Abstract: Provided is a method for manufacturing a synthetic gemstone from a body tissue of a person or an animal, the method including: extracting a biomaterial from the body tissue; manufacturing a raw material mixture by mixing the biomaterial with a gemstone material; and melting the raw material mixture to form a synthetic gemstone on a crystal seed.

Abstract: A biological material manufacturing device according to an embodiment of the inventive concept includes a main body and a head unit that is rotatable on the main body. The main body includes a main groove and a first container groove connected to the main groove. The head unit includes a pillar provided in the main groove and a protruding part that protrudes from the pillar.

Abstract: An integrated circuit packaging system and method of manufacture thereof includes: a substrate with internal circuitry between a substrate top side, a substrate bottom side, and vertical sides; an integrated circuit coupled to the internal circuitry; a molded package body formed directly on the integrated circuit and the substrate top side of the substrate; and a conductive conformal shield structure applied directly on the molded package body, the vertical sides, and to extend below the substrate bottom side coupled to the internal circuitry.

Abstract: An integrated circuit packaging system and method of manufacture thereof includes: a substrate with internal circuitry between a substrate top side, a substrate bottom side, and vertical sides; an integrated circuit coupled to the internal circuitry; a molded package body formed directly on the integrated circuit and the substrate top side of the substrate; and a conductive conformal shield structure applied directly on the molded package body, the vertical sides, and to extend below the substrate bottom side coupled to the internal circuitry.

Abstract: Provided is a method for manufacturing a synthetic gemstone, which manufactures a synthetic gemstone from a body tissue separated from a person or an animal, the method including: extracting a biological material from the body tissue; preparing a mixed material by mixing the biological material with a gemstone material; and growing a synthetic gemstone on a crystal seed as a single crystal by melting the mixed material.

Abstract: Provided is a method for manufacturing a synthetic gemstone from a body tissue of a person or an animal, the method including: extracting a biomaterial from the body tissue; manufacturing a raw material mixture by mixing the biomaterial with a gemstone material; and melting the raw material mixture to form a synthetic gemstone on a crystal seed.

Abstract: A biological material manufacturing device according to an embodiment of the inventive concept includes a main body and a head unit that is rotatable on the main body. The main body includes a main groove and a first container groove connected to the main groove. The head unit includes a pillar provided in the main groove and a protruding part that protrudes from the pillar.

Abstract: Provided is a method for manufacturing a synthetic gemstone, which manufactures a synthetic gemstone from a body tissue separated from a person or an animal, the method including: extracting a biological material from the body tissue; preparing a mixed material by mixing the biological material with a gemstone material; and growing a synthetic gemstone on a crystal seed as a single crystal by melting the mixed material.

Abstract: An integrated circuit packaging system and method of manufacture thereof includes: a substrate with internal circuitry between a substrate top side, a substrate bottom side, and vertical sides; an integrated circuit coupled to the internal circuitry; a molded package body formed directly on the integrated circuit and the substrate top side of the substrate; and a conductive conformal shield structure applied directly on the molded package body, the vertical sides, and to extend below the substrate bottom side coupled to the internal circuitry.

Abstract: An integrated circuit packaging system and method of manufacture thereof includes: a substrate with internal circuitry between a substrate top side, a substrate bottom side, and vertical sides; an integrated circuit coupled to the internal circuitry; a molded package body formed directly on the integrated circuit and the substrate top side of the substrate; and a conductive conformal shield structure applied directly on the molded package body, the vertical sides, and to extend below the substrate bottom side coupled to the internal circuitry.

Abstract: A method of manufacture of an integrated packaging system includes: providing a substrate; mounting an integrated circuit on the substrate; mounting an interposer substrate having an interposer pad on the integrated circuit; covering an encapsulant over the integrated circuit and the interposer substrate; forming a hole through the encapsulant aligned over the interposer pad; and placing a conductive connector on and in direct contact with the interposer pad.

Abstract: An integrated circuit packaging system and method of manufacture thereof includes: a substrate with internal circuitry between a substrate top side, a substrate bottom side, and vertical sides; an integrated circuit coupled to the internal circuitry; a molded package body formed directly on the integrated circuit and the substrate top side of the substrate; and a conductive conformal shield structure applied directly on the molded package body, the vertical sides, and to extend below the substrate bottom side coupled to the internal circuitry.

Abstract: Semiconductor packages with multiple substrates can incorporate cavities in a portion of an upper substrate to minimize or reduce void formations during a molding process. The cavities can be formed substantially over the integrated circuit devices and not over the internal interconnects to further facilitate the flow of the molding compound. The combination with extension members or recesses on a top or exterior surface of the upper substrate can further cut down on bleeding or spill over of the molding compound between adjacent packages and improve device reliability and yield.

Abstract: A method of manufacture of an integrated circuit packaging system including: providing a package carrier; mounting an integrated circuit to the package carrier; mounting a circuit interposer above the integrated circuit; mounting a mounting integrated circuit above the circuit interposer; forming a conductive pillar to the circuit interposer adjacent to the mounting integrated circuit; connecting the circuit interposer to the package carrier; and forming an encapsulation on the package carrier.

Abstract: An integrated circuit packaging system and method of manufacture thereof includes: a substrate with internal circuitry between a substrate top side, a substrate bottom side, and vertical sides; an integrated circuit coupled to the internal circuitry; a molded package body formed directly on the integrated circuit and the substrate top side of the substrate; and a conductive conformal shield structure applied directly on the molded package body, the vertical sides, and to extend below the substrate bottom side coupled to the internal circuitry.

Abstract: A method of manufacture of an integrated packaging system includes: providing a substrate; mounting an integrated circuit on the substrate; mounting an interposer substrate having an interposer pad on the integrated circuit; covering an encapsulant over the integrated circuit and the interposer substrate; forming a hole through the encapsulant aligned over the interposer pad; and placing a conductive connector on and in direct contact with the interposer pad.

Abstract: An integrated circuit packaging system includes: providing a base substrate; applying a molded under-fill on the base substrate; forming a substrate contact extender through the molded under-fill and in direct contact with the base substrate; mounting a stack device over the molded under-fill; attaching a coupling connector from the substrate contact extender to the stack device; and forming a base encapsulation on the stack device, the substrate contact extender, and encapsulating the coupling connector.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching a connection post to the substrate, the connection post having a post top and a post side; mounting an integrated circuit die on the substrate, the integrated circuit die having a top die surface; and forming a package body on the substrate, the connection post, and the integrated circuit die.

Abstract: A system and method for manufacturing an integrated circuit packaging system includes: forming a base substrate including: providing a sacrificial carrier: mounting a metallic sheet on the sacrificial carrier, applying a top trace to the metallic sheet, forming a conductive stud on the top trace, forming a base encapsulation over the metallic sheet, the top trace, and the conductive stud, the top trace exposed from a top surface of the base encapsulation, and removing the sacrificial carrier and the metallic sheet; mounting an integrated circuit device on the base substrate; and encapsulating the integrated circuit device and the base substrate with a top encapsulation.

Abstract: A system and method for manufacturing an integrated circuit packaging system includes: forming a base substrate including: providing a sacrificial carrier: mounting a metallic sheet on the sacrificial carrier, applying a top trace to the metallic sheet, forming a conductive stud on the top trace, forming a base encapsulation over the metallic sheet, the top trace, and the conductive stud, the top trace exposed from a top surface of the base encapsulation, and removing the sacrificial carrier and the metallic sheet; mounting an integrated circuit device on the base substrate; and encapsulating the integrated circuit device and the base substrate with a top encapsulation.