Abstract: A circuit board arrangement having a circuit board with a contact strip formed on a side edge and with at least one electronic component, electrically connected to the circuit board, on each of the component sides, the outer contour of the circuit board arrangement being formed by an encapsulating case molded in one piece onto the circuit board and essentially enclosing the circuit board, and the contact strip protruding from the encapsulating case.

Abstract: Manufacturing method for an electronic component assembly and corresponding electronic component assembly The present invention provides a manufacturing method for an electronic component assembly and to a corresponding electronic component assembly.

Abstract: In a method for producing an integrated component, a carrier strip is provided with at least one arrangement of chips. A casting mold is placed over the carrier strip in such a way that the arrangement of chips is covered completely by at least one cavity of the casting mold. A protective layer is formed over the arrangement of microchips by filling the cavity with a liquefied encapsulating compound. The liquefied encapsulating compound transforms into a solid state upon cooling. The carrier strip with the protective layer can be ejected from the cavity by exerting a force onto a surface of the protective layer facing the cavity. The force is exerted onto at least one linearly extended surface region of the protective layer.