Patents by Inventor In Jae YOO

In Jae YOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11994322
    Abstract: A refrigerator includes a main body having a storage compartment formed therein, and a cooling module forming a machine compartment in which a compressor is disposed and detachably mounted to the main body. The cooling module includes a module body forming the machine compartment, a condenser of an L shape disposed on one side of the compressor and including a first part corresponding to a portion of a rear surface of the machine compartment and a second part corresponding to one side of the machine compartment. The condenser is vertically mounted on a base plate disposed below the module body. A module cover is provided to cover the rear of the machine compartment, and a suction flow path includes first and second suction flow paths.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: May 28, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung Woo Yoo, Ju Young Kim, Kook Jeong Seo, Su-Cheol Yoo, Won-Jae Yoon
  • Patent number: 11996411
    Abstract: Embodiments disclosed herein include stacked forksheet transistor devices, and methods of fabricating stacked forksheet transistor devices. In an example, an integrated circuit structure includes a backbone. A first transistor device includes a first vertical stack of semiconductor channels adjacent to an edge of the backbone. A second transistor device includes a second vertical stack of semiconductor channels adjacent to the edge of the backbone. The second transistor device is stacked on the first transistor device.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Cheng-Ying Huang, Gilbert Dewey, Anh Phan, Nicole K. Thomas, Urusa Alaan, Seung Hoon Sung, Christopher M. Neumann, Willy Rachmady, Patrick Morrow, Hui Jae Yoo, Richard E. Schenker, Marko Radosavljevic, Jack T. Kavalieros, Ehren Mannebach
  • Publication number: 20240170291
    Abstract: A method of manufacturing a pre-mold substrate includes preparing an electrically conductive substrate, forming a groove on one surface of the substrate, arranging a resin to cover one surface of the substrate and the groove, removing a portion of the resin so that at least a portion of one surface of the substrate protrudes higher than a surface of the resin covering the groove, and forming a circuit pattern on another surface of the substrate.
    Type: Application
    Filed: December 1, 2021
    Publication date: May 23, 2024
    Inventors: Jong Hoe Ku, In Seob Bae, Kwang Jae Yoo
  • Publication number: 20240170614
    Abstract: A light-emitting element comprises a first semiconductor layer, an active layer provided on the first semiconductor layer, a second semiconductor layer provided on the active layer, an electrode layer provided on the second semiconductor layer, and an insulating film around outer peripheral surfaces of the first semiconductor layer, the active layer, the second semiconductor layer, and the electrode layer, wherein the active layer includes a cover layer including a plurality of quantum dots, and the first semiconductor layer, the active layer, the second semiconductor layer, and the electrode layer are sequentially stacked in one direction to form a shape of a rod.
    Type: Application
    Filed: August 31, 2023
    Publication date: May 23, 2024
    Inventors: Mi Hyang SHEEN, Dong Uk KIM, Kwan Jae LEE, Bo Hwa KIM, Dong Youn YOO, Hyeong Su CHOI
  • Publication number: 20240165589
    Abstract: Disclosed herein is a catalyst for an upgrading reaction of biomass pyrolysis oil, a method for preparing the same, and a method for upgrading biomass pyrolysis oil using the same. The catalyst is a composite inorganic oxide, and the composite inorganic oxide includes lanthanum, nickel, titanium, and cerium. When a metal catalyst supported on carbon is used as a catalyst for a first step reaction, by using the catalyst as a catalyst for a second step reaction, the efficiency of the upgrading reaction of bio-oil is increased and a continuous reaction is possible without clogging of a continuous reactor.
    Type: Application
    Filed: December 27, 2022
    Publication date: May 23, 2024
    Inventors: Chunjae YOO, Jeong-Myeong HA, Dong Jin SUH, Jae Wook CHOI, Young Hyun YOON, Kyeongsu KIM, Chang Soo KIM, Kwang Ho KIM, Thi Lien DO, Jong Hyun LEE, Jin A EUN
  • Patent number: 11991926
    Abstract: Disclosed is an organic electroluminescent device including a first electrode, one or more organic material layers, and a second electrode, wherein the organic material layer includes a light emitting layer, wherein one or more layers of the organic material layer contain a compound represented by Chemical Formula 1, wherein the light emitting layer contains a compound represented by Chemical Formula 2. The organic electroluminescent device has lowered drive voltage, and improved efficiency and lifespan characteristics.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: May 21, 2024
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Inbum Song, Seunghee Yoon, Sunghoon Kim, Seong-Min Park, Tae Wan Lee, Jae Ho Jeong, Jiwoong Yoo
  • Publication number: 20240162194
    Abstract: Disclosed are semiconductor packages and/or methods of fabricating the same. The semiconductor package comprises a package substrate, a first semiconductor chip mounted on the package substrate, a second semiconductor chip mounted on a top surface of the first semiconductor chip, and a first under-fill layer that fills a space between the package substrate and the first semiconductor chip. The package substrate includes a cavity in the package substrate, and a first vent hole that extends from a top surface of the package substrate and is in fluid communication with the cavity. The first under-fill layer extends along the first vent hole to fill the cavity.
    Type: Application
    Filed: January 24, 2024
    Publication date: May 16, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jaekyung YOO, Jayeon LEE, Jae-eun LEE, Yeongkwon KO, Jin-woo PARK, Teak Hoon LEE
  • Publication number: 20240162141
    Abstract: Embodiments disclosed herein include electronic systems with vias that include a horizontal and vertical portion in order to provide interconnects to stacked components, and methods of forming such systems. In an embodiment, an electronic system comprises a board, a package substrate electrically coupled to the board, and a die electrically coupled to the package substrate. In an embodiment the die comprises a stack of components, and a via adjacent to the stack of components, wherein the via comprises a vertical portion and a horizontal portion.
    Type: Application
    Filed: January 22, 2024
    Publication date: May 16, 2024
    Inventors: Ehren MANNEBACH, Aaron LILAK, Hui Jae YOO, Patrick MORROW, Anh PHAN, Willy RACHMADY, Cheng-Ying HUANG, Gilbert DEWEY, Rishabh MEHANDRU
  • Publication number: 20240154058
    Abstract: A light emitting device and a light emitting apparatus including the same are disclosed. The light emitting apparatus includes a light emitting device and a circuit substrate on which the light emitting device is mounted. The light emitting device includes a first conductivity type semiconductor layer, an active layer disposed on the first conductivity type semiconductor layer, and a second conductivity type semiconductor layer disposed on the active layer, wherein the active layer includes a plurality of sub-active layers having different energy bandgaps.
    Type: Application
    Filed: October 6, 2023
    Publication date: May 9, 2024
    Inventor: Hong Jae YOO
  • Patent number: 11978548
    Abstract: The present disclosure relates to a medical image analysis method using a processor and a memory which are hardware. The method includes generating predicted second metadata for a medical image by using a prediction model, and determining a processing method of the medical image based on one of first metadata stored corresponding to the medical image and the second metadata.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: May 7, 2024
    Assignee: LUNIT INC.
    Inventors: Jong Chan Park, Dong Geun Yoo, Ki Hyun You, Hyeon Seob Nam, Hyun Jae Lee, Sang Hyup Lee
  • Patent number: 11980095
    Abstract: A heat converter according to one embodiment of the present invention comprises: a plurality of unit modules respectively arranged in a first direction and a second direction that intersects the first direction; and a frame, which supports the plurality of unit modules, allows cooling water to flow in through one surface arranged in the first direction, and allows the cooling water to be discharged through the other surface arranged in the first direction, wherein each unit module includes: a cooling water passage chamber having first and second surfaces arranged to be spaced in the first direction, third and fourth surfaces arranged to be spaced in a third direction that intersects the first direction and the second direction, a fifth surface arranged to be spaced in the second direction such that cooing water flows therein, and a sixth surface from which cooling water is discharged; a first thermoelectric module arranged on the first surface; and a second thermoelectric module arranged on the second surface
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: May 7, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Seong Jae Jeon, Un Hak Lee, Jong Hyun Kang, Young Sam Yoo, Tae Woong Kim
  • Publication number: 20240145557
    Abstract: A device is disclosed. The device includes a first epitaxial region, a second epitaxial region, a first gate region between the first epitaxial region and a second epitaxial region, a first dielectric structure underneath the first epitaxial region, a second dielectric structure underneath the second epitaxial region, a third epitaxial region underneath the first epitaxial region, a fourth epitaxial region underneath the second epitaxial region, and a second gate region between the third epitaxial region and a fourth epitaxial region and below the first gate region. The device also includes, a conductor via extending from the first epitaxial region, through the first dielectric structure and the third epitaxial region, the conductor via narrower at an end of the conductor via that contacts the first epitaxial region than at an opposite end.
    Type: Application
    Filed: January 9, 2024
    Publication date: May 2, 2024
    Inventors: Ehren MANNEBACH, Aaron LILAK, Hui Jae YOO, Patrick MORROW, Anh PHAN, Willy RACHMADY, Cheng-Ying HUANG, Gilbert DEWEY
  • Publication number: 20240138565
    Abstract: A shoe management apparatus including a cabinet including an inner space for storing shoes, an exhaust port disposed at a rear surface of the inner space and discharging air into the inner space, and a front discharge port disposed at an upper surface of the cabinet and discharging air from the inner space to outside of the shoe management apparatus.
    Type: Application
    Filed: January 5, 2024
    Publication date: May 2, 2024
    Applicant: LG ELECTRONICS INC.
    Inventors: Hyunsun YOO, Jeong Guen CHOI, Joohyeon OH, Jae Myung LIM, Byoungjoon HAN, Sang Yoon LEE, Hyunju KIM, Jeaseok SEONG
  • Publication number: 20240136067
    Abstract: A method for monitoring an object is provided. The method includes the steps of: in response to information on a behavior of a domestic animal being estimated from sensor data measured by a sensor for the domestic animal using a machine learning-based behavior recognition model, estimating health status of the domestic animal with reference to the information on the behavior of the domestic animal and a health criterion for the domestic animal; and determining first breeding information on the domestic animal to be provided to a user on the basis of the health status.
    Type: Application
    Filed: August 22, 2021
    Publication date: April 25, 2024
    Applicant: Bodit Inc.
    Inventors: Kwang Jae Choo, Min Yong Shin, Heung Jong Yoo, Yoon Chul Choi, Seongjin Kim, Nayeon Kim
  • Publication number: 20240132782
    Abstract: A waste wood sleeper pyrolysis apparatus of a hybrid heating type includes a plurality of reactor containers arranged side by side, each having a space in which a waste wood sleeper is placed, a movement rail arranged parallel to an end of one side and an end of the other side of each of the plurality of reactor containers, and a microwave applicator coupled to the movement rail and including a plurality of microwave generators that move to upper portions of the plurality of reactor containers to transmit microwaves into the plurality of reactor containers.
    Type: Application
    Filed: October 15, 2023
    Publication date: April 25, 2024
    Inventors: Tae Hoon KOH, Myung SAGONG, Jae Young LEE, Dong Geun LEE, Hanju YOO
  • Publication number: 20240125996
    Abstract: A method for replicating a holographic optical element and a holographic optical element replicated thereby are provided. The holographic optical element is larger than a master. The master has a holographic grating pattern generated on the master by interference of the reflected, diffracted or transmitted beam generated by irradiating the master having a specific diffraction grating pattern formed thereon with a laser beam.
    Type: Application
    Filed: August 25, 2021
    Publication date: April 18, 2024
    Applicant: LG Chem, Ltd.
    Inventors: Bo Ra Jung, Joon Young Lee, Min Soo Song, Do Kyeong Kwon, Yeon Jae Yoo
  • Patent number: 11955560
    Abstract: A thin film transistor (TFT) structure includes a gate electrode, a gate dielectric layer on the gate electrode, a channel layer including a semiconductor material with a first polarity on the gate dielectric layer. The TFT structure also includes a multi-layer material stack on the channel layer, opposite the gate dielectric layer, an interlayer dielectric (ILD) material over the multi-layer material stack and beyond a sidewall of the channel layer. The TFT structure further includes source and drain contacts through the interlayer dielectric material, and in contact with the channel layer, where the multi-layer material stack includes a barrier layer including oxygen and a metal in contact with the channel layer, where the barrier layer has a second polarity. A sealant layer is in contact with the barrier layer, where the sealant layer and the ILD have a different composition.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Abhishek A. Sharma, Arnab Sen Gupta, Travis W. LaJoie, Sarah Atanasov, Chieh-Jen Ku, Bernhard Sell, Noriyuki Sato, Van Le, Matthew Metz, Hui Jae Yoo, Pei-Hua Wang
  • Publication number: 20240112952
    Abstract: A dielectric layer and a method of forming thereof. An opening defined in a dielectric layer and a wire deposited within the opening, wherein the wire includes a core material surrounded by a jacket material, wherein the jacket material exhibits a first resistivity ?1 and the core material exhibits a second resistivity ?2 and ?2 is less than ?1.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 4, 2024
    Inventors: Hui Jae YOO, Tejaswi K. INDUKURI, Ramanan V. CHEBIAM, James S. CLARKE
  • Patent number: 11944958
    Abstract: Disclosed herein are a catalyst for hydrocracking reaction of high molecular weight components in bio-oil, a method for preparing the same and a method for bio-oil upgrading using the same. The catalyst includes a zeolite carrier; and at least one metal selected from the group consisting of nickel (Ni), ruthenium (Ru) and cerium (Ce) supported on the carrier. The catalyst promotes the hydrocracking of high molecular weight compounds contained in the bio-oil, but also inhibits the polymerization reaction of the decomposed product, thereby more effectively enhancing the hydrocracking reaction of the bio-oil.
    Type: Grant
    Filed: July 18, 2022
    Date of Patent: April 2, 2024
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Chunjae Yoo, Jeong-Myeong Ha, Dong Jin Suh, Jae Wook Choi, Young Hyun Yoon, Kyeongsu Kim, Chang Soo Kim, Kwang Ho Kim, Thi Lien Do
  • Patent number: 11942416
    Abstract: Embodiments disclosed herein include electronic systems with vias that include a horizontal and vertical portion in order to provide interconnects to stacked components, and methods of forming such systems. In an embodiment, an electronic system comprises a board, a package substrate electrically coupled to the board, and a die electrically coupled to the package substrate. In an embodiment the die comprises a stack of components, and a via adjacent to the stack of components, wherein the via comprises a vertical portion and a horizontal portion.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Ehren Mannebach, Aaron Lilak, Hui Jae Yoo, Patrick Morrow, Anh Phan, Willy Rachmady, Cheng-Ying Huang, Gilbert Dewey, Rishabh Mehandru