Patents by Inventor INVENTEC CORPORATION

INVENTEC CORPORATION has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140156986
    Abstract: A server comprises a first motherboard module. The first motherboard module comprises a first motherboard, a first CPU, at least one first memory module, a chipset, input/output units, a BIOS unit and a first QPI connector. The first CPU is disposed on the first motherboard. The first memory module electrically couples with the first CPU. The chipset electrically couples with the first CPU. The input/output units electrically couple with the chipset. The BIOS unit electrically couples with the chipset. The first QPI connector electrically couples with the first CPU through a QPI bus. The first QPI connector is connected to a second motherboard module.
    Type: Application
    Filed: February 25, 2013
    Publication date: June 5, 2014
    Applicants: INVENTEC CORPORATION, INVENTEC (PUDONG) TECHNOLOGY CORPORATION
    Inventors: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION