Patents by Inventor Insik Kim

Insik Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8939784
    Abstract: A semiconductor chip package test socket may include a socket housing; a plurality of probe needles in the socket housing; a conductive pad on the probe needles; a floating guide configured to cover an edge of the conductive pad and configured to provide a semiconductor chip package on the conductive pad; and/or clamps fixed at the socket housing. The clamps may combine the floating guide with the socket housing.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: January 27, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sangki Lee, Insik Kim, Teaseog Um, Suklae Kim, Yoonoh Han
  • Publication number: 20130260592
    Abstract: A semiconductor chip package test socket may include a socket housing; a plurality of probe needles in the socket housing; a conductive pad on the probe needles; a floating guide configured to cover an edge of the conductive pad and configured to provide a semiconductor chip package on the conductive pad; and/or clamps fixed at the socket housing. The clamps may combine the floating guide with the socket housing.
    Type: Application
    Filed: March 14, 2013
    Publication date: October 3, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sangki LEE, Insik KIM, Teaseog UM, Suklae KIM, Yoonoh HAN
  • Publication number: 20040187904
    Abstract: A thermal detection device having hot and cold regions, first and second thermocouples disposed across the hot and cold regions each with terminals at the cold region, a thermal absorber disposed at the hot region and in thermal communication with the first and second thermocouples, and a base header having a support surface and a non-support surface. A portion of the support surface opposes a portion of the cold region, and a portion of the non-support surface opposes a portion of the hot region. The second thermocouple has a polarity opposite to the polarity of the first thermocouple.
    Type: Application
    Filed: January 29, 2004
    Publication date: September 30, 2004
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Theodore J. Krellner, Insik Kim, Hunnam Lim, Kyurull Jang
  • Patent number: 6677654
    Abstract: Thermopile detector and method for fabricating the same, the method including the steps of (1) forming a diaphragm film on a substrate, (2) forming thermocouples in a given region on the diaphragm film, (3) forming a protection film on the thermocouples, (4) forming photoresist on the protection film and removing the photoresist from a given region, (5) forming a black body on an entire surface including the photoresist and removing remained photoresist and the black body on the photoresist, and (6) removing a portion of the substrate from a given region of a back-side of the substrate, to expose the diaphragm film, thereby facilitating a compatibility of fabrication process with an existing semiconductor fabrication process (a CMOS fabrication process), whereby improving a mass production capability, preventing a damage to the diaphragm film occurred in formation of the black body, and controlling a property of the black body uniform.
    Type: Grant
    Filed: September 5, 2001
    Date of Patent: January 13, 2004
    Assignee: LG Electronics Inc.
    Inventors: Insik Kim, Taeyoon Kim
  • Publication number: 20020006683
    Abstract: Thermopile detector and method for fabricating the same, the method including the steps of (1) forming a diaphragm film on a substrate, (2) forming thermocouples in a given region on the diaphragm film, (3) forming a protection film on the thermocouples, (4) forming photoresist on the protection film and removing the photoresist from a given region, (5) forming a black body on an entire surface including the photoresist and removing remained photoresist and the black body on the photoresist, and (6) removing a portion of the substrate from a given region of a back-side of the substrate, to expose the diaphragm film, thereby facilitating a compatibility of fabrication process with an existing semiconductor fabrication process(a CMOS fabrication process), whereby improving a mass production capability, preventing a damage to the diaphragm film occurred in formation of the black body, and controlling a property of the black body uniform.
    Type: Application
    Filed: September 5, 2001
    Publication date: January 17, 2002
    Applicant: LG Electronics Inc.
    Inventors: Insik Kim, Taeyoon Kim
  • Patent number: 6305840
    Abstract: Thermopile detector and method for fabricating the same, the method including the steps of (1) forming a diaphragm film on a substrate, (2) forming thermocouples in a given region on the diaphragm film, (3) forming a protection film on the thermocouples, (4) forming a photoresist on the protection film and removing the photoresist from a given region, (5) forming a black body on an entire surface including the photoresist and removing the remaining photoresist and the black body on the photoresist, and (6) removing a portion of the substrate from a given region of a back-side of the substrate, to expose the diaphragm film, thereby facilitating a compatibility of fabrication process with an existing semiconductor fabrication process#(a CMOS fabrication process), whereby improving a mass production capability, preventing a damage to the diaphragm film occurred in formation of the black body, and controlling a property of the black body uniform.
    Type: Grant
    Filed: February 10, 1999
    Date of Patent: October 23, 2001
    Assignee: LG Electronics Inc.
    Inventors: Insik Kim, Taeyoon Kim