Abstract: A conductive resin composition which has electrical conductivity and antistatic property, is excellent in heat resistance and processability, and comprises:(A) from 50 to 95% by weight of a polyphenylene ether resin,(B) from 50 to 5% by weight of a copolymer of a styrenic compound and an .alpha.,.beta.-unsaturated dicarboxylic acid imide compound,(C) from 5 to 30 parts by weight of a conductive carbon per 100 parts by weight of the sum of the resin (A) and the copolymer (B), and (D) from 1 to 20 parts by weight of a low molecular weight polystyrene per 100 parts by weight of the sum of the resin (A) and the copolymer (B).

Abstract: A molding material for electroconductive IC parts is here provided which has a preferable heat distortion temperature (heat resistance) and a desirable melt flow index (moldability) and which supplies molded articles having a suitable surface specific resistance. The above-mentioned molding material comprises 50% by weight or more of a polyphenylene ether resin, electroconductive carbon, an acid imide compound which can be used depending upon an intrinsic viscosity of the polyphenylene ether resin, a high-impact polystyrene resin and an A--B--A' type block copolymer elastomer.