Abstract: An electromagnetic relay is disclosed. The electromagnetic relay comprises a coil, a yoke having a yoke face, and an armature. The armature has an armature face facing the yoke face and movable, depending on a current through the coil, between an open position and a closed position in which the armature face is positioned closer to the yoke face, and an overlap disposed over a side surface of the yoke. A first distance between the side surface of the yoke and the overlap is smaller than a smallest second distance between the armature face and the yoke face in the open position.

Abstract: An electromagnetic relay is disclosed. The electromagnetic relay comprises a coil, a yoke having a yoke face, and an armature. The armature has an armature face facing the yoke face and movable, depending on a current through the coil, between an open position and a closed position in which the armature face is positioned closer to the yoke face, and an overlap disposed over a side surface of the yoke. A first distance between the side surface of the yoke and the overlap is smaller than a smallest second distance between the armature face and the yoke face in the open position.

Abstract: A semiconductor module is disclosed, including a substrate and at least one semiconductor component in bottom contact with the substrate. The semiconductor component including a main current branch sandwiched between the bottom and top of the semiconductor component. The side edges of a barrier layer zone coincide with the side edge portions of the semiconductor component between the top and the bottom. The space above the substrate and to the side of the semiconductor component is packed with an insulating compound at least up to the level of the top of the semiconductor component. Topping the semiconductor component and parallel thereto is a patterned or unpatterned metallization connected to a contact pad on the top of the semiconductor component.

Abstract: A semiconductor module is disclosed, including a substrate and at least one semiconductor component in bottom contact with the substrate. The semiconductor component including a main current branch sandwiched between the bottom and top of the semiconductor component. The side edges of a barrier layer zone coincide with the side edge portions of the semiconductor component between the top and the bottom. The space above the substrate and to the side of the semiconductor component is packed with an insulating compound at least up to the level of the top of the semiconductor component. Topping the semiconductor component and parallel thereto is a patterned or unpatterned metallization connected to a contact pad on the top of the semiconductor component.