Patents by Inventor Iolanda CUSERI

Iolanda CUSERI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11691177
    Abstract: A transducer assembly operable to transmit ultrasonic energy in a desired direction towards a zone adapted to be acoustically coupled to an object or area of interest is disclosed which has a transducer layer, a backing material disposed behind the transducer layer with respect to the desired direction, and a back-matching layer disposed between the transducer layer and the backing material to reflect towards the transducer layer part of the ultrasonic energy directed from the transducer layer to the backing material. The backing layer has an acoustic impedance higher than the acoustic impedance of the back-matching layer. The back-matching material has an impedance less than the impedance of the transducer layer and the transducer layer has a thickness greater than a ¼ of the wavelength of the ultrasound waves the assembly is configured to generate. A process for manufacturing a transducer assembly is also disclosed.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: July 4, 2023
    Assignee: Esaote S.p.A.
    Inventors: Paolo Palchetti, Andrea Grandoni, Iolanda Cuseri
  • Publication number: 20180290175
    Abstract: A transducer assembly operable to transmit ultrasonic energy in a desired direction towards a zone adapted to be acoustically coupled to an object or area of interest, the assembly comprising: a transducer layer; a backing material disposed behind said transduction material with respect to the desired direction; a back-matching layer disposed between the transducer layer and the backing material to reflect towards said transducer layer part of the ultrasonic energy directed from the transducer layer to the backing material. The backing layer has an acoustic impedance higher than the acoustic impedance of the back-matching layer, the back-matching material has an impedance less that the impedance of the transducer layer and the transducer layer has a thickness greater than a ¼ of the wavelength of the ultrasound waves the assembly is configured to generate. A process for manufacturing a transducer assembly is also disclosed.
    Type: Application
    Filed: March 19, 2018
    Publication date: October 11, 2018
    Inventors: Paolo PALCHETTI, Andrea GRANDONI, Iolanda CUSERI