Patents by Inventor Ingeol LEE

Ingeol LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Three-dimensional integrated circuit
    Patent number: 10170398
    Abstract: Disclosed is a three-dimensional integrated circuit divided into a plurality of groups and capable of repairing failed through-silicon vias (TSVs). In particular, the three-dimensional integrated circuit includes a plurality of through-silicon vias (TSVs) vertically penetrating the three-dimensional integrated circuit and included in each of the groups, and two or more redundant through-silicon vias (RTSVs), wherein, when the number of failed TSVs in one group exceeds a repairable number, the failed TSVs exceeding the repairable number are repaired using at least one RTSV included in another group adjacent to the group.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: January 1, 2019
    Assignee: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
    Inventors: Sungho Kang, Dongho Kang, Ingeol Lee
  • THREE-DIMENSIONAL INTEGRATED CIRCUIT
    Publication number: 20170229381
    Abstract: Disclosed is a three-dimensional integrated circuit divided into a plurality of groups and capable of repairing failed through-silicon vias (TSVs). In particular, the three-dimensional integrated circuit includes a plurality of through-silicon vias (TSVs) vertically penetrating the three-dimensional integrated circuit and included in each of the groups, and two or more redundant through-silicon vias (RTSVs), wherein, when the number of failed TSVs in one group exceeds a repairable number, the failed TSVs exceeding the repairable number are repaired using at least one RTSV included in another group adjacent to the group.
    Type: Application
    Filed: February 2, 2017
    Publication date: August 10, 2017
    Applicant: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
    Inventors: Sungho KANG, Dongho KANG, Ingeol LEE