Abstract: Disclosed is an oil-in-water type emulsion composition which has excellent temporal and temperature stability and exerts a good feeling of use; and a method of producing the same. Emulsification is carried out through a specific intermediate phase formed by mixing a surfactant capable of forming an L? phase, a surfactant capable of forming an H1 phase, and water. The intermediate phase preferably has an interfacial tension of 0.01 to 8 mN/m in terms of relative value with respect to polyperfluoromethylisopropyl ether. The oil-in-water type emulsion composition is produced by a production method that includes the step of sequentially adding an oil phase component and an aqueous phase component to the intermediate phase.

Abstract: A manufacturing method of a semiconductor device for mounting an LSI bare-chip component, or a bare chip, on a printed circuit board, or a substrate, with flip-chip bonding technology, comprises a recess forming step of forming recesses on substrate pads of the substrate, an adhesive coating step of applying adhesive to a location on the substrate at which the bare chip is to be placed, a chip mounting step of placing the bare chip on the substrate while aligning the positions of the bumps formed on the chip pads of the bare chip and the substrate pads of the substrate, and an adhesive hardening step of hardening the applied adhesive. Also disclosed is a semiconductor device manufactured with the above-mentioned manufacturing method.

Abstract: A manufacturing method of a semiconductor device for mounting an LSI bare-chip component, or a bare chip, on a printed circuit board, or a substrate, with flip-chip bonding technology, that includes a recess forming step of forming recesses on substrate pads of the substrate, an adhesive coating step of applying adhesive to a location on the substrate at which the bare chip is to be placed, a chip mounting step of placing the bare chip on the substrate while aligning positions of the bumps formed on the chip pads of the bare chip and the substrate pads of the substrate, and an adhesive hardening step of hardening the applied adhesive.