a second portion configured to receive the heat generating portion. The chip bonding apparatus further includes a first bonding tool connected to the heat generating portion; and a first bonding tool fixing unit having a third portion that is connected to the first portion, and a fourth portion configured to receive the first bonding tool. The bonding tool fixing unit may be attached by an electrostatic force or by coupling between a notch gripper and a corresponding notch.

Abstract: A bonding apparatus includes a detecting unit configured to determine whether a bonding head and a stage, on which a package substrate is disposed, are sufficiently parallel to each other during a bonding process, wherein the bonding head is configured to bond a semiconductor chip to the package substrate, and a correcting unit configured to adjust at least one of the bonding head or the stage based on the determination of the detecting unit during the bonding process.

Abstract: Semiconductor module testing equipment includes a test board, a plurality of pipe structures extending from an upper surface of the test board in a first direction and spaced apart from one another in a second direction that intersects the first direction, wherein the first and second directions are substantially parallel to a plane of the test board, at least one semiconductor module socket disposed between a pair of neighboring pipe structures of the plurality of pipe structures, and a plurality of nozzles disposed on each pipe structure of the plurality of pipe structures, wherein the plurality of nozzles is configured to discharge a fluid laterally.

Abstract: A bonding apparatus can include a console which controls bonding of at least one wire, a first bonding unit disposed on the console to bond a first wire to a first substrate, a second bonding unit disposed on the first bonding unit to bond a second wire to a second substrate different from the first substrate, and a vibration damping unit connected to the second bonding unit preventing vibrations generated in the second bonding unit from transmitting to the first bonding unit.

Abstract: Semiconductor module testing equipment includes a test board, a plurality of pipe structures extending from an upper surface of the test board in a first direction and spaced apart from one another in a second direction that intersects the first direction, wherein the first and second directions are substantially parallel to a plane of the test board, at least one semiconductor module socket disposed between a pair of neighboring pipe structures of the plurality of pipe structures, and a plurality of nozzles disposed on each pipe structure of the plurality of pipe structures, wherein the plurality of nozzles is configured to discharge a fluid laterally.

Abstract: A bonding apparatus includes a detecting unit configured to determine whether a bonding head and a stage, on which a package substrate is disposed, are sufficiently parallel to each other during a bonding process, wherein the bonding head is configured to bond a semiconductor chip to the package substrate, and a correcting unit configured to adjust at least one of the bonding head or the stage based on the determination of the detecting unit during the bonding process.

Abstract: An apparatus and method for detecting an object using a multi-directional integral image are disclosed. The apparatus includes an area segmentation unit, an integral image calculation unit, and an object detection unit. The area segmentation unit places windows having a size of x*y on a full image having w*h pixels so that they overlap each other at their edges, thereby segmenting the full image into a single area, a double area and a quadruple area. The integral image calculation unit calculates a single directional integral image for the single area, and calculates multi-directional integral images for the double and quadruple areas. The object detection unit detects an object for the full image using the single directional integral image and the multi-directional integral images.

Abstract: Provided are a method and a control apparatus for cooperative cleaning using multiple cleaning robots, including monitoring an overall cleaning condition of an extensive space and automatically assigning multiple cleaning robots to a space required to be cleaned, and when a cleaning area is fixed based on a cooperative cleaning method, data on an amount of garbage generated from the cleaning area or a cleaning condition of the cleaning area may be accumulated to facilitate easier management of the cleaning.

Abstract: Disclosed are an apparatus for measuring position of other apparatus and a method for the same. The apparatus may comprise at least one light emitting part transmitting a photo signal, at least one light receiving part receiving a photo signal transmitted from other apparatus, and a signal processing part controlling the at least one light emitting part to transmit the photo signal including identification information of itself, acquiring identification information of the other apparatus based on the photo signal received from the other apparatus, and acquiring a positional information of the other apparatus based on the acquired identification information of the other apparatus. Thus, the apparatus located in an arbitrary space may accurately acquire relative positional information of counterpart apparatuses.

Abstract: Disclosed are a conjugate of a metal nanoparticle including a magnetic core and at least one light emitting material linked to the metal nanoparticle through a linker, wherein the linker has an affinity for a biological material and has changed structure after contacting a biological material, a biosensor including the conjugate, and a method of measuring a concentration of specific biological material in a biological sample using the conjugate or the biosensor.

Abstract: An aligning guide, a semiconductor package comprising an aligning guide, and a method of manufacturing a semiconductor package comprising an aligning guide are provided. The semiconductor package may comprise a circuit board and an aligning guide mounted on the circuit board. The aligning guide may have a plurality of stepped portions. A plurality of semiconductor chips may be stacked on the circuit board and engage with the stepped portions of the aligning guide. According to the disclosed semiconductor package, a large number of semiconductor chips may be stacked with high accuracy and sufficient margin. Therefore, the rate of failure and defects in the chip stacking process may be reduced and the reliability and stability of the semiconductor package may be enhanced.

Abstract: An apparatus and method for detecting an object using a multi-directional integral image are disclosed. The apparatus includes an area segmentation unit, an integral image calculation unit, and an object detection unit. The area segmentation unit places windows having a size of x*y on a full image having w*h pixels so that they overlap each other at their edges, thereby segmenting the full image into a single area, a double area and a quadruple area. The integral image calculation unit calculates a single directional integral image for the single area, and calculates multi-directional integral images for the double and quadruple areas. The object detection unit detects an object for the full image using the single directional integral image and the multi-directional integral images.

Abstract: Disclosed are an object tracking system using a robot and an object tracking method using a robot. The present invention provides an object tracking system using a robot and an object tracking method using a robot capable of continuously performing object tracking without missing the corresponding object even when the object deviates from a viewing angle of a camera, in tracking an image based object (person) using a robot.

Abstract: An apparatus for creating a radio map includes a radio signal acquiring unit that acquires information on radio signals between one or more cooperative intelligent robots, a radio environment modeling unit that estimates radio strength for each cell configuring the radio map from the information on radio signals acquired by the radio signal acquiring unit, and a radio map creating unit that classifies a communication region of each cell and models the radio map according to the radio strength for each cell estimated by the radio environment modeling unit.

Abstract: An aligning guide, a semiconductor package comprising an aligning guide, and a method of manufacturing a semiconductor package comprising an aligning guide are provided. The semiconductor package may comprise a circuit board and an aligning guide mounted on the circuit board. The aligning guide may have a plurality of stepped portions. A plurality of semiconductor chips may be stacked on the circuit board and engage with the stepped portions of the aligning guide. According to the disclosed semiconductor package, a large number of semiconductor chips may be stacked with high accuracy and sufficient margin. Therefore, the rate of failure and defects in the chip stacking process may be reduced and the reliability and stability of the semiconductor package may be enhanced.