Patents by Inventor Ingo Kalker

Ingo Kalker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for the non-galvanic tin plating of copper or copper alloys
    Patent number: 6821323
    Abstract: The invention describes a process for non-galvanic tin plating of copper and copper alloys by precipitation of tin from methanesulphonic acid and tin-containing electrolytes, containing a complexing agent. In describing a process by which a durable tin layer which can be soldered is a created, which, at the same time, prevents liberation of the base material, this invention discloses that the electrolytes have at least one foreign metal added to form a diffusion barrier in the layer.
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: November 23, 2004
    Assignee: Enthone Inc.
    Inventors: Jane Bell, Joachim Heyer, Jürgen Hupe, Ingo Kalker, Marlies Kleinfeld