Patents by Inventor Ippei Nagaike

Ippei Nagaike has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EMI shield and a method of forming the same
    Patent number: 5945213
    Abstract: Improved shield against electromagnetic interference comprises an undercoat formed on at least one surface of a nonconductive substrate comprising a jacket or case of electronic equipment or part thereof that are vulnerable to electromagnetic interference and a metal layer formed over said undercoat; said undercoat is composed of 10-60 wt % of a composite metal oxide hydrate and 40-90 wt % of a binder and said metal layer is formed by electroless plating of copper and/or nickel.
    Type: Grant
    Filed: August 27, 1996
    Date of Patent: August 31, 1999
    Assignee: Yoshino Denka Kogyo, Inc.
    Inventors: Ippei Nagaike, Ryozo Mizuguchi, Masatomo Yanase
  • Chipping-resistant resin molded article
    Patent number: 5480714
    Abstract: A resin molded article comprising a main body of molded material, an intermediate coating layer comprising scaly pieces of matter and a resin constituent composed of one, or a plurality of layers, and a finish coating layer formed on the outermost surface of the intermediate coating layer. The resin molded article of the present invention provides improved resistance to chipping.
    Type: Grant
    Filed: April 9, 1993
    Date of Patent: January 2, 1996
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Toshiyasu Ito, Yasuhiko Ogisu, Shigeyuki Takahashi, Toshiya Uemura, Minoru Nohata, Ippei Nagaike, Shigeru Noguchi, Kenjiro Arai