Patents by Inventor Ioannis Dotsikas

Ioannis Dotsikas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for interconnecting semiconductor components with substrates and contact means
    Patent number: 7364999
    Abstract: A semiconductor component includes a substrate having a plurality of compliant contact bumps formed over a surface thereof. A semiconductor chip has a plurality of contact regions formed over a surface thereof. The compliant contact bumps of the substrate are electrically connected with the contact regions of the semiconductor chip and wherein the semiconductor chip is mechanically attached to the substrate. As an example, this connection and attachment can be achieved by soldering the contact bumps to the contact regions.
    Type: Grant
    Filed: February 4, 2005
    Date of Patent: April 29, 2008
    Assignee: Infineon Technologies AG
    Inventor: Ioannis Dotsikas
  • Method and furnace for the vapor phase deposition of components onto semiconductor substrates with a variable main flow direction of the process gas
    Patent number: 7241701
    Abstract: A method and a furnace are provided for the vapor phase deposition of components onto semiconductor substrates. The main flow direction of the process gases can be varied or reversed by the furnace in the course of the method. This prevents temperature and concentration inhomogeneities of the process gas within the furnace, and permits the components to be uniformly deposited onto the semiconductor substrates.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: July 10, 2007
    Assignee: Infineon Technologies AG
    Inventor: Ioannis Dotsikas
  • Method for interconnecting semiconductor components with substrates and contact means
    Publication number: 20060177969
    Abstract: A semiconductor component includes a substrate having a plurality of compliant contact bumps formed over a surface thereof. A semiconductor chip has a plurality of contact regions formed over a surface thereof. The compliant contact bumps of the substrate are electrically connected with the contact regions of the semiconductor chip and wherein the semiconductor chip is mechanically attached to the substrate. As an example, this connection and attachment can be achieved by soldering the contact bumps to the contact regions.
    Type: Application
    Filed: February 4, 2005
    Publication date: August 10, 2006
    Inventor: Ioannis Dotsikas
  • Method and furnace for the vapor phase deposition of components onto semiconductor substrates with a variable main flow direction of the process gas
    Publication number: 20040081754
    Abstract: The invention relates to a method and to a furnace for the vapor phase deposition of components onto semiconductor substrates. The main flow direction of the process gases can be varied or reversed in the course of the method. This prevents temperature and concentration inhomogeneities of the process gas within the furnace, and the components to be uniformly deposited onto the semiconductor substrates.
    Type: Application
    Filed: September 30, 2003
    Publication date: April 29, 2004
    Inventor: Ioannis Dotsikas