Patents by Inventor Ing-Jer Chiou

Ing-Jer Chiou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250040078
    Abstract: A heat dissipation module adapted for an electronic device with a fan is provided. The heat dissipation module includes a vapor chamber and a communicating pipe. The vapor chamber has a first cavity having an evaporating area and a second cavity communicated with the first cavity. The communicating pipe includes a first pipe and a second pipe communicated with the first pipe, wherein the first pipe is communicated with the first cavity, and the second pipe is communicated with the second cavity. An inner wall surface of the first pipe is a smooth surface, and an inner wall surface of the second pipe is provided with a wick structure. The first cavity, the second cavity and the communicating pipe surround and form a hollow area, wherein the fan is adapted for being disposed in the hollow area, and an air outlet of the fan faces the second pipe.
    Type: Application
    Filed: October 2, 2023
    Publication date: January 30, 2025
    Applicant: ASUSTeK COMPUTER INC.
    Inventor: Ing-Jer Chiou
  • Publication number: 20250027726
    Abstract: A loop type heat dissipation structure includes a heat pipe, a communicating pipe, and working fluid. The heat pipe includes a pipeline, a capillary structure, and a first barrier body. The pipeline has a first evaporation section, a first condensation section, an outlet, and an inlet. The outlet is located at an edge of the first evaporation section, and the inlet is located at an edge of the first condensation section. The capillary structure is distributed on an inner wall surface of the pipeline and extends from the first condensation section to the first evaporation section. The first barrier body is disposed in the first condensation section and is connected to the capillary structure. One end of the communicating pipe is communicated with the outlet, and the other end of the communicating pipe is communicated with the inlet. The working fluid flows in the heat pipe and the communicating pipe.
    Type: Application
    Filed: September 8, 2023
    Publication date: January 23, 2025
    Applicant: ASUSTeK COMPUTER INC.
    Inventor: Ing-Jer Chiou
  • Patent number: 12188483
    Abstract: The disclosure provides a centrifugal fan including a housing and a blade module. The housing includes a lower cover, a side wall, and an upper cover. Two ends of the side wall are respectively connected to the lower cover and the upper cover to define an internal space. The lower cover includes a plurality of lower air inlets. The blade module is arranged in the internal space, and includes a hub and a plurality of blades. The hub is rotatably arranged on the lower cover. The blades are arranged around the hub. The lower air inlets are located on the periphery of the hub, and each lower air inlet includes an outer edge relative to a rotational axis of the hub. At least one of two ends of at least one of the lower air inlets includes a protruding portion at a position corresponding to the outer edge.
    Type: Grant
    Filed: March 3, 2023
    Date of Patent: January 7, 2025
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Hsin Chen Lin, Ing-Jer Chiou
  • Publication number: 20240284610
    Abstract: A heat insulation pad applied to an electronic device is provided. The electronic device includes a housing and a heat source. The housing includes an inner side surface. The heat insulation pad includes a first contact layer, a second contact layer, and a hole layer stack structure. The first contact layer is adapted to attach to the inner side surface. The second contact layer is adapted to contact the heat source. The hole layer stack structure includes a plurality of hole layers stacked in sequence and is located between the first contact layer and the second contact layer. An electronic device with the heat insulation pad is further provided.
    Type: Application
    Filed: June 2, 2023
    Publication date: August 22, 2024
    Inventors: Yu-Jung LIN, Ing-Jer CHIOU, Cheng-Yu WANG
  • Patent number: 12066031
    Abstract: A fan module includes a hub, a plurality of fan blades, and a ring frame. The hub is configured to rotate about a central axis. The plurality of fan blades surround the hub. Each of the plurality of fan blades includes a first end portion connected to the hub and a second end portion opposite to the first end portion. The ring frame is connected to the second end portion of each of the plurality of fan blades. The ring frame includes a first surface facing the plurality of fan blades and a second surface opposite to the first surface, and the first surface is a curved surface.
    Type: Grant
    Filed: April 9, 2023
    Date of Patent: August 20, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Hsin-Chen Lin, Ing-Jer Chiou
  • Publication number: 20240268043
    Abstract: A foldable electronic device is provided, including a first body and a second body. The first body includes a front surface and a rear surface. The second body is arranged at the rear surface and includes a support portion. A system is arranged in the support portion. The support portion is used for being switched between a folded position and a supporting position. When the support portion is located at the folded position, the support portion abuts against the rear surface. When the support portion is located at the supporting position, an open space is formed between the support portion and the rear surface.
    Type: Application
    Filed: April 18, 2023
    Publication date: August 8, 2024
    Inventor: Ing-Jer CHIOU
  • Patent number: 12055157
    Abstract: A centrifugal fan includes upper and lower covers, a fan frame, and a fan blade module. The fan frame is located between the lower and upper covers. The fan frame, and the lower and upper covers form a space. The fan blade module disposed in the space includes a hub, a connecting ring, inner and outer ring blades. The connecting ring surrounding the hub forms an inner ring region and an outer ring region around the hub and has a ring height and a ring width greater than the ring height. The inner ring blades are connected to the hub and the connecting ring, and circularly arranged in the inner ring region. The outer ring blades are connected to the connecting ring, and circularly arranged in the outer ring region. A quantity of the outer ring blades is greater than a quantity of the inner ring blades.
    Type: Grant
    Filed: June 12, 2023
    Date of Patent: August 6, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Hsin Chen Lin, Ing-Jer Chiou
  • Patent number: 12009275
    Abstract: A heat transfer device is provided. The heat transfer device includes a first heat conduction sheet and a second heat conduction sheet. The first heat conduction sheet includes two first rigid parts and a first bendable part connected between the two first rigid parts. The second heat conduction sheet includes two second rigid parts and a second bendable part connected between the two second rigid parts. The two first rigid parts are thermally coupled to the two second rigid parts, respectively. The first bendable portion includes a nonlinear section.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: June 11, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Hsin-Chen Lin, Ing-Jer Chiou
  • Publication number: 20240102483
    Abstract: A fan module includes a hub, a plurality of fan blades, and a ring frame. The hub is configured to rotate about a central axis. The plurality of fan blades surround the hub. Each of the plurality of fan blades includes a first end portion connected to the hub and a second end portion opposite to the first end portion. The ring frame is connected to the second end portion of each of the plurality of fan blades. The ring frame includes a first surface facing the plurality of fan blades and a second surface opposite to the first surface, and the first surface is a curved surface.
    Type: Application
    Filed: April 9, 2023
    Publication date: March 28, 2024
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Hsin-Chen Lin, Ing-Jer Chiou
  • Patent number: 11903162
    Abstract: The disclosure provides a fan control method, applied to an electronic device. The electronic device includes a fan and a setting unit, the setting unit having a plurality of setting values, and each setting value being corresponding to a sampling number. The fan control method includes: continuously detecting a temperature of a heat source to obtain a plurality of temperature values; selecting one of the plurality of setting values based on variations of the temperature values; acquiring a value set from the temperature values based on the sampling number corresponding to the selected setting value, and generating an updated temperature value based on the value set; and controlling rotation of the fan based on the updated temperature value.
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: February 13, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Hsin-Chen Lin, Ing-Jer Chiou
  • Publication number: 20240035486
    Abstract: The disclosure provides a centrifugal fan including a housing and a blade module. The housing includes a lower cover, a side wall, and an upper cover. Two ends of the side wall are respectively connected to the lower cover and the upper cover to define an internal space. The lower cover includes a plurality of lower air inlets. The blade module is arranged in the internal space, and includes a hub and a plurality of blades. The hub is rotatably arranged on the lower cover. The blades are arranged around the hub. The lower air inlets are located on the periphery of the hub, and each lower air inlet includes an outer edge relative to a rotational axis of the hub. At least one of two ends of at least one of the lower air inlets includes a protruding portion at a position corresponding to the outer edge.
    Type: Application
    Filed: March 3, 2023
    Publication date: February 1, 2024
    Inventors: Hsin Chen LIN, Ing-Jer CHIOU
  • Patent number: 11859627
    Abstract: A fan control system includes a fan, a first temperature sensor, a calculating unit, a logic controller, and a memory unit. The first temperature sensor continuously senses temperatures of a device during a time period, in order to obtain a plurality of sampled temperatures. The calculating unit selects N1 latest sampled temperatures and N2 latest sampled temperatures from the sampled temperatures, and calculates a first average temperature according to the N1 sampled temperatures and a second average temperature according to the N2 sampled temperatures. N1 and N2 are positive integers. The logic controller is configured to select one of the first average temperature and the second average temperature to output as a compensation temperature. The memory unit is configured to store an operating table, and configured to output a rotational speed control signal to the fan corresponding to the operating table according to the compensation temperature.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: January 2, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Hsin-Chen Lin, Ing-Jer Chiou
  • Patent number: 11859633
    Abstract: Provided is a centrifugal fan. The centrifugal fan includes an air inlet, a shaft, and a plurality of blades. The blades are arranged around the shaft. Each of the blades includes an air guiding portion on a side of the blade facing the air inlet. The air guiding portion includes a first curve and a second curve. An air inflow channel is formed between the first curve and the second curve of two adjacent air guiding portions respectively. A width of the air inflow channel is expanded in a direction away from the air inlet according to an expanding ratio.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: January 2, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Hsin Chen Lin, Ing-Jer Chiou
  • Publication number: 20230264261
    Abstract: A manufacturing method of thermal paste is provided. The manufacturing method includes: providing a base material; heating a metal material to a liquid state, to generate a liquid metal material; sieving the liquid metal material to generate a metal powder material; adding a dispersant to the metal powder material and mixing to generate a mixed powder material; and mixing the mixed powder material and the base material.
    Type: Application
    Filed: September 30, 2022
    Publication date: August 24, 2023
    Inventors: Fei Lin YANG, Ing-Jer CHIOU
  • Patent number: 11690198
    Abstract: An electronic device is provided. The electronic device includes a first body, a second body, and a baffle structure. The first body includes a first edge. The second body includes a second edge. The first edge is pivotally connected to the second edge, and an air outlet is provided on the second edge. An air duct is formed between the first edge and the second edge. The baffle structure is disposed in the air duct and located at a position corresponding to the air outlet. The baffle structure selectively closes the air duct according to a temperature of the air outlet, to avoid a rising temperature inside the electronic device due to hot air backflow.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: June 27, 2023
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Yi-Chi Lai, Ing-Jer Chiou, Sung-Chuan Huang
  • Publication number: 20230167828
    Abstract: Provided is a centrifugal fan. The centrifugal fan includes an air inlet, a shaft, and a plurality of blades. The blades are arranged around the shaft. Each of the blades includes an air guiding portion on a side of the blade facing the air inlet. The air guiding portion includes a first curve and a second curve. An air inflow channel is formed between the first curve and the second curve of two adjacent air guiding portions respectively. A width of the air inflow channel is expanded in a direction away from the air inlet according to an expanding ratio.
    Type: Application
    Filed: July 7, 2022
    Publication date: June 1, 2023
    Inventors: Hsin Chen LIN, Ing-Jer CHIOU
  • Patent number: 11536295
    Abstract: A centrifugal fan includes a housing and an impeller. The housing includes a sidewall, and the sidewall includes a tongue portion. The impeller includes a fan hub and a plurality of blades. The fan hub is rotatably disposed in the housing, and the tongue portion has an inner contour line on a reference plane. The blades connect to the fan hub. Each one of the blades has an end surface facing the sidewall. The end surface has an outer contour line on the section of the blade. Any two adjacent blades have different outer contour lines. The outer contour line of at least one first blade of the plurality of blades is parallel to the inner contour line. The outer contour line of at least one second blade of the plurality of blades is not parallel to the inner contour line.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: December 27, 2022
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Hsin-Chen Lin, Ing-Jer Chiou
  • Publication number: 20220330455
    Abstract: An electronic device is provided. The electronic device includes a first body, a second body, and a baffle structure. The first body includes a first edge. The second body includes a second edge. The first edge is pivotally connected to the second edge, and an air outlet is provided on the second edge. An air duct is formed between the first edge and the second edge. The baffle structure is disposed in the air duct and located at a position corresponding to the air outlet. The baffle structure selectively closes the air duct according to a temperature of the air outlet, to avoid a rising temperature inside the electronic device due to hot air backflow.
    Type: Application
    Filed: February 22, 2022
    Publication date: October 13, 2022
    Inventors: Yi-Chi LAI, Ing-Jer CHIOU, Sung-Chuan HUANG
  • Publication number: 20220240415
    Abstract: The disclosure provides a fan control method, applied to an electronic device. The electronic device includes a fan and a setting unit, the setting unit having a plurality of setting values, and each setting value being corresponding to a sampling number. The fan control method includes: continuously detecting a temperature of a heat source to obtain a plurality of temperature values; selecting one of the plurality of setting values based on variations of the temperature values; acquiring a value set from the temperature values based on the sampling number corresponding to the selected setting value, and generating an updated temperature value based on the value set; and controlling rotation of the fan based on the updated temperature value.
    Type: Application
    Filed: January 21, 2022
    Publication date: July 28, 2022
    Inventors: Hsin-Chen LIN, Ing-Jer CHIOU
  • Patent number: 11268535
    Abstract: A fan module includes a hub, a first body and a second body. The hub is configured to rotate along a central axis. The first body is connected to an outer wall of the hub. The second body is sleeved on the outer wall of the hub. The second body includes a plurality of ribs. The ribs are disposed on an inner wall of the second body and abut against the outer wall of the hub.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: March 8, 2022
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Hsin-Chen Lin, Ing-Jer Chiou