Abstract: A loop type heat dissipation structure includes a heat pipe, a communicating pipe, and working fluid. The heat pipe includes a pipeline, a capillary structure, and a first barrier body. The pipeline has a first evaporation section, a first condensation section, an outlet, and an inlet. The outlet is located at an edge of the first evaporation section, and the inlet is located at an edge of the first condensation section. The capillary structure is distributed on an inner wall surface of the pipeline and extends from the first condensation section to the first evaporation section. The first barrier body is disposed in the first condensation section and is connected to the capillary structure. One end of the communicating pipe is communicated with the outlet, and the other end of the communicating pipe is communicated with the inlet. The working fluid flows in the heat pipe and the communicating pipe.

Abstract: Provided is a heat dissipation mechanism for a laptop computer. The laptop computer includes at least one heat source. The heat dissipation mechanism includes a vapor chamber, multiple columns, a capillary structure, a working fluid, multiple first fins, and at least one fan. The vapor chamber has a first surface and a second surface opposite to each other. A first chamber is formed between the first surface and the second surface. The second surface contacts the heat source. The columns are formed by the second surface protruding outward. Each of the columns has a second chamber, communicating with the first chamber to form a closed chamber body. The capillary structure is disposed on wall surfaces of the first chamber and the second chamber. The working fluid is filled in the first chamber and the second chamber.

Abstract: A heat dissipation module adapted for an electronic device with a fan is provided. The heat dissipation module includes a vapor chamber and a communicating pipe. The vapor chamber has a first cavity having an evaporating area and a second cavity communicated with the first cavity. The communicating pipe includes a first pipe and a second pipe communicated with the first pipe, wherein the first pipe is communicated with the first cavity, and the second pipe is communicated with the second cavity. An inner wall surface of the first pipe is a smooth surface, and an inner wall surface of the second pipe is provided with a wick structure. The first cavity, the second cavity and the communicating pipe surround and form a hollow area, wherein the fan is adapted for being disposed in the hollow area, and an air outlet of the fan faces the second pipe.

Abstract: A manufacturing method of thermal paste is provided. The manufacturing method includes: providing a base material; heating a metal material to a liquid state, to generate a liquid metal material; sieving the liquid metal material to generate a metal powder material; adding a dispersant to the metal powder material and mixing to generate a mixed powder material; and mixing the mixed powder material and the base material.

Abstract: A heat dissipation module including a vapor chamber, an insulating tube, a condensing tube, and a wick member is provided. The vapor chamber has a first chamber and a second chamber communicated with each other. The insulating tube has a first channel and a first wick structure. The first channel is communicated with the first chamber, and a cross-sectional area of the first wick structure has a first proportion in a cross-sectional area of the first channel. The condensing tube has a second channel and a second wick structure. The second channel is communicated with the first channel and the second chamber, and a cross-sectional area of the second wick structure has a second proportion greater than the first proportion in a cross-sectional area of the second channel. The wick member is disposed in the second channel and located at a boundary between the condensing tube and the second chamber.

Abstract: A foldable electronic device is provided, including a first body and a second body. The first body includes a front surface and a rear surface. The second body is arranged at the rear surface and includes a support portion. A system is arranged in the support portion. The support portion is used for being switched between a folded position and a supporting position. When the support portion is located at the folded position, the support portion abuts against the rear surface. When the support portion is located at the supporting position, an open space is formed between the support portion and the rear surface.

Abstract: A centrifugal fan provided includes an upper cover, a lower cover, a fan frame, and a fan blade module. The upper cover has an upper air inlet with an upper air inlet radius. The fan blade module includes a hub, a connecting ring, a plurality of inner ring blades, and a plurality of outer ring blades. The connecting ring surrounds the hub and forms an inner ring region and an outer ring region around the hub. The plurality of inner ring blades is connected to the hub and the connecting ring and circularly arranged in the inner ring region. The plurality of outer ring blades is connected to the connecting ring and circularly arranged in the outer ring region. The connecting ring has an inner radius and an outer radius. The outer radius is greater than the upper air inlet radius. Two adjacent outer ring blades are of different shapes.

Abstract: A heat insulation pad applied to an electronic device is provided. The electronic device includes a housing and a heat source. The housing includes an inner side surface. The heat insulation pad includes a first contact layer, a second contact layer, and a hole layer stack structure. The first contact layer is adapted to attach to the inner side surface. The second contact layer is adapted to contact the heat source. The hole layer stack structure includes a plurality of hole layers stacked in sequence and is located between the first contact layer and the second contact layer. An electronic device with the heat insulation pad is further provided.

Abstract: A heat dissipation module adapted for an electronic device with a fan is provided. The heat dissipation module includes a vapor chamber and a communicating pipe. The vapor chamber has a first cavity having an evaporating area and a second cavity communicated with the first cavity. The communicating pipe includes a first pipe and a second pipe communicated with the first pipe, wherein the first pipe is communicated with the first cavity, and the second pipe is communicated with the second cavity. An inner wall surface of the first pipe is a smooth surface, and an inner wall surface of the second pipe is provided with a wick structure. The first cavity, the second cavity and the communicating pipe surround and form a hollow area, wherein the fan is adapted for being disposed in the hollow area, and an air outlet of the fan faces the second pipe.

Abstract: A loop type heat dissipation structure includes a heat pipe, a communicating pipe, and working fluid. The heat pipe includes a pipeline, a capillary structure, and a first barrier body. The pipeline has a first evaporation section, a first condensation section, an outlet, and an inlet. The outlet is located at an edge of the first evaporation section, and the inlet is located at an edge of the first condensation section. The capillary structure is distributed on an inner wall surface of the pipeline and extends from the first condensation section to the first evaporation section. The first barrier body is disposed in the first condensation section and is connected to the capillary structure. One end of the communicating pipe is communicated with the outlet, and the other end of the communicating pipe is communicated with the inlet. The working fluid flows in the heat pipe and the communicating pipe.

Abstract: The disclosure provides a centrifugal fan including a housing and a blade module. The housing includes a lower cover, a side wall, and an upper cover. Two ends of the side wall are respectively connected to the lower cover and the upper cover to define an internal space. The lower cover includes a plurality of lower air inlets. The blade module is arranged in the internal space, and includes a hub and a plurality of blades. The hub is rotatably arranged on the lower cover. The blades are arranged around the hub. The lower air inlets are located on the periphery of the hub, and each lower air inlet includes an outer edge relative to a rotational axis of the hub. At least one of two ends of at least one of the lower air inlets includes a protruding portion at a position corresponding to the outer edge.

Abstract: A heat insulation pad applied to an electronic device is provided. The electronic device includes a housing and a heat source. The housing includes an inner side surface. The heat insulation pad includes a first contact layer, a second contact layer, and a hole layer stack structure. The first contact layer is adapted to attach to the inner side surface. The second contact layer is adapted to contact the heat source. The hole layer stack structure includes a plurality of hole layers stacked in sequence and is located between the first contact layer and the second contact layer. An electronic device with the heat insulation pad is further provided.

Abstract: A fan module includes a hub, a plurality of fan blades, and a ring frame. The hub is configured to rotate about a central axis. The plurality of fan blades surround the hub. Each of the plurality of fan blades includes a first end portion connected to the hub and a second end portion opposite to the first end portion. The ring frame is connected to the second end portion of each of the plurality of fan blades. The ring frame includes a first surface facing the plurality of fan blades and a second surface opposite to the first surface, and the first surface is a curved surface.

Abstract: A foldable electronic device is provided, including a first body and a second body. The first body includes a front surface and a rear surface. The second body is arranged at the rear surface and includes a support portion. A system is arranged in the support portion. The support portion is used for being switched between a folded position and a supporting position. When the support portion is located at the folded position, the support portion abuts against the rear surface. When the support portion is located at the supporting position, an open space is formed between the support portion and the rear surface.

Abstract: A centrifugal fan includes upper and lower covers, a fan frame, and a fan blade module. The fan frame is located between the lower and upper covers. The fan frame, and the lower and upper covers form a space. The fan blade module disposed in the space includes a hub, a connecting ring, inner and outer ring blades. The connecting ring surrounding the hub forms an inner ring region and an outer ring region around the hub and has a ring height and a ring width greater than the ring height. The inner ring blades are connected to the hub and the connecting ring, and circularly arranged in the inner ring region. The outer ring blades are connected to the connecting ring, and circularly arranged in the outer ring region. A quantity of the outer ring blades is greater than a quantity of the inner ring blades.

Abstract: A heat transfer device is provided. The heat transfer device includes a first heat conduction sheet and a second heat conduction sheet. The first heat conduction sheet includes two first rigid parts and a first bendable part connected between the two first rigid parts. The second heat conduction sheet includes two second rigid parts and a second bendable part connected between the two second rigid parts. The two first rigid parts are thermally coupled to the two second rigid parts, respectively. The first bendable portion includes a nonlinear section.

Abstract: A fan module includes a hub, a plurality of fan blades, and a ring frame. The hub is configured to rotate about a central axis. The plurality of fan blades surround the hub. Each of the plurality of fan blades includes a first end portion connected to the hub and a second end portion opposite to the first end portion. The ring frame is connected to the second end portion of each of the plurality of fan blades. The ring frame includes a first surface facing the plurality of fan blades and a second surface opposite to the first surface, and the first surface is a curved surface.

Abstract: The disclosure provides a fan control method, applied to an electronic device. The electronic device includes a fan and a setting unit, the setting unit having a plurality of setting values, and each setting value being corresponding to a sampling number. The fan control method includes: continuously detecting a temperature of a heat source to obtain a plurality of temperature values; selecting one of the plurality of setting values based on variations of the temperature values; acquiring a value set from the temperature values based on the sampling number corresponding to the selected setting value, and generating an updated temperature value based on the value set; and controlling rotation of the fan based on the updated temperature value.

Abstract: The disclosure provides a centrifugal fan including a housing and a blade module. The housing includes a lower cover, a side wall, and an upper cover. Two ends of the side wall are respectively connected to the lower cover and the upper cover to define an internal space. The lower cover includes a plurality of lower air inlets. The blade module is arranged in the internal space, and includes a hub and a plurality of blades. The hub is rotatably arranged on the lower cover. The blades are arranged around the hub. The lower air inlets are located on the periphery of the hub, and each lower air inlet includes an outer edge relative to a rotational axis of the hub. At least one of two ends of at least one of the lower air inlets includes a protruding portion at a position corresponding to the outer edge.

Abstract: A fan control system includes a fan, a first temperature sensor, a calculating unit, a logic controller, and a memory unit. The first temperature sensor continuously senses temperatures of a device during a time period, in order to obtain a plurality of sampled temperatures. The calculating unit selects N1 latest sampled temperatures and N2 latest sampled temperatures from the sampled temperatures, and calculates a first average temperature according to the N1 sampled temperatures and a second average temperature according to the N2 sampled temperatures. N1 and N2 are positive integers. The logic controller is configured to select one of the first average temperature and the second average temperature to output as a compensation temperature. The memory unit is configured to store an operating table, and configured to output a rotational speed control signal to the fan corresponding to the operating table according to the compensation temperature.