Patents by Inventor Ing-Ping LEE

Ing-Ping LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-layer ceramic capacitor
    Patent number: 12712130
    Abstract: A multi-layer ceramic capacitor includes a multi-layer brick and first and second terminal electrodes. The multi-layer brick includes a ceramic body and plural first and second internal electrodes. The ceramic body has first and second surfaces opposite to each other, and first and second end surfaces opposite to each other. The first and second internal electrodes are alternately embedded in the ceramic body. The first and second internal electrodes respectively extend from the first and second end surfaces. The first terminal electrode extends through the first end surface to a first portion of the second surface, and includes a first stress buffer layer located inside the first terminal electrode under the first portion. The second terminal electrode extends through the second end surface to a second portion of the second surface, and includes a second stress buffer layer located inside the second terminal electrode under the second portion.
    Type: Grant
    Filed: July 2, 2024
    Date of Patent: August 18, 2026
    Assignee: YAGEO CORPORATION
    Inventors: Ming-Chun Wu, Hsin-Yen Liu, Fen-Sheng Hsu, Ing-Ping Lee
  • MULTI-LAYER CERAMIC CAPACITOR
    Publication number: 20250266211
    Abstract: A multi-layer ceramic capacitor includes a multi-layer brick and first and second terminal electrodes. The multi-layer brick includes a ceramic body and plural first and second internal electrodes. The ceramic body has first and second surfaces opposite to each other, and first and second end surfaces opposite to each other. The first and second internal electrodes are alternately embedded in the ceramic body. The first and second internal electrodes respectively extend from the first and second end surfaces. The first terminal electrode extends through the first end surface to a first portion of the second surface, and includes a first stress buffer layer located inside the first terminal electrode under the first portion. The second terminal electrode extends through the second end surface to a second portion of the second surface, and includes a second stress buffer layer located inside the second terminal electrode under the second portion.
    Type: Application
    Filed: July 2, 2024
    Publication date: August 21, 2025
    Inventors: Ming-Chun WU, Hsin-Yen LIU, Fen-Sheng HSU, Ing-Ping LEE