Abstract: Systems and methods for antimicrobial application and related data collection are described. In certain embodiments, the systems and methods of the present disclosure include calculating a dwell time or density of workpieces in a vessel; and modulating the one or more conditions of the system based on the dwell time or density of workpieces in the vessel.

Abstract: Provided are systems and methods for reducing bacterial count on a substrate, such as a foodstuff. The disclosed technology includes treating the substrate with an oxidizing treatment (peracetic acid, for example) followed by treating the substrate with an acidic treatment.

Abstract: The present disclosure provides systems and methods for treatment of substrates—such as foodstuffs—with a high pH composition and an oxidizer. These systems and methods give rise to enhanced disinfection performance.

Abstract: High green strength reactive hot melt adhesives are prepared using relatively low levels of reactive acrylic, and may be prepared with liquid crystalline or crystalline diols.

Abstract: A hot melt adhesive based on a functionalized metallocene polyethylene copolymer finds use in packaging applications where high heat resistance, as well as good cold tolerance, is required.

Abstract: Hot melt adhesives comprising a polar tackifier are triacetin resistant and particularly advantageous for use as a plug wrap sealing adhesive. Particularly preferred for use in the practice of the invention are hot melt adhesives comprising a rosin ester tackifier.

Abstract: A low application temperature hot met adhesive composition and its use in carton, case or tray formation comprising from about 5 to about 60 weight percent ethylene vinyl acetate with about 30 to about 50 weight percent VA content and having a melt index of about 700 to about 4,000 dg/min; a tackifier; and wax with a melting point of about 125 to about 180° F.

Abstract: A low application temperature hot met adhesive composition and its use in carton, case or tray formation comprising from about 5 to about 60 weight percent ethylene vinyl acetate with about 30 to about 50 weight percent VA content and having a melt index of about 700 to about 4,000 dg/min; a tackifier; and wax with a melting point of about 125 to about 180° F.

Abstract: High green strength reactive hot melt adhesives are prepared using relatively low levels of reactive acrylic, and may be prepared with liquid crystalline or crystalline diols.

Abstract: A bag formed utilizing a hot melt adhesives comprising (a) 20 to 70 parts ethylene/alpha olefin polymer having a melt index of 50 to 500 MI, a melt point of 71 to 90° C., a density of 0.885 to 0.90, a composition distribution breadth index greater than 50%, and Mw/Mn less than 6; (b) 10 to 50 parts tackifier; and (c) 0 to 30 parts wax.

Abstract: A cigarette filter, process to manufacture, wherein a low application temperature ethylene copolymer based hot melt adhesive is applied to porous and/or nonporous plugwrap paper. As used herein, low application temperatures are temperature between 200° F. and 300° F. (93° C. and 149° C.), preferably, 240° F. to 275° F. (115° C. to 135° C.).

Abstract: A cigarette filter, process to manufacture, wherein a low application temperature ethylene copolymer based hot melt adhesive is applied to porous and/or nonporous plugwrap paper. As used herein, low application temperatures are temperature between 200° F. and 300° F. (93° C. and 149° C.), preferably, 240° F. to 275° F. (115° C. to 135° C.).

Abstract: The present invention is directed to hot melt pressure sensitive adhesive compositions, that exhibit excellent adhesion properties and improved thermal stability, said compositions comprising:a) 1 to 30 parts of styrene-butadiene-styrene triblock copolymer;b) 1 to 30 parts of styrene-isoprene-styrene triblock copolymer;c) 5 to 50 parts of a tackifier compatible with the butadiene and isoprene midblocks, but not compatible with the styrene end blocks;d) 5 to 70 parts of a tackifier compatible with the butadiene and isoprene midblocks, and the styrene end blocks;e) 5 to 30 parts of a tackifier compatible with the styrene end blocks, but not compatible with the butadiene and isoprene midblocks;f) 5 to 30 parts oil; andg) 0 to 5 parts wax.

Abstract: A low application temperature hot met adhesive composition and its use in carton, case or tray formation comprising from ethylene vinyl acetate with greater than 30 weight percent VA and having a melt index of at least 700; a thermoplastic hydrocarbon resin derived from styrene, alpha-methylstyrene, and/or vinyltoluene, and polymers, copolymers and terpolymers thereof; a compatible adhesive promoting tackifier; and wax with a melting point of about 130 to 170 .degree. F.; and optionally comprising ethylene vinyl acetate with less than about 30 weight percent by weight of vinyl acetate and having a melt index of about 400 to 2500.