Abstract: By performing x-ray analysis of stacked metallization layers on the basis of data reduction, the crystalline structure of individual metallization layers may be determined. Consequently, a relationship between electromigration and crystallinity, as well as a correlation between process parameters and materials and the finally obtained crystalline structures of metal lines, may be estimated in a highly efficient manner compared to measurement techniques based on charged particles.

Abstract: According to an illustrative embodiment disclosed herein, a semiconductor structure comprising a first crystalline substrate and a second crystalline substrate is provided. The semiconductor structure is irradiated with a radiation. Both the first crystalline substrate and the second crystalline substrate are exposed to the radiation. At least one diffraction pattern of a crystal lattice of the first crystalline substrate and a crystal lattice of the second crystalline substrate is measured. A relative orientation of the crystal lattice of the first crystalline substrate and the crystal lattice of the second crystalline substrate is determined from the at least one diffraction pattern.

Abstract: According to an illustrative embodiment disclosed herein, a semiconductor structure comprising a first crystalline substrate and a second crystalline substrate is provided. The semiconductor structure is irradiated with a radiation. Both the first crystalline substrate and the second crystalline substrate are exposed to the radiation. At least one diffraction pattern of a crystal lattice of the first crystalline substrate and a crystal lattice of the second crystalline substrate is measured. A relative orientation of the crystal lattice of the first crystalline substrate and the crystal lattice of the second crystalline substrate is determined from the at least one diffraction pattern.

Abstract: By performing x-ray analysis of stacked metallization layers on the basis of data reduction, the crystalline structure of individual metallization layers may be determined. Consequently, a relationship between electromigration and crystallinity, as well as a correlation between process parameters and materials and the finally obtained crystalline structures of metal lines, may be estimated in a highly efficient manner compared to measurement techniques based on charged particles.