Abstract: To provide audio solder alloy which is senary solder alloy (Sn.Ag.Cu.In.Ni.Pb) and has their appropriate contained amounts to obtain excellent sound quality and high auditory assessment, as the joining solder for connecting various kinds of electronics parts used for electronic circuit such as a filter circuit NW for audio system. A preferably example of the contained amounts is as follows: Ag of 1.0 through 1.01% by mass, Cu of 0.71 through 0.72% by mass, In of 0.003 through 0.0037% by mass, Ni of 0.016 through 0.017% by mass, Pb of 0.0025 through 0.0035% by mass and the remainder of Sn.