Patents by Inventor Ippei HONMA

Ippei HONMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250065551
    Abstract: An injection molding device includes a fixing section to which a molding die having a fixed molding die and a movable molding die, an injection section that injects a molding material, and a moving section that moves the injection section relative to the fixed molding die. The injection section includes a nozzle and an injection amount adjustment mechanism. The injection molding device further includes a control section configured to control the moving section, the injection amount adjustment mechanism, and a heater. The control section executes the following in a state where the molding die is mounted on the fixing section, a first control in which the nozzle is brought into contact with the fixed molding die and the molding material is injected, and a second control in which the nozzle is separated from the fixed molding die after a predetermined time elapses from the completion of the first control.
    Type: Application
    Filed: August 23, 2024
    Publication date: February 27, 2025
    Inventors: Masayuki TAKAHASHI, Kakeru SASAGAWA, Ippei HONMA
  • Publication number: 20190015044
    Abstract: A portable electronic device includes: a detection unit which detects at least one of biological information and motion information of a subject; a case which accommodates the detection unit; and a strap which fixes the case to the subject. The strap has a first surface which faces the subject when the case is fixed to the subject. The first surface is provided with a plurality of first protrusions, satisfying 0.03 mm?D?1.0 mm and 1<P/D?3, where P/D is a ratio of a pitch P representing a distance between centers of two of the first protrusions and an outer dimension D of each of the first protrusions.
    Type: Application
    Filed: July 2, 2018
    Publication date: January 17, 2019
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Mitsuto YANAGISAWA, Ippei HONMA