Patents by Inventor Insun AN

Insun AN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME
    Publication number: 20240188218
    Abstract: A circuit board module includes a first substrate, a second substrate provided above the first substrate and including a first inlet, a first interposer provided between the first substrate and the second substrate, the first interposer connecting the first substrate and the second substrate and providing a first space between the first substrate and the second substrate, a sealing member covering the first inlet, and a filler provided between the first substrate and the second substrate, where the sealing member includes an insertion area configured to receive a nozzle that injects the filler to be inserted into the first inlet and at least one of the first substrate, the second substrate and the first interposer includes a first opening configured to introduce air into the first space and a second opening configured to exhaust air from the first space.
    Type: Application
    Filed: February 9, 2024
    Publication date: June 6, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yonglak CHO, Joohan KIM, Juho KIM, Min PARK, Eunsoo PARK, Insun AN, Byungwoo LEE, Sangtae LEE, Haejin LEE