Patents by Inventor Ines Thummel

Ines Thummel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for clamping a semiconductor device in a manufacturing process
    Patent number: 6593254
    Abstract: There is disclosed a method for clamping a semiconductor wafer, preferably suitable for a wafer with a diameter of 300 mm or larger. After depositing at least one encapsulating material layer over the front side and backside of the wafer, the material layer over the front side of the wafer is etched selectively to form a predetermined structure in following process steps. Wafer warpage is caused as a result of unequal wafer bowing stress of the material layer. By removing the material layer over the backside of the wafer partially or completely in accordance with the desired reduction of the bowing stress wafer warpage is reduced. In a further course of the manufacturing process, the semiconductor device is clamped electrostatically, physically or by use of vacuum.
    Type: Grant
    Filed: March 28, 2002
    Date of Patent: July 15, 2003
    Assignee: Infineon Technologies AG
    Inventors: Manfred Kraxenberger, Ines Thümmel, Bruno Spuler, Thorsten Schedel, Karl Mautz
  • Method for clamping a semiconductor device in a manufacturing process
    Publication number: 20020132393
    Abstract: There is disclosed a method for clamping a semiconductor wafer, preferably suitable for a wafer with a diameter of 300 mm or larger. After depositing at least one encapsulating material layer over the front side and backside of the wafer, the material layer over the front side of the wafer is etched selectively to form a predetermined structure in following process steps. Wafer warpage is caused as a result of unequal wafer bowing stress of the material layer. By removing the material layer over the backside of the wafer partially or completely in accordance with the desired reduction of the bowing stress wafer warpage is reduced. In a further course of the manufacturing process, the semiconductor device is clamped electrostatically, physically or by use of vacuum.
    Type: Application
    Filed: March 28, 2002
    Publication date: September 19, 2002
    Inventors: Manfred Kraxenberger, Ines Thummel, Bruno Spuler, Thorsten Schedel, Karl Mautz