Abstract: A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-à-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit.

Abstract: An embodiment of the invention may include a sealing apparatus. The sealing apparatus may include a first component having a body, where the body has an outer surface and a first arm protruding from the outer surface. The first arm includes an inner surface facing the outer surface of the body. The sealing apparatus may include a second component engaged by the first arm of the first component. The second component may have a first portion arranged inside a space between the inner surface of the first arm and the outer surface of the body and a second portion arranged outside of the space and adjacent to an outer surface of the first arm.

Abstract: A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-à-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit.

Abstract: A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-à-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit.

Abstract: A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-à-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit.

Abstract: An air moisture control system for a computer system includes a housing with an air passage and an air moisture control element with an adsorption material, which is exposed in the air passage so as to enable fluid communication towards and from the air moisture control element. The element is designed such that the adsorption material is adapted, in operation, to adsorb moisture from a first air flow flowing into the air passage, having a first temperature and a first relative humidity, and desorb moisture to a second air flow, said air flow having a second temperature at least 5° C. higher than the first temperature and a second humidity at least 3% lower than the first relative humidity.

Abstract: An air moisture control system for a computer system includes a housing with an air passage and an air moisture control element with an adsorption material, which is exposed in the air passage so as to enable fluid communication towards and from the air moisture control element. The element is designed such that the adsorption material is adapted, in operation, to adsorb moisture from a first air flow flowing into the air passage, having a first temperature and a first relative humidity, and desorb moisture to a second air flow, said air flow having a second temperature at least 5° C. higher than the first temperature and a second humidity at least 3% lower than the first relative humidity.

Abstract: An air moisture control system for a computer system includes a housing with an air passage and an air moisture control element with an adsorption material, which is exposed in the air passage so as to enable fluid communication towards and from the air moisture control element. The element is designed such that the adsorption material is adapted, in operation, to adsorb moisture from a first air flow flowing into the air passage, having a first temperature and a first relative humidity, and desorb moisture to a second air flow, said air flow having a second temperature at least 5° C. higher than the first temperature and a second humidity at least 3% lower than the first relative humidity.

Abstract: An air moisture control system for a computer system includes a housing with an air passage and an air moisture control element with an adsorption material, which is exposed in the air passage so as to enable fluid communication towards and from the air moisture control element. The element is designed such that the adsorption material is adapted, in operation, to adsorb moisture from a first air flow flowing into the air passage, having a first temperature and a first relative humidity, and desorb moisture to a second air flow, said air flow having a second temperature at least 5° C. higher than the first temperature and a second humidity at least 3% lower than the first relative humidity.

Abstract: An embodiment of the invention may include a sealing apparatus. The sealing apparatus may include a first component having a body, where the body has an outer surface and a first arm protruding from the outer surface. The first arm includes an inner surface facing the outer surface of the body. The sealing apparatus may include a second component engaged by the first arm of the first component. The second component may have a first portion arranged inside a space between the inner surface of the first arm and the outer surface of the body and a second portion arranged outside of the space and adjacent to an outer surface of the first arm.

Abstract: Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic components and one or more coolant-carrying channels integrated within the module and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure, which includes a coolant inlet and outlet in fluid communication with the coolant-carrying channel(s) of the electronic module, facilitates flow of coolant through the coolant-carrying channel, and thus cooling of the electronic component(s). Coolant-absorbent material is positioned at the interface between the electronic module and the manifold structure to facilitate absorbing any excess coolant during a stepwise detaching of the manifold structure from the electronic module.

Abstract: Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic components and one or more coolant-carrying channels integrated within the module and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure, which includes a coolant inlet and outlet in fluid communication with the coolant-carrying channel(s) of the electronic module, facilitates flow of coolant through the coolant-carrying channel, and thus cooling of the electronic component(s). Coolant-absorbent material is positioned at the interface between the electronic module and the manifold structure to facilitate absorbing any excess coolant during a stepwise detaching of the manifold structure from the electronic module.

Abstract: Each pair of memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe. An example embodiment includes one pair of memory module sockets on opposite sides of the respective cooling pipe. An inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe. Heat is conducted from the second face of the memory module to the cooling pipe, such as from an outer plate in thermal engagement with an opposing second face of the memory modules and with the inner plate.