Abstract: A probe system includes a wafer cassette, a wafer processing device, a computer and a transfer assembly. The wafer cassette stores a plurality of wafers. The wafer processing device is configured to test the wafer. The computer stores a test recipe, displays a plurality of virtual wafers corresponding to the plurality of first wafer cassette, creates a first virtual wafer group by selecting one or more virtual wafers from the first virtual wafer group, wherein the first virtual wafer group corresponds to the test recipe, and issues a load command. The transfer assembly transfers a selected wafer, which is one of the plurality of wafers stored in the first wafer cassette corresponding to a first virtual wafer within the first virtual wafer group, to the wafer processing device according to the load command for testing, wherein the wafer processing device tests the selected wafer based on the test recipe.

Abstract: A method of positioning probe tips relative to pads includes: focusing on each of the probe tips in a first image as viewed by a microscope and collecting the coordinates of the corresponding probe tip relative to a first reference point in the first image; focusing on each of the pads in a second image as viewed by the microscope and collecting the coordinates of the corresponding pad relative to a second reference point in the second image, a relative position of the second reference point to the first reference point being predetermined; matching the pads with the probe tips when the quantity of the probe tips and the pads are equal while minimizing a maximum value of the distances calculated between each of the probe tips and the corresponding pad; and moving the probe tips to touch the pads with the maximum value minimized.