Abstract: An angular position sensor includes a stator element with at least three coils, a rotor element rotatably mounted with respect to the stator element, and an evaluation unit configured to determine an angle of rotation between the rotor element and stator element. The rotor element is configured to inductively couple with each of the at least three coils with varying strengths based on the angle of rotation. The evaluation unit is further configured to supply the coils with alternating voltage in a cyclical manner and in sequence, so that a first respective part of the coils is supplied with alternating voltage and a remaining part is de-energized. The evaluation unit is additionally configured, in a cyclical manner in sequence with one or more de-energized coils, to detect at least one of a respective phase and an amount of an induced alternating voltage, and to determine the angle of rotation therefrom.

Abstract: A sensor assembly for detecting a displacement in a contactless manner includes a target and a current sensor. The target includes a transmitter that moves along a measurement path and includes at least one measurement track and at least one correction track arranged together with the measurement track within a common geometry. The current sensor includes a measurement value sensor having at least two detection coils. At least one coil acts as a measurement coil, the signal of which is evaluated by a control unit to detect a displacement. At least one coil acts as a correction coil, the signal of which is evaluated by the control unit to correct the displacement detection. The control unit assigns a coil the measurement coil action if the corresponding coil is positioned over a first region or the correction coil action if the corresponding coil is positioned over a second region.

Abstract: A linear-displacement sensor includes a base element arranged with a sensor coil and an excitation coil in such a manner that an AC voltage is induced in the sensor coil upon application of an AC voltage to the excitation coil. An at least partly electrically conductive sliding element is configured to be shifted relative to the base element in a direction along the measurement path. The sliding element has a variable geometry along the measurement path to inductively couple partial turns of the sensor coil with the excitation coil. A correction coil is arranged above a geometry of the sliding element so that an inductive coupling of the correction coil and hence an amplitude of an AC voltage induced in the correction coil is dependent on a lateral offset of the sliding element in relation to the base element.

Abstract: A linear displacement sensor includes an induction element, measuring sensor element, and correction sensor element. The induction element has a first side with an electrically conductive measuring track running along a measurement path. The measuring sensor element is positioned over the first side, is movable relative to the induction element along the path, and includes a measuring coil positioned over the measuring track such that an overlap between the measuring coil and the measuring track changes along the path so that an induction of the measuring coil is dependent on a position of the measuring coil on the path. A second side of the induction element has an electrically conductive correction track running along the path. The correction sensor element is rigidly connected to the measuring sensor element, is positioned over the second side, and has a correction coil with a constant overlap with the correction track along the path.

Abstract: A miniature spectrometer includes an optical system, a polarization interferometer with a polarizer and a Savart element and an analyzer, a detection unit with a detector, and a data unit. The optical system of the miniature spectrometer is configured as a diffuser.

Abstract: A quantum random number generator is described as having a first single-photon detector that detects a first event, and a second single-photon detector that detects a second event, and as having an electronic circuit by way of which the first single-photon detector and the second single-photon detector are interconnected in such a way that after detection of the first event the latter is outputted and an output of a detected second event is suppressed.

Abstract: An arrangement of at least two wafers for detecting electromagnetic radiation, in particular far infrared radiation, comprises a first wafer and a second wafer. The first wafer includes a microsystem formed as a sensor array. The microsystem is configured to register electromagnetic radiation and provide a corresponding sensor signal. The second wafer includes an integrated circuit formed as an evaluation circuit that is coupled to the sensor array. The integrated circuit is configured to detect the electromagnetic radiation with the aid of the sensor signal provided.

Abstract: A linear-displacement sensor includes a base element arranged with a sensor coil and an excitation coil in such a manner that an AC voltage is induced in the sensor coil upon application of an AC voltage to the excitation coil. An at least partly electrically conductive sliding element is configured to be shifted relative to the base element in a direction along the measurement path. The sliding element has a variable geometry along the measurement path to inductively couple partial turns of the sensor coil with the excitation coil. A correction coil is arranged above a geometry of the sliding element so that an inductive coupling of the correction coil and hence an amplitude of an AC voltage induced in the correction coil is dependent on a lateral offset of the sliding element in relation to the base element.

Abstract: A miniature spectrometer includes an optical system, a polarization interferometer with a polarizer and a Savart element and an analyzer, a detection unit with a detector, and a data unit. The optical system of the miniature spectrometer is configured as a diffuser.

Abstract: An angular position sensor includes a stator element with at least three coils, a rotor element rotatably mounted with respect to the stator element, and an evaluation unit configured to determine an angle of rotation between the rotor element and stator element. The rotor element is configured to inductively couple with each of the at least three coils with varying strengths based on the angle of rotation. The evaluation unit is further configured to supply the coils with alternating voltage in a cyclical manner and in sequence, so that a first respective part of the coils is supplied with alternating voltage and a remaining part is de-energized. The evaluation unit is additionally configured, in a cyclical manner in sequence with one or more de-energized coils, to detect at least one of a respective phase and an amount of an induced alternating voltage, and to determine the angle of rotation therefrom.

Abstract: The present disclosure relates to a thermal sensor and a method for producing a thermal sensor of this type having a low signal-to-noise ratio at relatively high signal strengths. To this end, a thermoelectric generator is combined with a field effect transistor and a diode. Owing to its integrated diode and the barrier effect associated therewith, the thermal sensor is suitable for the economical and efficient design of imaging sensor arrays for converting thermal radiation into electrical signals.

Abstract: An infrared sensor device includes a semiconductor substrate, at least one sensor element that is micromechanically formed in the semiconductor substrate, and at least one calibration element, which is micromechanically formed in the semiconductor substrate, for the sensor element. An absorber material is arranged on the semiconductor substrate in the area of the sensor element and the calibration element. One cavern each is formed in the semiconductor substrate substantially below the sensor element and substantially below the calibration element. The sensor element and the calibration element are thermally and electrically isolated from the rest of the semiconductor substrate by the caverns. The infrared sensor device has high sensitivity, calibration functionality for the sensor element, and a high signal-to-noise ratio.

Abstract: A measurement bridge circuit includes a first branch and a second branch. The first branch contains a first resistor which is sensitive to measured variables and an invariable resistor connected in series. A first tap point is located between the first resistor and the invariable resistor. The second branch contains a second resistor which is sensitive to measured variables and a variable resistor arrangement connected in series. The variable resistor arrangement includes a first component having an invariable electrical resistance value and a second component having a variable electrical resistance value. The second component is connected in parallel with the first component in order to vary a total electrical resistance value for the variable resistor arrangement. A second tap point is located between the second resistor and the variable resistor arrangement.

Abstract: A sensor arrangement includes an infrared sensor and at least one acceleration sensor. The infrared sensor is configured to detect infrared radiation, and to output infrared image data. The at least one acceleration sensor is configured to detect an instantaneous acceleration of the sensor arrangement, and to output acceleration data. The output of the infrared image data from the infrared sensor is blocked when the instantaneous acceleration of the sensor arrangement exceeds a preprogrammed threshold value.

Abstract: The present disclosure relates to a thermal sensor and a method for producing a thermal sensor of this type having a low signal-to-noise ratio at relatively high signal strengths. To this end, a thermoelectric generator is combined with a field effect transistor and a diode. Owing to its integrated diode and the barrier effect associated therewith, the thermal sensor is suitable for the economical and efficient design of imaging sensor arrays for converting thermal radiation into electrical signals.

Abstract: An image pixel apparatus for detecting electromagnetic radiation includes an absorption structure device configured to absorb the electromagnetic radiation and to take it up as a quantity of heat. At least one plasmonic resonance structure device of the apparatus is configured to forward the electromagnetic radiation to the absorption structure device. A detection device that has at least one detection element is configured to detect the electromagnetic radiation by way of changes in an electrical property of the at least one detection element that are caused by the quantity of heat taken up.

Abstract: An infrared sensor device includes at least one sensor element formed in a semiconductor substrate, an SOI wafer that defines a gap below and around the sensor element, and a suspension device that is configured to suspend the sensor element in the SOI wafer. The sensor element is substantially arranged below the suspension device, thereby achieving a high sensitivity, low thermal capacity, low thermal coupling to the substrate and a high image refresh rate.

Abstract: A thermodiode element for a photosensor of a thermocamera usable for infrared radiation measurement includes a semiconductor substrate that has a first layer, and a second layer adjoining the first layer. The first layer has a base doping zone, and the second layer has a side doping zone that is the same doping type as the base doping zone. The second layer also has a further doping zone that is arranged as an island in the side doping zone and that has a doping type that is opposite to the doping type of the base doping zone. The base doping zone is further arranged in the first layer so as to adjoin the further doping zone.

Abstract: A method for monitoring at least one interior space of a building includes comparing recorded image data, which represent the at least one interior space, with reference data, which represent a reference situation, in order to generate monitoring information dependent on a comparison result. The monitoring information represents a monitoring-relevant situation in the at least one interior space.

Abstract: An arrangement of at least two wafers for detecting electromagnetic radiation, in particular far infrared radiation, comprises a first wafer and a second wafer. The first wafer includes a microsystem formed as a sensor array. The microsystem is configured to register electromagnetic radiation and provide a corresponding sensor signal. The second wafer includes an integrated circuit formed as an evaluation circuit that is coupled to the sensor array. The integrated circuit is configured to detect the electromagnetic radiation with the aid of the sensor signal provided.