Abstract: A display device includes a first electrode and a second electrode which are spaced apart from each other on a substrate. A light emitting element is disposed between the first electrode and the second electrode. A light emitting element core of the light emitting element includes a first semiconductor layer, a second semiconductor layer spaced apart from the first semiconductor layer, and a light emitting layer disposed between the first semiconductor layer and the second semiconductor layer. A first element insulating layer surrounds a side surface of the light emitting element core. The first element insulating layer is an oxide insulating layer having a single crystalline structure.

Abstract: Provided is an electroosmotic pump including a housing including a shaft hole, a membrane disposed between a first space arranged in a direction away from the shaft hole and a second space adjacent to the shaft hole, a first electrode body and a second electrode body arranged at opposite sides based on the membrane, a shaft extending to an outside of the housing through the shaft hole, and a first fluid included in an internal space of the housing.

Abstract: A module and method for linking information of a plurality of driving units, and a module and method for linking driving units of a robot system in which a master controls a plurality of driving units included in a plurality of slave devices through communication are provided. The module and method for linking driving units of a robot system provide compatibility with an existing robot motion table that uses one driving unit for one device without requiring a separate conversion operation.

Abstract: A display device includes: a first pixel electrode comprising a first reflective electrode in a first emission area, a first light transmitting pattern on the first reflective electrode, and a first light transmitting electrode on the first reflective electrode and the first light transmitting pattern and connected to the first reflective electrode; a second pixel electrode comprising a second reflective electrode in a second emission area and a second light transmitting electrode on the second reflective electrode; a light emitting stack on the first and second pixel electrodes and comprising at least one light emitting layer; a common electrode on the light emitting stack; and a bank pattern surrounding the first and second emission areas, and having at least a portion between the first emission area and the second emission area, wherein the first light transmitting pattern and the bank pattern contain a same material and are spaced apart.

Abstract: The present disclosure provides a needle assembly and a drug injection device including a needle, a cannula into which the needle is inserted, a first holder supporting the needle, a second holder disposed to face one side of the first holder and supporting the cannula, a sleeve accommodating the first holder in an inner space and rotating with respect to the first holder, and an elastic member disposed between the first holder and the sleeve, wherein, when the sleeve is rotated, the elastic member is expanded and the first holder and the second holder are moved to an extended position, and wherein, when the sleeve is further rotated, the elastic member is contracted and only the first holder is returned to an original position.

Abstract: A light emitting element may include a light emitting stack pattern including a first semiconductor layer, an active layer, and a second semiconductor layer. An insulating film may surround an outer circumferential surface of the light emitting stack pattern. The insulating film may include a first layer, a second layer surrounding the first layer, and a third layer surrounding the second layer. The first layer and the third layer may include a same material.

Abstract: Provided is an electroosmotic pump including a housing including a shaft hole, a membrane disposed between a first space arranged in a direction away from the shaft hole and a second space adjacent to the shaft hole, a first electrode body and a second electrode body arranged at opposite sides based on the membrane, a shaft extending to an outside of the housing through the shaft hole, and a first fluid included in an internal space of the housing.

Abstract: The present invention presents a single wafer-type wafer cleaning device and a single wafer-type method for controlling the surface roughness of a wafer, in which, in a wafer cleaning process, mutually different cleaning processes are carried out on the respective two sides of a wafer, and also, mutually different chemicals are used depending on the side of the wafer being cleaned, thereby enabling the respective roughness of the two sides to differ. The single wafer-type wafer cleaning device comprises a spin chamber, a first chemical supply device, a second chemical supply device and a third chemical supply device.

Abstract: A display device includes a light emitting element disposed on a substrate and including a first end portion and a second end portion. The first electrode is electrically connected to the first end portion of the light emitting element. The second electrode is electrically connected to the second end portion of the light emitting element. A first semiconductor layer, a light emitting layer, a second semiconductor layer, and an electrode layer of the light emitting element are sequentially disposed along a longitudinal direction from the second end portion to the first end portion. An insulating film of the light emitting element covers side surfaces of the first semiconductor layer, the light emitting layer, the second semiconductor layer, and the electrode layer, and extends in parallel to the longitudinal direction. A shielding layer is disposed inside the insulating film.

Abstract: A multilayer capacitor includes a body including a dielectric layer and a plurality of internal electrodes stacked on one another with the dielectric layer interposed therebetween, and external electrodes disposed externally on the body, and each connected to the plurality of internal electrodes, wherein at least one of the plurality of internal electrodes includes an alloy region formed in a region in contact with a corresponding external electrode of the external electrodes, and the alloy region includes a nickel (Ni)-chromium (Cr) alloy.

Abstract: An embodiment vehicle dash crossmember includes a cross portion extending in a width direction of a vehicle body, a front portion protruding from the cross portion toward a front of the vehicle body, and a pair of outrigger portions provided at both ends of the cross portion, respectively, wherein the cross portion, the front portion, and the pair of outrigger portions define a unitary one-piece structure.

Abstract: An organic light emitting diode (OLED) and an organic light emitting device (e.g., a display device or a lighting device) thereof are described. The OLED comprises a first electrode, a second electrode, a first emitting part (including a first hole transporting layer (HTL) and a first emitting material layer (EML), positioned between the first and second electrodes); and a second emitting part (including a second EML and positioned between the first emitting part and the second electrode). The first EML is a blue EML, and the second EML includes at least one of a red EML and a blue EML. The first hole HTL includes a high refractive layer having a first refractive index, and a low refractive layer having a second refractive index, positioned between the high refractive layer and the first EML, where the second refractive index is smaller than the first refractive index.

Abstract: An organic light emitting diode (OLED) and an organic light emitting device comprising the OLED (e.g., a display device or a lighting device) are described. The OLED can include a first blue emitting material layer including a first host, and a second blue emitting material layer including a second host, disposed between two electrodes. The OLED includes two blue emitting material layers so that an exciton recombination zone is distributed within the blue emitting material layers irrespective of current density or gradation. As the amount of non-emitting excitons accumulated outside of the emitting material layers is minimized, the driving voltage of the OLED can be lowered, and the luminous efficiency and the luminous lifespan of the OLED can be improved.

Abstract: An organic light emitting diode (OLED) and an organic light emitting device comprising the OLED (e.g., a display device or a lighting device) are described. The OLED can include a blue emitting material layer including plural hosts with adjusted energy levels. A HOMO energy barrier between the at least one blue emitting material layer and at least one hole transport layer and/or electron blocking layer can be minimized. Holes generated at an anode or a P-type charge generation layer can be injected rapidly into the at least one blue emitting material layer without accumulating at an interface between the hole transport layer and/or the electron blocking layer, and the at least one blue emitting material layer. As the amount of non-emitting holes is minimized, the driving voltage of the OLED can be lowered, and the luminous efficiency and the luminous lifespan of the OLED can be improved.

Abstract: An organic light emitting diode (OLED) and an organic light emitting device comprising the OLED are described. The OLED can comprise a first electrode; a second electrode facing the first electrode; and a first emitting part (including a first blue emitting layer and a second blue emitting layer), which is positioned between the first and second electrode. The second blue emitting layer is positioned between the first blue emitting layer and the second electrode and contacting the first blue emitting layer. The first blue emitting layer includes a first host and a first dopant, and the second blue emitting layer includes a second host and a second dopant, wherein the first host is a pyrene derivative, and the second host is an anthracene derivative. An organic light emitting device can include the OLED, and can be a display device or a lighting device.

Abstract: Embodiments in accordance with the present inventive concept disclose a chip bonding apparatus that includes a stage configured to support a substrate and a heater that is disposed above the stage. The heater includes a heat generating portion and a body portion. The chip bonding apparatus further includes a bonding tool assembly fixing unit having a first portion connected to the body portion of the heater, and a second portion configured to receive the heat generating portion. The chip bonding apparatus further includes a first bonding tool connected to the heat generating portion; and a first bonding tool fixing unit having a third portion that is connected to the first portion, and a fourth portion configured to receive the first bonding tool. The bonding tool fixing unit may be attached by an electrostatic force or by coupling between a notch gripper and a corresponding notch.

Abstract: Embodiments in accordance with the present inventive concept disclose a chip bonding apparatus that includes a stage configured to support a substrate and a heater that is disposed above the stage. The heater includes a heat generating portion and a body portion. The chip bonding apparatus further includes a bonding tool assembly fixing unit having a first portion connected to the body portion of the heater, and a second portion configured to receive the heat generating portion. The chip bonding apparatus further includes a first bonding tool connected to the heat generating portion; and a first bonding tool fixing unit having a third portion that is connected to the first portion, and a fourth portion configured to receive the first bonding tool. The bonding tool fixing unit may be attached by an electrostatic force or by coupling between a notch gripper and a corresponding notch.

Abstract: A bonding apparatus includes a detecting unit configured to determine whether a bonding head and a stage, on which a package substrate is disposed, are sufficiently parallel to each other during a bonding process, wherein the bonding head is configured to bond a semiconductor chip to the package substrate, and a correcting unit configured to adjust at least one of the bonding head or the stage based on the determination of the detecting unit during the bonding process.

Abstract: Semiconductor module testing equipment includes a test board, a plurality of pipe structures extending from an upper surface of the test board in a first direction and spaced apart from one another in a second direction that intersects the first direction, wherein the first and second directions are substantially parallel to a plane of the test board, at least one semiconductor module socket disposed between a pair of neighboring pipe structures of the plurality of pipe structures, and a plurality of nozzles disposed on each pipe structure of the plurality of pipe structures, wherein the plurality of nozzles is configured to discharge a fluid laterally.

Abstract: A bonding apparatus can include a console which controls bonding of at least one wire, a first bonding unit disposed on the console to bond a first wire to a first substrate, a second bonding unit disposed on the first bonding unit to bond a second wire to a second substrate different from the first substrate, and a vibration damping unit connected to the second bonding unit preventing vibrations generated in the second bonding unit from transmitting to the first bonding unit.