Patents by Inventor Inhee Yoo

Inhee Yoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250210570
    Abstract: A semiconductor package includes: a package substrate that includes a substrate pad; a semiconductor chip that is disposed on the package substrate, the semiconductor chip including a chip pad; a bonding wire that connects the substrate pad to the chip pad; an adhesive member between the package substrate and the semiconductor chip; and a dam that extends along a side surface of the adhesive member and surrounds at least some of side surfaces of the adhesive member. A height of the dam is greater than or equal to a height of the adhesive member.
    Type: Application
    Filed: July 24, 2024
    Publication date: June 26, 2025
    Inventors: Hakmin Kim, INHEE YOO
  • Publication number: 20250087636
    Abstract: A semiconductor package includes a package substrate including an insulating layer, an interconnection layer in the insulating layer, and interconnection pads on the insulating layer and electrically connected to the interconnection layer, first and second semiconductor chips on the package substrate and spaced apart from each other, first connection wires each extending from a first side of the first semiconductor chip to a second side of the second semiconductor chip and spaced apart from each other, an adhesive layer on the first and second semiconductor chips and covering at least a portion of each of the first connection wires, an upper semiconductor chip on the adhesive layer, second connection wires connecting the first and second semiconductor chips and the upper semiconductor chip to the interconnection layer of the package substrate, and an encapsulant on the package substrate and filling a space between the first and second semiconductor chips.
    Type: Application
    Filed: May 31, 2024
    Publication date: March 13, 2025
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Inhee YOO
  • Patent number: 11791314
    Abstract: Disclosed is a semiconductor package comprising a first semiconductor chip on a substrate, a second semiconductor chip between the substrate and the first semiconductor chip, and a spacer between the substrate and the first semiconductor chip. The substrate includes a first substrate pad between the second semiconductor chip and the spacer. The second semiconductor chip includes a chip pad and a signal wire. The spacer includes a first dummy pad on the spacer and a first dummy wire coupled to the first dummy pad. The first dummy pad is adjacent to the second semiconductor chip. The first semiconductor chip is attached to the second semiconductor chip and the spacer by an adhesive layer on the first semiconductor chip. A portion of each of the signal wire and the first dummy wire are in the adhesive layer.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: October 17, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seoeun Kyung, Inhee Yoo
  • Publication number: 20220149010
    Abstract: Disclosed is a semiconductor package comprising a first semiconductor chip on a substrate, a second semiconductor chip between the substrate and the first semiconductor chip, and a spacer between the substrate and the first semiconductor chip. The substrate includes a first substrate pad between the second semiconductor chip and the spacer. The second semiconductor chip includes a chip pad and a signal wire. The spacer includes a first dummy pad on the spacer and a first dummy wire coupled to the first dummy pad. The first dummy pad is adjacent to the second semiconductor chip. The first semiconductor chip is attached to the second semiconductor chip and the spacer by an adhesive layer on the first semiconductor chip. A portion of each of the signal wire and the first dummy wire are in the adhesive layer.
    Type: Application
    Filed: September 7, 2021
    Publication date: May 12, 2022
    Inventors: Seoeun Kyung, Inhee Yoo