Abstract: A vibronic sensor for monitoring a flowable medium, comprising: an oscillator to which a medium surrounding the oscillator can be applied; at least one electromechanical transducer for exciting the oscillator to mechanical vibrations in accordance with driver signals and/or for outputting transducer signals that depend on vibrations of the oscillator; an operating and evaluating unit for providing the driver signals for driving the electromechanical transducer, for capturing the transducer signals, and for determining the presence, the density, and/or the viscosity of the medium in accordance with the transducer signals, wherein the operating and evaluating unit is designed to detect whether the medium in the pipe has a flow velocity above a limit value on the basis of time-varying modifications of the transducer signals.

Abstract: A vibronic sensor for monitoring a flowable medium, comprising: an oscillator to which a medium surrounding the oscillator can be applied; at least one electromechanical transducer for exciting the oscillator to mechanical vibrations in accordance with driver signals and/or for outputting transducer signals that depend on vibrations of the oscillator; an operating and evaluating unit for providing the driver signals for driving the electromechanical transducer, for capturing the transducer signals, and for determining the presence, the density, and/or the viscosity of the medium in accordance with the transducer signals, wherein the operating and evaluating unit is designed to detect whether the medium in the pipe has a flow velocity above a limit value on the basis of time-varying modifications of the transducer signals.

Abstract: An electronics housing with a circuit board in the interior of the electronics housing, fitted with electronics components on at least one first surface, said first surface facing a first wall of the electronics housing and the interior is filled with a thermally conducting sealing mass, at least between the first surface of the circuit board and the first wall. According to the invention, local overheating on the external housing surfaces may be avoided whereby a planar heat dissipater is arranged in the sealing mass, between the circuit board and the first wall, which has a higher specific heat conductivity than the sealing mass, whereby inhomogeneous temperature distributions along the surfaces of the first wall are reduced.