Abstract: A method of manufacturing an interconnect packaging structure is provided. In one aspect, the method includes forming a first body defining a cavity around at least one integrated circuit using an additive manufacturing machine, depositing a conductive transmission line on the first body and electrically coupling the conductive transmission line and the at least one integrated circuit with a conductive interconnect.

Abstract: Material mixing for an additive manufacturing apparatus is provided. A further aspect employs multiple material inlets for simultaneously feeding a polymer and/or nanocomposite material in at least a first inlet, and ceramic or other particles in at least a second inlet, to a single additive manufacturing outlet nozzle. In another aspect, a three dimensional printing machine varies a chemical or compounding characteristic, such as a loading percentage, of printing material during printing. In another aspect, in situ mixing of a polymer and/or nanocomposite with variable amounts of ceramic, magnetic or other particles therein in an additive manufacturing apparatus, such as a multi-material aerosol jet printing machine.

Abstract: Material mixing for an additive manufacturing apparatus is provided. A further aspect employs multiple material inlets for simultaneously feeding a polymer and/or nanocomposite material in at least a first inlet, and ceramic or other particles in at least a second inlet, to a single additive manufacturing outlet nozzle. In another aspect, a three dimensional printing machine varies a chemical or compounding characteristic, such as a loading percentage, of printing material during printing. In another aspect, in situ mixing of a polymer and/or nanocomposite with variable amounts of ceramic, magnetic or other particles therein in an additive manufacturing apparatus, such as a multi-material aerosol jet printing machine.

Abstract: A method of manufacturing an interconnect packaging structure is provided. In one aspect, the method includes forming a first body defining a cavity around at least one integrated circuit using an additive manufacturing machine, depositing a conductive transmission line on the first body and electrically coupling the conductive transmission line and the at least one integrated circuit with a conductive interconnect.

Abstract: Multilayer electronic component systems and methods of manufacture are provided. In this regard, an exemplary system comprises a first layer of liquid crystal polymer (LCP), first electronic components supported by the first layer, and a second layer of LCP. The first layer is attached to the second layer by thermal bonds. Additionally, at least a portion of the first electronic components are located between the first layer and the second layer.

Abstract: Packaging systems and methods of manufacture are provided. In this regard, a representative system comprises a first layer of liquid crystal polymer (LCP), a first electronic component supported by the first layer, and a second layer of LCP. The first layer and the second layer encase the first electronic component.

Abstract: A self-similar multiband reconfigurable antenna includes a planar antenna structure formed on a surface of a substrate, the antenna structure including symmetrically opposed self-similar geometry antenna arms defining a self-similar or Sierpinski gasket configuration for each arm of the antenna. MEMS type switches are provided for operatively connecting adjacent antenna patches on each arm of the antenna configuration, and a voltage source is provided for selectively actuating the switches. Selective actuation of the switches enables up to four different antenna configurations each having a different resonant frequency, and wherein each resonant frequency demonstrates a similar radiation pattern.

Abstract: A self-similar multiband reconfigurable antenna includes a planar antenna structure formed on a surface of a substrate, the antenna structure including symmetrically opposed self-similar geometry antenna arms defining a self-similar or Sierpinski gasket configuration for each arm of the antenna. MEMS type switches are provided for operatively connecting adjacent antenna patches on each arm of the antenna configuration, and a voltage source is provided for selectively actuating the switches. Selective actuation of the switches enables up to four different antenna configurations each having a different resonant frequency, and wherein each resonant frequency demonstrates a similar radiation pattern.

Abstract: The present invention includes an apparatus including a thin film resistor. The thin film resistor includes a resistive component, a body, and a reactant. The resistive component includes a nickel-composite material. The body has a predetermined, sturdy shape. The body carries the resistive component. The reactant manipulates the body to enable the resistive component to adhere to the body.

Abstract: A surface micromachined electromagnetically radiating antenna includes a coplanar waveguide on a ground plane coated substrate having a conductor path. The conductor path is coupled to a monopole conductor, which has a generally-cylindrical backbone erected vertically from the substrate and a metal layer deposited on the backbone at a predetermined thickness. The antenna may be fabricated by depositing an epoxy on the ground plane coated substrate to a predetermined depth and according to a pattern. The epoxy is exposed to an ultraviolet source that develops one or more columns according to the pattern. A seed layer of metal may be formed on the developed column. A conductive metal is electrodeposited over the column surface to produce the monopole antenna. Other antenna may be created by adding monopoles and/or conductive metal patches and/or strips that are positioned atop the monopoles and elevated from the substrate.

Abstract: The invention is a tunable RF MEMS switch developed with a BST dielectric at the contact interface. BST has a very high dielectric constant (>300) making it very appealing for RF MEMS capacitive switches. The tunable dielectric constant of BST provides a possibility of making linearly tunable MEMS capacitive switches. The capacitive tunable RF MEMS switch with a BST dielectric is disclosed showing its characterization and properties up to 40 GHz.

Abstract: A surface micromachined electromagnetically radiating antenna includes a coplanar waveguide on a ground plane coated substrate having a conductor path. The conductor path is coupled to a monopole conductor, which has a generally-cylindrical backbone erected vertically from the substrate and a metal layer deposited on the backbone at a predetermined thickness. The antenna may be fabricated by depositing an epoxy on the ground plane coated substrate to a predetermined depth and according to a pattern. The epoxy is exposed to an ultraviolet source that develops one or more columns according to the pattern. A seed layer of metal may be formed on the developed column. A conductive metal is electrodeposited over the column surface to produce the monopole antenna. Other antenna may be created by adding monopoles and/or conductive metal patches and/or strips that are positioned atop the monopoles and elevated from the substrate.

Abstract: A high frequency micromachined filter assembly comprises at least one microresonator having at least one metal-lined resonance chamber and at least two openings. Input means couples an electromagnetic input signal to the resonance chamber through a first one of the openings. The output signal is coupled to output means from the resonance chamber through a second one of the openings. Dielectric material is arranged between the input means and the resonance chamber to maintain the resonator and the input means separated from one another. Dielectric material is arranged between the output means and the resonance chamber to maintain the resonator and the output means separated from one another.