Abstract: An electronic device including a memory device with improved reliability is provided. The semiconductor device comprises a data pin configured to transmit a data signal, a command/address pin configured to transmit a command and an address, a command/address receiver connected to the command/address pin, and a computing unit connected to the command/address receiver, wherein the command/address receiver receives a first command and a first address from the outside through the command/address pin and generates a first instruction on the basis of the first command and the first address, and the computing unit receives the first instruction and performs computation based on the first instruction.

Abstract: A semiconductor device including a memory device which has improved reliability is provided. The semiconductor device comprises at least one data pin configured to transfer a data signal, at least one command address pin configured to transfer a command and an address, at least one serial pin configured to transfer a serial data signal, and processing circuitry connected to the at least one data pin and the at least one serial pin. The processing circuitry is configured to receive the data signal from outside through the at least one data pin, and the processing circuitry is configured to output the serial data signal through the at least one serial pin in response to the received data signal.

Abstract: A memory module includes a memory device configured to receive a first refresh command from a host, and perform a refresh operation in response to the first refresh command during a refresh time, and a computing unit configured to detect the first refresh command provided from the host to the memory device, and write a first error pattern at a first address of the memory device during the refresh time.

Abstract: A semiconductor device including a memory device which has improved reliability is provided. The semiconductor device comprises at least one data pin configured to transfer a data signal, at least one command address pin configured to transfer a command and an address, at least one serial pin configured to transfer a serial data signal, and processing circuitry connected to the at least one data pin and the at least one serial pin. The processing circuitry is configured to receive the data signal from outside through the at least one data pin, and the processing circuitry is configured to output the serial data signal through the at least one serial pin in response to the received data signal.

Abstract: An electronic device including a memory device with improved reliability is provided. The semiconductor device comprises a data pin configured to transmit a data signal, a command/address pin configured to transmit a command and an address, a command/address receiver connected to the command/address pin, and a computing unit connected to the command/address receiver, wherein the command/address receiver receives a first command and a first address from the outside through the command/address pin and generates a first instruction on the basis of the first command and the first address, and the computing unit receives the first instruction and performs computation based on the first instruction.

Abstract: A memory module includes a memory device configured to receive a first refresh command from a host, and perform a refresh operation in response to the first refresh command during a refresh time, and a computing unit configured to detect the first refresh command provided from the host to the memory device, and write a first error pattern at a first address of the memory device during the refresh time.

Abstract: A memory system may comprise a plurality of data strobe transfer paths assigned to a plurality of data transfer paths such that each of the plurality of data strobe transfer paths may be shared by the plurality of data transfer paths. At least one selected data strobe transfer path is selected and data signals transferred through the plurality of data transfer paths are sampled using at least one data strobe signal transferred through the selected data strobe transfer path. Reliability of data communication is enhanced through a redundant data strobe scheme by assigning a plurality of data strobe transfer paths to a plurality of data transfer paths such that the plurality of data strobe transfer paths may be shared by the plurality of data transfer paths.

Abstract: A memory system configured to support internal data (DQ) termination of a data buffer is provided. The memory system includes a first memory module, which is a target memory module accessed by an external device, and a second memory module, which is a non-target memory module not accessed by the external device. The second memory module performs the internal DQ termination on an internal data path during an internal operation mode in which data communication is performed by using the internal data path between internal memory chips. Signal reflection over the internal data path is reduced or prohibited due to the internal DQ termination, and thus, signal integrity is improved.

Abstract: A data storage system includes: a storage device having a first storage and a physically separate second storage. A first core includes first data information related to first data to be written to the first storage, and a second core includes second data information related to second data to be written to the second storage. A shared memory is accessible by the first and second cores, and an emergency power system supplies backup power to the first and second cores when external power supplied to the data storage system is less than a minimum threshold operating power. When a write operation error of the second core is detected in a first mode, the first core writes the second data information to the first storage as third data information and writes the second data to the first storage as third data by referring to the second data information.

Abstract: A memory system configured to support internal data (DQ) termination of a data buffer is provided. The memory system includes a first memory module, which is a target memory module accessed by an external device, and a second memory module, which is a non-target memory module not accessed by the external device. The second memory module performs the internal DQ termination on an internal data path during an internal operation mode in which data communication is performed by using the internal data path between internal memory chips. Signal reflection over the internal data path is reduced or prohibited due to the internal DQ termination, and thus, signal integrity is improved.

Abstract: A data storage system includes: a storage device having a first storage and a physically separate second storage. A first core includes first data information related to first data to be written to the first storage, and a second core includes second data information related to second data to be written to the second storage. A shared memory is accessible by the first and second cores, and an emergency power system supplies backup power to the first and second cores when external power supplied to the data storage system is less than a minimum threshold operating power. When a write operation error of the second core is detected in a first mode, the first core writes the second data information to the first storage as third data information and writes the second data to the first storage as third data by referring to the second data information.

Abstract: A memory system configured to support internal data (DQ) termination of a data buffer is provided. The memory system includes a first memory module, which is a target memory module accessed by an external device, and a second memory module, which is a non-target memory module not accessed by the external device. The second memory module performs the internal DQ termination on an internal data path during an internal operation mode in which data communication is performed by using the internal data path between internal memory chips. Signal reflection over the internal data path is reduced or prohibited due to the internal DQ termination, and thus, signal integrity is improved.

Abstract: A memory system may comprise a plurality of data strobe transfer paths assigned to a plurality of data transfer paths such that each of the plurality of data strobe transfer paths may be shared by the plurality of data transfer paths. At least one selected data strobe transfer path is selected and data signals transferred through the plurality of data transfer paths are sampled using at least one data strobe signal transferred through the selected data strobe transfer path. Reliability of data communication is enhanced through a redundant data strobe scheme by assigning a plurality of data strobe transfer paths to a plurality of data transfer paths such that the plurality of data strobe transfer paths may be shared by the plurality of data transfer paths.

Abstract: In a method of operating a memory device, a first write command, a first write address, and first write data are received by a first memory device through a channel. The first write command, received by the first memory device, is sensed by a controller. The controller is connected to the channel and controls a second memory device. The first memory device and the second memory device are different types of memory devices. When the first write command is sensed by the controller, a first write log is generated using the first write address and the first write data. The first write log is stored into a buffer.

Abstract: In a method of operating a memory device, a first write command, a first write address, and first write data are received by a first memory device through a channel. The first write command, received by the first memory device, is sensed by a controller. The controller is connected to the channel and controls a second memory device. The first memory device and the second memory device are different types of memory devices. When the first write command is sensed by the controller, a first write log is generated using the first write address and the first write data. The first write log is stored into a buffer.

Abstract: A semiconductor memory device includes a first memory block of a first type of memory; and a second memory block of a second type of memory having a different type from the first type. A first address region of the first memory block and a second address region of the second memory block are included in the same address domain. Each of the first and second memory blocks is accessed by an address signal including an address of the address domain, and the second memory block is a nonvolatile memory.

Abstract: A device includes a memory controller, a memory bus coupled to the memory controller, an internal memory and an external memory connection unit. The internal memory may be directly connected to the memory controller through the memory bus. The external memory connection unit may connect an external memory directly to the memory controller through a portion of signal lines in the memory bus, and may generate a flag signal indicating whether the external memory is connected to the external memory connection unit.

Abstract: A semiconductor memory device includes an internal address generating circuit; an internal command generating circuit; and a memory cell array including one or more memory bank groups. The semiconductor memory device is configured such that when a read command or a write command is input, if a first portion of a plurality of memory banks of a first memory bank group from among one or more memory bank groups of the memory cell array performs a read operation or a write operation, a second portion of the plurality of memory banks of the first memory bank group performs a refresh operation.

Abstract: A semiconductor memory device includes a first memory block of a first type of memory; and a second memory block of a second type of memory having a different type from the first type. A first address region of the first memory block and a second address region of the second memory block are included in the same address domain. Each of the first and second memory blocks is accessed by an address signal including an address of the address domain, and the second memory block is a nonvolatile memory.

Abstract: A semiconductor memory device includes an internal address generating circuit; an internal command generating circuit; and a memory cell array including one or more memory bank groups. The semiconductor memory device is configured such that when a read command or a write command is input, if a first portion of a plurality of memory banks of a first memory bank group from among one or more memory bank groups of the memory cell array performs a read operation or a write operation, a second portion of the plurality of memory banks of the first memory bank group performs a refresh operation.